Patents Assigned to International Grain & Milling Company
  • Patent number: 5266368
    Abstract: A biodegradable low density packing material, comprising an expanded wheat and starch product having high dimensional stability at high humidity and temperature ambient conditions. The invention also includes a method of preparing a low density biodegradable packaging material having a blended mix of wheat, amylose starch and amylopectin starch with approximately 1% gelatin being added after the initial mixing of the product at temperatures of 300.degree. to 350.degree. F.
    Type: Grant
    Filed: April 16, 1992
    Date of Patent: November 30, 1993
    Assignee: International Grain & Milling Company
    Inventor: Kent R. Miller