Abstract: A method for soldering or hybridizing two components to each other by means of a solder material, including producing, on the opposite-facing surfaces of the components to be soldered or hybridized, a surface capable of being wetted by said solder material, this surface being produced on a first component which is in electrical contact with a metallic conductor, depositing an appropriate quantity of solder material capable of constituting a solder or hybridization pad on one of the wettability surfaces, depositing a flux material in liquid form, bringing the wettability surface of the other component into contact with the solder material thus deposited and raising the temperature until at least the melting temperature of the solder material is reached in order to ensure effective soldering or hybridization of the two components to each other due to the reflow effect.

Abstract: A hermetic coupling device between an optoelectronic component emitting and/or receiving a light beam, and an optical transmission mechanism conveying the light beam. The hermetic coupling device includes a substrate including a blind hole, having a bottom wall, into which one part of the optical transmission mechanism is inserted. The substrate is formed of a stack of a first layer and a second layer. The light beam crosses the substrate passing through the bottom wall of the blind hole, the substrate receiving the optoelectronic component substantially opposite the blind hole. Reflective patterns are inserted between two layers of the hermetic coupling device, substantially on the periphery of the blind hole, and reflect one part of the light beam emitted by the optoelectronic component.