Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

Abstract: A microphone system has a package with a top, a bottom, and four sides that at least in part form an interior chamber. One of the sides forms an inlet aperture for communicating the inlet chamber with the exterior environment. The system also has first and second microphone dies, in a stacked relationship, respectively having a first and second diaphragms. A circuit die, positioned in electrical communication with the first and second microphone dies, is configured to mitigate vibrational noise from the first microphone die using a signal produced by the second microphone die or vice versa. The first and second microphone dies are positioned so that the first and second diaphragms are substantially the same distance from the inlet aperture in the side.

Abstract: A gyroscope comprises a substrate and a guided mass system. The guided mass system comprises proof masses and guiding arms disposed in a plane parallel to the substrate. The proof masses are coupled to the guiding arm by springs. The guiding arm is coupled to the substrate by springs. At least one of the proof-masses is directly coupled to the substrate by at least one anchor via a spring system. The gyroscope also comprises an actuator for vibrating one of the proof-masses in the first direction, which causes another proof mass to rotate in the plane. Finally, the gyroscope also includes transducers for sensing motion of the guided mass system in response to angular velocities about a single axis or multiple input axes.

Abstract: A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body. In some embodiments, a conductive column extends through the pre-molded body to allow electrical connection from a partially encapsulated lead frame to the conductive cover. Some embodiments may include a multi-tiered cavity within the mold body for mounting an integrated circuit separated by a gap above the MEMS device.

Abstract: A method and system for a MEMS device is disclosed. The MEMS device includes a free layer, with a first portion and a second portion. The MEMS device also includes a underlying substrate, the free layer movably positioned relative to the underlying substrate. The first portion and second portion of the free layer are coupled through at least one stem. A sense material is disposed over portions of the second portion of the free layer. Stress in the sense material and second portion of the free layer does not cause substantial deflection of the first portion.

Abstract: Microelectromechanical systems (MEMS) microphones associated with a tunable back cavity are described. Provided implementations can comprise a MEMS acoustic sensor element associated with a first back cavity, which first back cavity can be separated and/or acoustically coupled by a tuning port to a second back cavity. In addition, various physical and acoustic filtering configurations of MEMS microphones and tunable back cavities are described.

Abstract: Systems and methods are disclosed for calibrating a sensor. A recursive least squares estimation may be performed to update a mean and a covariance matrix for samples of data from a motion sensor and a bias estimate for the motion sensor may be derived from the mean and covariance matrix. The motion sensor may be an gyroscope, an accelerometer or a magnetometer.

Abstract: Systems and methods are disclosed for providing sensor based authentication of a user's identification and may be used to control access. In this manner, a user's identity may be used to control access to any suitable location, space or resource, either locally or remotely. A combination of functions involved in authenticating a user's identification may be performed by one or more discrete devices and include obtaining sensor data from at least one sensor that is physically associated with a user, monitoring to determine that the sensor remains physically associated with the user, authenticating the user's identity using the sensor data and communicating information regarding the user's identification.

Abstract: This disclosure provides techniques for guiding a user through a calibration operation of a mobile device having a motion sensor. The user may receive one or more visual cues to aid the user in positioning the device in one or more desired orientations or patterns of motion. The visual cues may be with respect to a virtual three dimensional environment that is responsive to a determined orientation of the device.

Abstract: A method and circuit for testing an acoustic sensor are disclosed. In a first aspect, the method comprises using electro-mechanical features of the acoustic sensor to measure characteristic of the acoustic sensor. In a second aspect, the method comprises utilizing an actuation signal to evaluate mechanical characteristics of the acoustic sensor. In a third aspect, the method comprises using a feedthrough cancellation system to measure a capacitance of the acoustic sensor. In the fourth aspect, the circuit comprises a mechanism for driving an electrical signal into a signal path of the acoustic sensor to cancel an electrical feedthrough signal provided to the signal path, wherein any of the electrical signal and the electrical feedthrough signal are within or above an audio range.

Abstract: Systems and methods for human hand gesture recognition through a training mode and a recognition mode are disclosed. In the training mode, a user can move a handheld device with a hand gesture intended to represent a command. Sensors within the handheld device can record raw data, which can be processed to obtain a set of values corresponding to a set of discrete features, which is stored in a database and associated with the intended command. The process is repeated for various hand gestures representing different commands. In the recognition mode, the user can move the handheld device with a hand gesture. A computer system can compare a set of values corresponding to a set of discrete features derived from the hand gesture with the sets of values stored in the database, select a command with the closest match and displays and/or executes the command.

Abstract: A MEMS device includes a first plate coupled to a second plate and a fixed third plate formed on a first substrate. The first and second plates are displaced in the presence of an acoustic pressure differential across the surfaces of the first plate. The MEMS device also includes a first electrode formed on the third plate and a second electrode formed on the second substrate. The first, second plate, and third plates are contained in an enclosure formed by a first and second substrates. The device includes an acoustic port to expose the first plate to the environment. The MEMS device also includes a first gap formed between the second and third plates and a second gap formed between the second plate and the second electrode. The displacement of the second plate causes the first gap to change inversely to the second gap.

Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

Abstract: A microphone system has two diaphragms and are mechanically interconnected such that they respond in antiphase to an acoustic signal impinging on one of the diaphragms. The two diaphragms produce two variable capacitances that vary proportionately but inversely to one another. Voltage signals produced by the two variable capacitances are summed to provide an output signal proportional to the acoustic signal, but with greater sensitivity than a single-diaphragm microphone.

Abstract: A method and system for image stabilization is disclosed. The image stabilization system includes a first pair of light sensors placed along an axis relative to a first axis, each light sensor is configured to provide a signal indicative of intensity of light received by the light sensor. The image stabilization system further includes a first directional light filter configured to selectively permit passage of incident light to the first pair of light sensors based on an angle of the incident light with reference to the first axis. An image stabilization circuit is configured to receive a pair of signals from the first pair of light sensors and generates a first signal indicative of a change in the angle of incidence of the incident light with reference to the first axis.

Abstract: A method of the invention includes reducing stiction of a MEMS device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided by a conductive layer deposited on the bump stop. The conductive layer can also be roughened to reduce stiction.

Abstract: MEMS device for low resistance applications are disclosed. In a first aspect, the MEMS device comprises a MEMS wafer including a handle wafer with one or more cavities containing a first surface and a second surface and an insulating layer deposited on the second surface of the handle wafer. The MEMS device also includes a device layer having a third and fourth surface, the third surface bonded to the insulating layer of the second surface of handle wafer; and a metal conductive layer on the fourth surface. The MEMS device also includes CMOS wafer bonded to the MEMS wafer. The CMOS wafer includes at least one metal electrode, such that an electrical connection is formed between the at least one metal electrode and at least a portion of the metal conductive layer.

Abstract: A device and a microphone are disclosed. The device comprises a circuit board and a plurality of pads on the circuit board, wherein at least one of the plurality of pads is split into at least two portions that are electrically isolated from each other. The microphone comprises a circuit board, a seal structure on the circuit board, and a plurality of pads on the circuit board, wherein at least one of the plurality of pads is split into at least two portions that are electrically isolated from each other.

Abstract: A system and method in accordance with an embodiment reduces the cross-axis sensitivity of a gyroscope. This is achieved by building a gyroscope using a mechanical transducer that comprises a spring system that is less sensitive to fabrication imperfection and optimized to minimize the response to the rotations other than the intended input rotation axis. The longitudinal axes of the first and second flexible elements are parallel to each other and parallel to the first direction.

Abstract: A curvature-corrected bandgap reference is disclosed. The curvature-corrected bandgap reference comprises a Brokaw bandgap circuit. The Brokaw bandgap circuit includes an output node providing a reference voltage. The Brokaw bandgap circuit further comprising a first BJT device including a first base terminal coupled to the output node and a first emitter terminal. The first BJT device operates at a first current density that is substantially proportional to absolute temperature. The curvature-corrected bandgap reference also includes a second BJT device including a second base terminal coupled to the output node and a second emitter terminal. The second BJT device operates at a second current density that is substantially independent of temperature. Finally the curvature-corrected bandgap reference includes a correction voltage proportional to a voltage difference of the first and second emitter terminals, wherein the correction voltage substantially cancels a curvature of the reference voltage.