Abstract: A method for packaging submount adhering LED comprises providing a first substrate which has an upper surface, a lower surface forming a plurality of heat-dissipating cavities and a plurality of die-attaching regions defined on the upper surface. Each of the heat-dissipating cavities corresponds to the die-attaching region and has a bottom surface, wherein there is a carrier base located between the bottom surface and the die-attaching region. Next, a heat conductor is formed in the heat-dissipating cavity and a plurality of LEDs are disposed on the die-attaching regions of the first substrate. Then, a second substrate is provided which has a first surface facing to the upper surface of the first substrate, a second surface opposite to the first surface and a plurality of reflective slots communicating with the first and second surfaces.

Abstract: A thin type camera module includes a fixing board, an imaging-sensing semiconductor assembly, and a lens holder. The image-sensing semiconductor assembly is manufacture by a chip-on-film (COF) packaging method. The image-sensing semiconductor assembly comprises an image sensing chip and a COF wiring film, wherein the image sensing chip is flip-chip mounted on the COF wiring film. A photosensitive surface of the image sensing chip is corresponding to a window of the COF wiring film and disposed toward a light-pervious channel of the lens holder. The lens holder is connected with the fixing board to form an airtight space for sealing the image sensing chip. The COF wiring film has a module circuit for mounting an electrical device.