Patents Assigned to Inventec Corporation
  • Patent number: 10977411
    Abstract: A method for generating packing solution of printed circuit board (PCB) comprises: obtaining a plurality of component files, a first constraint, and a second constraint, wherein each of the component files corresponds to an electrical component, the first constraint corresponds to a signal-PCB, and the second constraint corresponds to a multiple-PCB; performing a genetic algorithm according to the plurality of component files and the first constraint files to generate a plurality of single-PCB feasible solutions, wherein each of the plurality of single-PCB feasible solutions has a shape description, performing a concave hull algorithm to update the shape description according to each of the plurality of single-PCB feasible solutions, after updating the shape description, performing the genetic algorithm according to the plurality of single-PCB feasible solutions and the second constraint to generate a multiple-PCB packing solution.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: April 13, 2021
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Yu-Sheng Lin, Trista Pei-Chun Chen, Wei-Chao Chen
  • Patent number: 10970198
    Abstract: An automatic test system suitable for testing a server comprises a storage device, a computing device, and a sensing device. The storage device stores an automatic test script. The sensing device collects a plurality of test results of the server. The automatic test script comprises a parameter configuration module, a data processing module, and a core logic module. The parameter configuration module provides a plurality of configuration parameters associated with a server test procedure. The data processing module comprises a data recording sub-module and a data sorting sub-module, while the former receives an output data set from the server test procedure, and the latter generates a test report according to the output data set and the configuration parameters. The core logic module comprises a plurality of instruction sets for controlling the server test procedure through a data exchange interface.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: April 6, 2021
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Qun Wu, Xuefeng Chen, Dong-Rui Xue
  • Patent number: 10962300
    Abstract: A cooling device includes a sink, a first tube, a second tube, a heat exchanger, a pressure adjuster, and a dielectric liquid. The sink has a first outlet and a second outlet. The first tube has a first outlet connected to the first outlet of the sink, and a second outlet. The second tube has a first outlet connected to the second outlet of the sink, and a second outlet. The heat exchanger has a first outlet connected to the second outlet of the first tube, a second outlet connected to the second outlet of the second tube, and a third outlet. The pressure adjuster has an outlet connected to the third outlet of the heat exchanger. A heating element is placed in the sink and immersed in the dielectric liquid. The size of the pressure adjuster is defined by a volume of a vaporization status of the dielectric liquid.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: March 30, 2021
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Kai-Yang Tung, Mao-Ching Lin
  • Publication number: 20210080196
    Abstract: A heat dissipation system configured to be in thermal contact with a heat source. The heat dissipation system includes a centrifugal fan, a heat pipe, a heat dissipater, and a heat conduction assembly. The centrifugal fan includes a housing and an impeller. The housing has an accommodation space, an inlet, and an outlet. The inlet and the outlet are connected to the accommodation space. The impeller is located in the accommodation space. The heat pipe is configured to be in thermal contact with the heat source. The heat dissipater is located at the outlet and in thermal contact with the heat pipe. The heat conduction assembly includes a first part configured for the heat source to be mounted thereon and in thermal contact with the heat source, and a second part disposed on the housing and partially located in the accommodation space.
    Type: Application
    Filed: November 25, 2019
    Publication date: March 18, 2021
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Shin-Hsin HSIEN, Chih-Kai YANG
  • Publication number: 20210084792
    Abstract: A centrifugal fan including an impeller housing and an impeller. The impeller housing has an accommodation space, an air inlet and an air outlet. The air inlet and the air outlet are connected to the accommodation space. The impeller is located in the accommodation space. The impeller includes a hub, a plurality of blades, and at least one heat conductive annular portion. The hub is rotatably disposed in the impeller housing. The plurality of blades are connected to an outer circumferential surface of the hub. The at least one heat conductive annular portion is connected to the plurality of blades.
    Type: Application
    Filed: November 25, 2019
    Publication date: March 18, 2021
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Shin-Hsin HSIEN, Chih-Kai YANG
  • Publication number: 20210081898
    Abstract: A human resource management method, comprising: obtaining a feature parameter associated with an employee; performing a prediction algorithm based on machine learning according to the feature parameter to output a human resource index; and performing a classification procedure to convert the human resource index to an understandable information.
    Type: Application
    Filed: November 25, 2019
    Publication date: March 18, 2021
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Shih-Yi WU, Trista Pei-Chun CHEN, Wei-Chao CHEN
  • Patent number: 10948246
    Abstract: A heat dissipation system configured to be in thermal contact with a heat source. The heat dissipation system includes a centrifugal fan, a heat pipe, a heat dissipater, and a heat conduction assembly. The centrifugal fan includes a housing and an impeller. The housing has an accommodation space, an inlet, and an outlet. The inlet and the outlet are connected to the accommodation space. The impeller is located in the accommodation space. The heat pipe is configured to be in thermal contact with the heat source. The heat dissipater is located at the outlet and in thermal contact with the heat pipe. The heat conduction assembly includes a first part configured for the heat source to be mounted thereon and in thermal contact with the heat source, and a second part disposed on the housing and partially located in the accommodation space.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: March 16, 2021
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Shin-Hsin Hsien, Chih-Kai Yang
  • Publication number: 20210075706
    Abstract: The present disclosure discloses an automated integrated test system and method thereof. A virtual mobile device is generated by a host at the test end at an initial time, which executes a preset script file to call the basic functions and the control functions after detecting the abnormal signals of production equipments, so as to simulate the processing flow of abnormal signals and to remotely adjust the equipment parameters. Then, a log file is generated according to the execution result of the script file, and the corresponding report files are generated according to different time ranges in the log file for transmission or display, so as to achieve the technical effect of improving the convenience of system testing in the complex environment.
    Type: Application
    Filed: September 7, 2020
    Publication date: March 11, 2021
    Applicants: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: Lei WANG
  • Publication number: 20210072305
    Abstract: The disclosure provides an online test data record and offline data conversion analysis system and a method thereof. In the present disclosure, the test process information of the production line testing system performed on the circuit board to be tested is generated into online test result data in a database file format, and the offline analysis system receives the online test data from the production line testing system. The offline analysis system reads the corresponding data in the online test result data according to the designated data in the data designated instruction, and generates the offline test result data in the designated file format of the data designated instruction, and the offline analysis system perform the data analysis for the offline test result according to the analysis instruction.
    Type: Application
    Filed: September 7, 2020
    Publication date: March 11, 2021
    Applicants: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: Yong-Jun SHI
  • Publication number: 20210072215
    Abstract: The present disclosure provides a method and a system for building a detection model based on a standard value to confirm a soldering status. The present disclosure generates the solder joint classification based on the standard value data, and uses the detection model to analyze whether the second solder joint data generated by detecting the PCB has poor soldering conditions after building the detection model based on the first solder joint data corresponding to the solder joint included in the solder joint classification, thereby achieving the technical effect of reducing the number of solder joints that are misjudged as poor soldered and shortening the time required for manual re-judgment.
    Type: Application
    Filed: September 7, 2020
    Publication date: March 11, 2021
    Applicants: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: Li Yu
  • Publication number: 20210073108
    Abstract: The present disclosure relates to a virtualized device-based test system and method thereof. A virtual mobile device can be generated by the host at the test end, and a script file corresponding to the item to be tested is allowed to be established. When testing, the script file is executed to: simulate the touch operation, detect the display state and identify the text information by the basic functions; drive the browser of the virtual mobile device to perform webpage operations through an application programming interface (API) and control functions; then generate a log file according to the script file and the execution result of the webpage operations; and generate a test report according to the log file, the touch operation, the display state and the text information for transmission or display, so as to achieve the technical effect of improving the convenience of system testing.
    Type: Application
    Filed: September 6, 2020
    Publication date: March 11, 2021
    Applicants: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: Lei WANG
  • Publication number: 20210073896
    Abstract: A product order prediction method adapts to a production planning system. The method comprises obtaining a reference data related to a next reference order and a current actual order, performing an algorithm based on the neural network model according to the reference data and the current actual order to generate a feature vector, and performing another algorithm based on the neural network model according to the feature vector to output a next predicted order to the production planning system, for the production planning system to generate an operation plan of a production line of the product according to the next predicted order.
    Type: Application
    Filed: December 18, 2019
    Publication date: March 11, 2021
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Jonathan Hans SOESENO, Trista Pei-Chun CHEN, Chih Hung HUANG, Junh Hsien TU, Wei-Chao CHEN, Chao-Nan CHEN
  • Publication number: 20210071701
    Abstract: A fastener including a screw part and a handle part. The screw part includes a head portion and a body portion that are connected to each other. A diameter of the body portion is smaller than a diameter of the head portion. The head portion includes a recess on a side of the head portion located away from the body portion. The handle part is pivotally connected to the head portion and pivotable between an operation position and a bent-down position. When the handle part is in the operation position, the handle part is partially located on a side of the head portion located away from the body portion. When the handle part is in the bent-down position, the handle part is located away from the side of the head portion located away from the body portion.
    Type: Application
    Filed: December 13, 2019
    Publication date: March 11, 2021
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventor: Tai-Yi CHIANG
  • Publication number: 20210072306
    Abstract: The disclosure relates to a test system for improving test stability. One end of the connection pin is fixed to a bottom surface of a corresponding pin socket, the bottom surface is near an end of the plug end, the other end of each connection pin is disposed in the corresponding pin socket and a portion of the other end of the connection pin protrudes from a top surface of an end of the plug end. The connection pin in the plug end will not be deformed by external force, which can avoid the deformation of the connection pin caused by external force, and ensure the electrical connection and test stability.
    Type: Application
    Filed: September 7, 2020
    Publication date: March 11, 2021
    Applicants: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: Lin ZHANG
  • Publication number: 20210073968
    Abstract: The present disclosure relates to a system and method for detecting whether solder joints are bridged by using a deep learning model. After an SPI device generates a detection result of a pad, the present disclosure analyzes a detection image corresponding to the solder joint with poor soldering indicated by a detection result by using a detection model. When there is a bridge in the detection image, the detection image is displayed to provide a re-judgment technique, thereby achieving the technical effect of reducing the number of solder joints which are misjudged to be bridged and shortening the time required for manual re-judgment.
    Type: Application
    Filed: September 7, 2020
    Publication date: March 11, 2021
    Applicants: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: Hao LIU
  • Publication number: 20210074331
    Abstract: A server includes a case including a bottom board, a first lateral board and a second lateral board, a riser card provided with opposite two ends respectively disposed on the lateral boards, a HDD backplane electrically connected with the riser card, first HDDs disposed on the HDD backplane, a first main logic board electrically connected with the riser card, and a common carrier. The lateral boards are respectively located on opposite sides of the bottom board, and an accommodation space is formed between the lateral boards. The riser card divides the accommodation space into a two accommodation regions. The HDD backplane is disposed in a first accommodation region. The first main logic board is disposed in a second accommodation region, and the first HDDs is electrically connected with the first main logic board via the riser card. The common carrier is disposed in the second accommodation region.
    Type: Application
    Filed: September 16, 2019
    Publication date: March 11, 2021
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Shu-Min WANG, Ji-Peng XU
  • Publication number: 20210071706
    Abstract: A fixing structure, configured to fix screw. Screw includes wide portion and narrow portion. Fixing structure includes plate part, holding component and elastic positioning component. Plate part includes top surface, bottom surface and mount groove. Mount groove penetrates through top surface and bottom surface and narrow portion is disposed through mount groove to allow wide portion to rest on top surface. Holding component and top surface together form space. Elastic positioning component is disposed on plate part. When wide portion is located in space and between holding component and top surface, and elastic positioning component is in holding state and located at side of wide portion, wide portion is prevented from being moved away from space. When elastic positioning component is switched to released state, elastic positioning component is removed from side of wide portion so that wide portion is allowed to move away from space.
    Type: Application
    Filed: November 14, 2019
    Publication date: March 11, 2021
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ming-Hung SHIH, Hong-Jie JIAN, Kuo En CHANG
  • Publication number: 20210072299
    Abstract: A method for examining differential pair transmission lines, performed by a processor, comprising: capturing a plurality of first insertion losses of a first signal line within a frequency range and a plurality of second insertion losses of a second signal line within the frequency range, wherein the first signal line and the second signal line are configured to transmit a pair of differential signals; calculating a plurality of maximum error ratios between the first insertion losses and the second insertion losses within the frequency range; determining whether any one of the maximum error ratios is greater than or equal to an upper threshold; outputting a warning signal when the processor determines one of the maximum error ratios is greater than or equal to the upper threshold; and ending the method when the processor determines each one of the maximum error ratios is smaller than the upper threshold.
    Type: Application
    Filed: December 13, 2019
    Publication date: March 11, 2021
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Chun I TSENG, Yen-Hao CHEN
  • Publication number: 20210072071
    Abstract: A method for assessing transportation risk is adapted to an object transported by a vehicle. The method comprises disposing a sensor on a floor of the vehicle to generate and collect a vibration signal, with the floor being configured to carry the object, a computing device performs a time-domain processing procedure according to the vibration signal to output a first data, performs a frequency-domain processing procedure according to the first data to output a second data, performs a risk assessing procedure to output a risk level according to the second data and a reference data, wherein the second data comprises an actual vibration intensity and an actual vibration duration and the reference data comprises a reference vibration intensity and a reference vibration duration.
    Type: Application
    Filed: September 17, 2019
    Publication date: March 11, 2021
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: De bin QI, Xiaowei ZHANG, Xuefeng CHEN
  • Publication number: 20210073112
    Abstract: A system and method for generating configuration files and performing test by using the configuration files are disclosed. The configuration generation system configures the identification code corresponding to each testing mode as a comparison table, and configures at least one set of identification codes corresponding to each testing collection and the execution configuration of the identification code to generate the configuration files, and the production line testing system parses the test script to obtain the testing mode and the execution configuration of the testing mode according to the identification comparison table and the configuration files, so as to execute the test. The test program is convenient by providing the configuration files.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 11, 2021
    Applicants: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: Yong-Jun SHI