Abstract: Embodiments generally relate to apparatus and methods for dismantling a hermetically sealed chamber. In one embodiment, an apparatus facilitating the opening of a hermetically sealed chamber in a device comprises a fixture configured to hold the device, and a system configured to create sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. In one embodiment, a method for opening a hermetic seal between first and second elements forming a chamber in a microfluidic chip comprises using a release technique creating sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. The release technique comprises introducing a tool to the vicinity of the interface without any contact between the tool and any material within the chamber. The breaking of the seal results in the complete separation of the first and second elements.

Abstract: Embodiments generally relate to chips containing one or more hermetically sealed chambers that may be dismantled under controlled conditions using a release technique. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

Abstract: Embodiments generally relate to methods for preventing the formation of an emulsion in a liquid lens. In one embodiment, the method comprises fabricating a top substrate, a bottom substrate, and a central substrate including a cavity configured to be filled by first and second liquids. The liquid lens comprising the top substrate, the bottom substrate and the central substrate is assembled, with at least one of the top substrate and the bottom substrate in the assembled liquid lens being characterized by a stabilizing feature determining that in response to an impact load on the assembled liquid lens that would cause localized pressure drops of maximum magnitude X in the absence of the stabilizing feature, the maximum magnitude of localized pressure drops within the liquid lens is smaller than X.

Abstract: Embodiments generally relate to systems and methods for in-vehicle optical image stabilization. In one embodiment, the system includes a first motion sensor rigidly attached to a video capture device mounted in a vehicle; a second motion sensor rigidly attached to an object in the vehicle, the object being within the field of view of the video capture device; and a controller. The controller is operatively connected to the first motion sensor, to the second motion sensor, and to a movable optical element in the video capture device. In one aspect, the first sensor provides a first output signal to the controller, the second sensor provides a second output signal to the controller; and the controller provides a compensation signal to the movable element determined by the first and second output signals.

Abstract: Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

Abstract: Embodiments generally relate to heat pipes and methods for fabricating the same. In one embodiment, the heat pipe comprises a first section bonded to a second section such that a first channel is enclosed therebetween; and a liquid partly filling the first channel. The bonded first and second sections comprise a first area configured to be bonded to a heat-generating device and a second area configured to be bonded to a heat sink. The first channel is characterized by a first portion within the first area and a second portion within the second area. The liquid and at least one of the first section and the second section are transparent at a wavelength emitted by the heat-generating device.

Abstract: A method of fabricating a liquid lens array creates an array of through holes of axisymmetric cross-section through a central plate, forms conductive traces on the side walls of each of the through holes and on a portion of the top and bottom surfaces of the central plate contiguous with each through hole, and bonds the bottom surface of the central plate around each through hole to the top surface of a transparent base plate, forming an array of cavities. The method applies an insulating layer to the side walls of each cavity, portions of the top surface of the base plate lying within each cavity, and portions of the top surface of the transparent central plate surrounding each cavity, introduces a polar liquid and a non-polar liquid into each cavity; and bonds the top surface of the central plate to the bottom surface of a transparent top plate.

Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Abstract: A reflective grating for precision location measurement. In one embodiment, the reflective grating has a non-reflective substrate and a non-reflective adhesion layer disposed on the substrate layer. A reflective surface layer is disposed on the adhesion layer. In another embodiment, the reflective grating is manufactured on the reflective (polished) surface of a monolithic substrate. A series of grating lines are formed in the reflective surface layer by vaporizing portions of the reflective surface layer with a laser in order to expose the non-reflective adhesion layer. Accordingly, alternating reflective and non-reflective grating lines are formed that are used for making precision measurements.