Abstract: A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a convex surface, applying a suspension to the front face or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles and electrically conducting nanoparticles, arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad, evaporating the carrier fluid thereby confining the microparticles and the nanoparticles, and thereby arranging the nanoparticles and the microparticles as percolation paths between the front face of the pillar and the pad, and sintering the arranged nanoparticles for forming metallic bonds at least between the nanoparticles and/or between the nanoparticles and the front face of the pillar or the pad.

Abstract: Method for printing high resolution features on a substrate, the method comprising: depositing a nanoparticle ink, comprising metal/semi-metal nanoparticles and an adhesive compound, having a binder on a substrate; and applying a laser beam, directly on some or all of the deposited nanoparticle ink to define the print feature, wherein the laser beam is configured to remove the nanoparticle coating or binder thereby allowing the adhesive compound to bond to the nanoparticles and the laser beam is further configured to transform the ink to form a metal/semi-metal structure. The remaining uncured structure can be easily washed away using standard developer solutions such as sodium or potassium hydroxide.

Abstract: Apparatus for curing of nanoparticle material, the apparatus comprising: a receptacle for receiving a substrate upon which a laser of the nanoparticle ink has been placed; and a laser bar diode array comprising a first bar diode laser, the array configured to emit a laser as a continuous wave and to cure the deposited nanoparticle material.