Abstract: A detector assembly (50) is formed by integrating the electronic processing circuits on a CMOS wafer by stitching a plurality of reticles of at least two different types so as to form an integrated circuit having an array of electronic processing circuits each having a respective sensor input disposed toward a first surface of the wafer and accessible from the first surface via a contact formed near an edge of the integrated circuit. Sensor elements (56) are disposed on the first surface of the respective integrated circuits in the detector whereby an exposed surface of the sensor elements forms a common first electrode towards which incident photons are directed, and an opposite unexposed surface thereof forms multiple second electrodes of opposite polarity to the first electrode each in registration with a corresponding sensor input.

Abstract: A sensor array having a plurality of pixels each including a sensor element coupled to a sensor input (24) of an electronic processing circuit is fabricated by first forming an integrated circuit having at least one array of electronic processing circuits (25, 26) each having a respective sensor input (24) disposed with terminal nodes of the integrated circuit toward a first surface of the wafer. In respect of either each pixel or each terminal node, an electrically conductive via (31) is formed through the wafer (20) extending from either the respective sensor input (24) or from the respective terminal node to a second surface (28) of the wafer opposite the first surface. This allows each electrically conductive via (31) exposed at the second surface of the wafer to serve for connection thereto of either a sensor element or a terminal connection that is electrically connected through the electrically conductive via (31) to the respective sensor input or terminal node.

Abstract: A sensor array having a plurality of pixels each including a sensor element coupled to a sensor input (24) of an electronic processing circuit is fabricated by first forming an integrated circuit having at least one array of electronic processing circuits (25, 26) each having a respective sensor input (24) disposed with terminal nodes of the integrated circuit toward a first surface of the wafer. In respect of either each pixel or each terminal node, an electrically conductive via (31) is formed through the wafer (20) extending from either the respective sensor input (24) or from the respective terminal node to a second surface (28) of the wafer opposite the first surface. This allows each electrically conductive via (31) exposed at the second surface of the wafer to serve for connection thereto of either a sensor element or a terminal connection that is electrically connected through the electrically conductive via (31) to the respective sensor input or terminal node.

Abstract: A sewage system comprising a network of sewage sumps that temporarily store sewage produced in a dwelling or other structure, each of said sumps preferably comprising a computer controller for operating a pump in the sump such that the sewage collected in the sump may be pumped out of the sump and into the collection system in a controlled manner to regulate the flow of sewage material in the system. The regulation of the sewage flow permits the efficient operation of a sewage treatment facility that receives sewage from the network of sewage sumps by insulating the facility from the peak burdens that would be placed on it at certain times of day in the absence of a system that regulates sewage flow into the system at the source of the sewage.

Abstract: An integrally molded plastic sump basin formed with two distinct portions including a constant depth, shallow dry well at the top defining a controls area that is isolated from a varying depth wet well below, said wet well defining a pump chamber. All electronic controls, level sensor controls and valve extension control are situated in the non-hazardous dry well while pump(s) and associated piping are contained within the potentially hazardous wet well part of the basin. The sump basin may be formed with a drop inlet opening for sewage entry that enhances installation flexibility and provides more efficient processing of sewage entering the basin.

Abstract: A plastic pipe joint between two dissimilar plastics, one being a non-glueable olefin or rubber and the other a glueable or solvent-weldable plastic. The joint consists of a glueable, plastic ferrule compression fitted over the end of an olefinic or other non-glueable pipe by means of an internally expanded metal insert inside the olefinic pipe. A method for employing the instrumentalities of the invention in a pipe joint is also described.

Abstract: A dental and gum treatment agent and method uses the isolated and purified enzyme species lysozyme as a primary active substance to attack and destroy in situ the cariogenic bacteria in the oral cavity forming the plaque-calculus substrate and causing gum disorders. The agent operates to penetrate the bacterial cell wall and thereby destroy existing bacteria by disintegration so that residues are washed away. Auxiliary isolated enzymes of the groups of lipases, carbohydrases, phospholipases and proteases are used as additives to decrease treatment time as an aid to penetration of cell walls of gram (-) type bacteria. EDTA (ethylene diamino tetraacetic acid) is also used as an additive to remove ionic bonds that could clamp and stabilize bacterial walls to some extent after the lysozyme action. Thus, an aqueous solution of about 0.