Abstract: The invention relates to a memory card and its method of manufacture. The memory card has a flexible composite substrate formed from a top film, a base film, and an adhesive layer deposited between and bonding together the base film and the top film. Preferably, the thickness of such composite substrate is between 8 and 12 mils. A layer of metal is adhered to the exposed surface of the top film. A circuit layer is provided to form at least one site on the memory card which is readable by an external reading device. A protective layer is provided to overlie and protect the circuit layer of the memory card.