Abstract: A plasma processing system includes a processing chamber, a substrate holder configured to hold a substrate for plasma processing, and a gas injection assembly. The gas injection assembly includes a first evacuation port located substantially in a center of the gas injection assembly and configured to evacuate gases from a central region of the substrate, and a gas injection system configured to inject gases in the process chamber. The plasma processing system also includes a second evacuation port configured to evacuate gases from a peripheral region surrounding the central region of the substrate.
Type:
Application
Filed:
April 6, 2010
Publication date:
August 5, 2010
Applicants:
TOKYO ELECTRON LIMITED, Intl. Business Machines Corp. ("IBM")
Inventors:
Merritt FUNK, David V. Horak, Eric J. Strang, Lee Chen