Patents Assigned to Interuniversitair Micro-Elktronica Centrum (IMEC VZW)
  • Patent number: 6297072
    Abstract: A method of fabricating a microstructure having an inside cavity. The method includes depositing a first layer or a first stack of layers in a substantially closed geometric configuration on a first substrate. Then, performing an indent on the first layer or on the top layer of said first stack of layers. Then, depositing a second layer or a second stack of layers substantially with said substantially closed geometric configuration on a second substrate. Then, aligning and bonding said first substrate on said second substrate such that a microstructure having a cavity is formed according to said closed geometry configuration.
    Type: Grant
    Filed: April 16, 1999
    Date of Patent: October 2, 2001
    Assignee: Interuniversitair Micro-Elktronica Centrum (IMEC VZW)
    Inventors: Hendrikus A. C. Tilmans, Eric Beyne, Myriam Van de Peer