Abstract: A finFET field effect transistor is produced by the formation of an electrical junction between the thin fin portion of semiconductor material which forms the channel of the transistor and the circuit substrate. Doping particles are implanted in the substrate through a mask which is then subsequently used to form the thin fin portion of the channel. The channel of the finFET transistor is thus electrically insulated from the circuit substrate in the same manner as in MOS integrated circuits realized from bulk silicon substrates.
Type:
Application
Filed:
July 15, 2010
Publication date:
November 4, 2010
Applicants:
STMicroelectronics (Crolles 2) SAS, Interuniversitair Micro-Elecronica Centrum
Abstract: A finFET field effect transistor is produced by the formation of an electrical junction between the thin fin portion of semiconductor material which forms the channel of the transistor and the circuit substrate. Doping particles are implanted in the substrate through a mask which is then subsequently used to form the thin fin portion of the channel. The channel of the finFET transistor is thus electrically insulated from the circuit substrate in the same manner as in MOS integrated circuits realized from bulk silicon substrates.
Type:
Application
Filed:
June 25, 2008
Publication date:
January 1, 2009
Applicants:
STMicroelectronics (Crolles 2) SAS, Interuniversitair Micro-Elecronica Centrum