Abstract: An adjustable pressure mount heatsink subassembly (10) is provided for use with an electronic chip component (16). The system (10) includes a heatsink portion (12) having a block (28) which has a formed thereon to extend the lateral dimension of the circuit board portion (20) of the chip component (16). A mounting subassembly (14) is, in the preferred embodiment, disposed substantially within the transverse channel (34) and includes a spring clip (40) having a threaded aperture (44) centrally located in a pretensioned arc portion (46) and a pair of opposed end portions (48) for engaging the circuit board portion board edges (26). The pressure of attachment is adjusted by a threaded screw (42) which extends through the threaded aperture (44) and engages the channel floor (36) of the heatsink block (28). An optional nonconductive coating (52) is provided on the clip ends (48) in order to prevent unintended electrical conductance.