Abstract: Methods and devices are provided for fabricating a resistive random-access array having dedicated electroforming contacts. A lower conductive line is formed on an interlayer dielectric layer. A lower electrode is formed on the lower conductive line. An isolation layer is formed having an upper surface which is coplanar with an upper surface of the lower electrode. A stack structure including a metal-oxide layer and upper electrode is formed on the lower electrode. Insulating spacers are formed on sidewalls of the stack structure. The lower electrode, and stack structure form a resistive memory cell, wherein a footprint of the lower electrode is greater than that of the upper electrode. An upper conductive line contacts the upper electrode, and is arranged orthogonal to the lower conductive line. A dedicated electroforming contact contacts an extended portion of the lower electrode which extends past a cross-point of the upper and lower conductive lines.

Abstract: Weight based upselling, including receiving a purchase request for an item from a customer; determining a weight of the item; identifying, in dependence upon the weight of the item, a shipping weight range and a shipping cost for the item, where the shipping weight range includes a maximum shipping weight; calculating a difference between the weight of the item and the maximum shipping weight in the shipping weight range; selecting an upsell item in dependence upon the difference between the weight of the item and the maximum shipping weight in the shipping weight range; and offering the upsell item to the customer, including offering to ship both the item and the upsell item for only the identified shipping cost.