Patents Assigned to International Superconductivity Center, The Juridical Foundation
  • Patent number: 8188010
    Abstract: A thin film superconductive wire material (16) and an electro conductive tape (15) are immersed in a solder bath (35) containing a solder, which includes Sn(tin) and Bi (bismuth), to bond the thin film superconductive wire material (16) and the electro conductive tape (15) and a composite superconductive wire material (10) is formed.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: May 29, 2012
    Assignees: The Furukawa Electric Co., Ltd., International Superconductivity Center, The Juridical Foundation
    Inventors: Masashi Yagi, Hirao Hirata, Shinichi Mukoyama, Yuh Shiohara