Abstract: A thin film superconductive wire material (16) and an electro conductive tape (15) are immersed in a solder bath (35) containing a solder, which includes Sn(tin) and Bi (bismuth), to bond the thin film superconductive wire material (16) and the electro conductive tape (15) and a composite superconductive wire material (10) is formed.
Type:
Grant
Filed:
February 2, 2009
Date of Patent:
May 29, 2012
Assignees:
The Furukawa Electric Co., Ltd., International Superconductivity Center, The Juridical Foundation