Patents Assigned to INV Polypropylene, LLC
  • Polymeric substrate including a barrier layer
    Patent number: 12600846
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: April 14, 2026
    Assignee: INV Polypropylene, LLC
    Inventors: Billy R. Bodiford, Ross Michael Mahan
  • Polymeric substrate including a barrier layer
    Patent number: 11781000
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: October 10, 2023
    Assignee: INV Polypropylene, LLC
    Inventors: Billy R. Bodiford, Ross Michael Mahan
  • POLYMERIC SUBSTRATE INCLUDING A BARRIER LAYER
    Publication number: 20230057559
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Application
    Filed: October 13, 2022
    Publication date: February 23, 2023
    Applicant: INV Polypropylene, LLC
    Inventors: Billy R. BODIFORD, Ross Michael MAHAN