Abstract: A method of fabricating a microstructure having an inside cavity. The method includes depositing a first layer or a first stack of layers in a substantially closed geometric configuration on a first substrate. Then, performing an indent on the first layer or on the top layer of said first stack of layers. Then, depositing a second layer or a second stack of layers substantially with said substantially closed geometric configuration on a second substrate. Then, aligning and bonding said first substrate on said second substrate such that a microstructure having a cavity is formed according to said closed geometry configuration.
Type:
Grant
Filed:
April 16, 1999
Date of Patent:
October 2, 2001
Assignee:
Interuniversitair Micro-Elktronica Centrum (IMEC VZW)
Inventors:
Hendrikus A. C. Tilmans, Eric Beyne, Myriam Van de Peer