Patents Assigned to International Test Solutions, Inc.
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Patent number: 11035898Abstract: A thermally conductive material, device, and method for predictably maintaining the temperature state and condition of the contact elements and support hardware of a tester interface, such as a probe card, for a testing apparatus, such as automated test equipment (ATE), that has a predetermined configuration applicable for the particular pin contact elements, thermal conditions. The thermally conductive device also has a substrate having a predefined form factor which can be readily introduced into the testing apparatus during normal testing operations. Unlike a patterned substrate that is constrained to specific probe element layouts, the unpatterned surface of the heat conductive device facilitates use with multiple probe card designs within numerous automated test equipment (ATE) tools.Type: GrantFiled: May 11, 2020Date of Patent: June 15, 2021Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, Jerry J. Broz, Wayne C. Smith, Mark M. Stark
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Patent number: 10896828Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: June 8, 2020Date of Patent: January 19, 2021Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10843885Abstract: Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.Type: GrantFiled: February 22, 2019Date of Patent: November 24, 2020Assignee: INTERNATIONAL TEST SOLUTIONS, INC.Inventors: Mark M. Stark, Alan E. Humphrey
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Patent number: 10792713Abstract: A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.Type: GrantFiled: July 2, 2019Date of Patent: October 6, 2020Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, Bret A. Humphrey, Jerry J. Broz, Wayne C. Smith
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Publication number: 20200303217Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: ApplicationFiled: June 8, 2020Publication date: September 24, 2020Applicant: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10741420Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: September 20, 2018Date of Patent: August 11, 2020Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10717618Abstract: Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on movable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and movable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.Type: GrantFiled: February 22, 2019Date of Patent: July 21, 2020Assignee: INTERNATIONAL TEST SOLUTIONS, INC.Inventors: Mark M. Stark, Alan E. Humphrey
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Patent number: 10406568Abstract: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.Type: GrantFiled: March 1, 2019Date of Patent: September 10, 2019Assignee: International Test Solutions, Inc.Inventors: Alan Humphrey, Jerry Broz, James H. Duvall
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Patent number: 10361169Abstract: A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.Type: GrantFiled: October 2, 2017Date of Patent: July 23, 2019Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, Wayne C. Smith, Janakraj Shivlal, Bret A. Humphrey
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Patent number: 10239099Abstract: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.Type: GrantFiled: November 20, 2017Date of Patent: March 26, 2019Assignee: International Test Solutions, Inc.Inventors: Alan Eugene Humphrey, Jerry J. Broz, James H. Duvall
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Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
Patent number: 10195648Abstract: A cleaning material for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, has a cleaning pad layer, one or more intermediate layers having a set of predetermined characteristics and having a plurality of abrasive particles.Type: GrantFiled: July 28, 2014Date of Patent: February 5, 2019Assignee: International Test Solutions, Inc.Inventors: Jerry J. Broz, Bret A. Humphrey, Alan E. Humphrey, James H. Duvall -
Publication number: 20190019694Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: ApplicationFiled: September 20, 2018Publication date: January 17, 2019Applicant: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10109504Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: January 30, 2017Date of Patent: October 23, 2018Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10002776Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: December 21, 2012Date of Patent: June 19, 2018Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 9833818Abstract: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.Type: GrantFiled: August 7, 2013Date of Patent: December 5, 2017Assignee: INTERNATIONAL TEST SOLUTIONS, INC.Inventors: Alan E. Humphrey, Jerry J. Broz, James H. Duvall
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Patent number: 9825000Abstract: A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.Type: GrantFiled: April 24, 2017Date of Patent: November 21, 2017Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, Wayne C. Smith, Janakraj Shivlal, Bret A. Humphrey
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Publication number: 20170136500Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: ApplicationFiled: January 30, 2017Publication date: May 18, 2017Applicant: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 9595456Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: August 20, 2013Date of Patent: March 14, 2017Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Publication number: 20140338698Abstract: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.Type: ApplicationFiled: August 7, 2013Publication date: November 20, 2014Applicant: International Test Solutions, Inc.Inventors: Alan Eugene Humphrey, Jerry J. Broz, James H. Duvall
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Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
Patent number: 8801869Abstract: A cleaning device for cleaning pin contact elements and support hardware in a semiconductor testing apparatus that has a cleaning layer with a predetermined configuration appropriate for the particular pin contact elements and a substrate having a configuration to be introduced into the testing apparatus during the normal testing operating of the testing apparatus. The cleaning layer secured to the substrate has predetermined characteristics that cause the pad to clean debris the pin contact elements and support hardware when the pin contact elements and support hardware contact the pad during the normal operation of the testing machine.Type: GrantFiled: November 4, 2011Date of Patent: August 12, 2014Assignee: International Test Solutions, Inc.Inventors: Jerry J. Broz, Bret A. Humphrey, Alan E. Humphrey, James H. Duvall