Abstract: A cold-chamber die-casting apparatus and method for making a die-cast part with an open space within the geometry of the part. The apparatus includes an injection shaft which receives molten material for casting the part. The molten material is pushed with a plunger through a gate and into a tool cavity corresponding to the part. The gate is disposed at an end of the injection shaft and adjacent the tool cavity at a position that corresponds to the open space of the part and is inside the geometry of the part.

Abstract: There is disclosed for use with a piezoelectric stack, first and second side electrodes, each side electrode having two serpentine shape members positioned in a common plane, where the two serpentine shape members of an electrode have alternately spaced conductive fingers which project outward toward each other. The conductive fingers are adapted to be electrically coupled to the ends of alternate ones of internal electrode layers of the piezoelectric stack. The undersides of the conductive fingers which contact the ends of the internal electrodes are provided with a solder material to provide good electrical contact by applying the soldered finger to the internal electrode and applying heat to reflow the solder. The serpentine shape of the side electrodes here disclosed provides high flexibility which can absorb displacement of the internal electrodes as they move up, down, in and out as the piezoelectric layers of the stack expand and contract.

Abstract: A sliding mechanism includes two members, one of which is slidable with respect to the other along an axis. One of the members slides back and forth with respect to the other between a first position and a second position. A leaf spring is used as a positioning element to hold one of the members in either the first position or the second position. The leaf spring is attached to one of the two members and the other of the two members includes a projection. The leaf spring abuts the projection holding the slidable member in either the first position or the second position. When a user pushes one of the members from one position to another, the projection pushes the leaf spring out of the way until it passes an apex of the leaf spring and is held in the other position.

Abstract: A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.

Abstract: A tin-silver press-fit interconnect which includes a press-fit terminal having a coating or finish of a tin-silver compound for use with a terminal receiving device. The tin-silver compound serves to prevent the formation of tin whiskers which appear most frequently in pure tin coated electrical components under mechanical stress and which make the electronic device susceptible to short circuits. The tin-silver compound may include between 85 and 99.5% weight of tin and between 0.5 and 15% weight of silver and is applied at a thickness range between 0.4 and 5 microns using a technique such as electroplating, hot dip or immersion.

Abstract: A metal processing method includes etching to remove material from a thin metal part. A pattern of etch resistant material is used to prevent etching of the metal in desired locations. The etch resistant material is intentionally applied to unclean surfaces so that an adhesion between the etch resistant material and the metal will fail during the etching process. An edge is formed during etching at the boundaries of the pattern of the etch resistant material. These edges are rounded where the adhesion fails. A shaver foil is produced using the described metal processing method including a face side, a cutter side and a plurality of whisker holes. A face edge is formed where an etched profile of the whisker hole meets the face side and a cutter edge is formed where the etched profile of the whisker hole meets the cutter side. The face edge is rounded using the aforementioned process and the cutter edge is sharp using a conventional etch resistant material application method.

Abstract: A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.

Abstract: In one aspect, a surface mount contact is provided for attachment to a circuit board or the like. The contact includes an elongated electrically conductive pin that has a first end and an opposing second end. A pre-formed heat re-flowable material is attached to one end of the pin and a conductive locator member surrounds the pin at a location between the first and second ends thereof and adjacent the conductive locator member. In one embodiment, the locator member is in the form of a cylindrical collar that extends around the pin.

Abstract: There is disclosed for use with a piezoelectric stack, first and second side electrodes, each side electrode having two serpentine shape members positioned in a common plane, where the two serpentine shape members of an electrode have alternately spaced conductive fingers which project outward toward each other. The conductive fingers are adapted to be electrically coupled to the ends of alternate ones of internal electrode layers of the piezoelectric stack. The undersides of the conductive fingers which contact the ends of the internal electrodes are provided with a solder material to provide good electrical contact by applying the soldered finger to the internal electrode and applying heat to reflow the solder. The serpentine shape of the side electrodes here disclosed provides high flexibility which can absorb displacement of the internal electrodes as they move up, down, in and out as the piezoelectric layers of the stack expand and contract.

Abstract: A cold-chamber die-casting apparatus and method for making a die-cast part with an open space within the geometry of the part. The apparatus includes an injection shaft which receives molten material for casting the part. The molten material is pushed with a plunger through a gate and into a tool cavity corresponding to the part. The gate is disposed at an end of the injection shaft and adjacent the tool cavity at a position that corresponds to the open space of the part and is inside the geometry of the part.

Abstract: A high-density interconnection device or connector (1) that is formed with wafer in a stacked arrangement. The stack of wafers (20) is arranged to include signal wafers (20b) that alternate with shield wafers (20a). A dielectric coating (40) is applied to at least one body surface of one or more of the wafer to prevent electrical bridging between the adjacent signal and shield wafers (20a, 20b), e.g. when conductive debris is lodged between the wafers (20).

Abstract: In one aspect, a surface mount contact is provided for attachment to a circuit board or the like. The contact includes an elongated electrically conductive pin that has a first end and an opposing second end. A pre-formed heat re-flowable material is attached to one end of the pin and a conductive locator member surrounds the pin at a location between the first and second ends thereof and adjacent the conductive locator member. In one embodiment, the locator member is in the form of a cylindrical collar that extends around the pin.

Abstract: In one aspect, a surface mount contact is provided for attachment to a circuit board or the like. The contact includes an elongated electrically conductive pin that has a first end and an opposing second end. A pre-formed heat re-flowable material is attached to one end of the pin and a conductive locator member surrounds the pin at a location between the first and second ends thereof and adjacent the conductive locator member. In one embodiment, the locator member is in the form of a cylindrical collar that extends around the pin.

Abstract: A sliding mechanism includes two members, one of which is slidable with respect to the other along an axis. One of the members slides back and forth with respect to the other between a first position and a second position. A leaf spring is used as a positioning element to hold one of the members in either the first position or the second position. The leaf spring is attached to one of the two members and the other of the two members includes a projection. The leaf spring abuts the projection holding the slidable member in either the first position or the second position. When a user pushes one of the members from one position to another, the projection pushes the leaf spring out of the way until it passes an apex of the leaf spring and is held in the other position.

Abstract: A metal processing method includes etching to remove material from a thin metal part. A pattern of etch resistant material is used to prevent etching of the metal in desired locations. The etch resistant material is intentionally applied to unclean surfaces so that an adhesion between the etch resistant material and the metal will fail during the etching process. An edge is formed during etching at the boundaries of the pattern of the etch resistant material. These edges are rounded where the adhesion fails. A shaver foil is produced using the described metal processing method including a face side, a cutter side and a plurality of whisker holes. A face edge is formed where an etched profile of the whisker hole meets the face side and a cutter edge is formed where the etched profile of the whisker hole meets the cutter side. The face edge is rounded using the aforementioned process and the cutter edge is sharp using a conventional etch resistant material application method.

Abstract: According to one embodiment, an electrical connector for electrical connection to a second electronic device having at least one second contact includes a substrate having a first surface and an opposing second surface, with a recess being formed in the first surface. The connect also has a first contact securely coupled to the substrate and having a first portion extending at least partially into the recess and a mass of solder material retainingly held in the recess such that the first portion of the first contact is in contact with the solder material. The first surface is for placement against the second electronic device such that the first and second contacts are aligned and whereupon heating of the mass of solder material, the first and second contacts are securely attached to one another and form an electrical pathway therebetween.

Abstract: A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.

Abstract: An easily openable one-piece RF interference shield and method of manufacturing the same that is cost efficient and easily adapted for use with existing electrical devices. The RF shield having a plurality of interconnected sidewalls, a substantially open bottom region, and a hingeably connected top cover portion, having a top cover latch and disposed along the top edge of one of the sidewalls. The top cover portion of the shield is adapted to hinge toward another one of the sidewalls such that the top cover latch engages a hole disposed on the other sidewall being engaged and completing a protective enclosure about electrical components and preventing those components from causing electromagnetic interferences. The RF shield of the present invention allows for easy opening of the top cover portion to provide access to the enclosure for rework or repair of the electrical components covered by the shield, without having to unsolder the unit from a substrate containing the electrical components.

Abstract: A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.

Abstract: A two-piece RF interference shield and method of manufacturing the same that is cost efficient and easily adapted for use with existing electrical devices. The RF shield includes a bottom portion mounted to the circuit board and a top portion which fits onto the bottom portion. The RF electrical interference shield can be mounted to circuit boards (e.g., by soldering) to prevent electrical components from causing RF interference. The RF shield of the present invention also allows for easy removal of the top of the RF shield so as to provide access to the interior for rework or repair of the electrical components covered by the shield, without having to unsolder the bottom portion of the shield. The two-piece shield for shielding an electrical component comprises a top portion and bottom portion that are fitted together so as to enclose the electrical components to be shielded. The top and bottom portions snap together, e.g.