Abstract: A gradient-index lens for directing incident electromagnetic radiation comprises at least one substrate having a plurality of micro-features (e.g., trenches or holes) that may be arranged in a pattern of varied size and/or spacing. Each of the micro-features has at least one dimension that is less than a wavelength of the electromagnetic radiation. The spacing between adjacent micro-features is less than the wavelength of the electromagnetic radiation, and the size and spacing of the micro-features are sufficient to produce an effective refractive index profile of the lens that is graded.

Abstract: A gradient-index lens for directing incident electromagnetic radiation comprises at least one substrate having a plurality of micro-features (e.g., trenches or holes) that may be arranged in a pattern of varied size and/or spacing. Each of the micro-features has at least one dimension that is less than a wavelength of the electromagnetic radiation. The spacing between adjacent micro-features is less than the wavelength of the electromagnetic radiation, and the size and spacing of the micro-features are sufficient to produce an effective refractive index profile of the lens that is graded.

Abstract: A gradient-index lens for directing incident electromagnetic radiation comprises at least one substrate having a plurality of micro-features (e.g., trenches or holes) that may be arranged in a pattern of varied size and/or spacing. Each of the micro-features has at least one dimension that is less than a wavelength of the electromagnetic radiation. The spacing between adjacent micro-features is less than the wavelength of the electromagnetic radiation, and the size and spacing of the micro-features are sufficient to produce an effective refractive index profile of the lens that is graded. A thermal imaging device incorporating a gradient-index lens is also provided.

Abstract: A gradient-index lens for focusing incident electromagnetic radiation comprises at least first and second substrates. Each of the substrates has a plurality of trenches or holes formed therein. The first substrate is stacked on the second substrate such that trenches or holes in the first substrate are substantially aligned with corresponding trenches or holes in the second substrate to form combined trenches or holes. Each of the combined trenches or holes has a width or diameter that is less than a wavelength of the electromagnetic radiation, and the spacing between adjacent ones of the combined trenches or holes is less than the wavelength of the electromagnetic radiation. The size and spacing of the combined trenches or holes in the stacked substrates are sufficient to produce an effective refractive index profile of the lens element that is graded. A method for producing the lens is also provided.

Abstract: An imaging device comprises a focal plane array (FPA) having a plurality of singulated unit cells arranged on a carrier substrate. Each of the unit cells comprises a sub-array of pixels in the focal plane array. At least one of the unit cells has a different number or type of pixels than does another one of the unit cells arranged on the carrier substrate to enable multi-spectral imaging. The device also includes at least one lens positioned to direct incident electromagnetic radiation to the unit cells. A modular method for producing the FPA and lenses of a camera core uses wafer-level packaging and optics. Lenses and sub-arrays of pixels are each fabricated on densely packed, batch-fabricated wafers, and subsequently singulated and assembled into arrays on respective low cost carrier substrates. The carrier substrates are bonded together at the substrate level to form a series of camera cores, and the stacked substrates are singulated to form individual camera cores.

Abstract: A thermal imaging device comprises a focal plane array disposed on a focal plane substrate. The focal plane array comprises a plurality of pixels grouped into sub-arrays of pixels. The device also comprises a lens array comprising a plurality of lenslets. Each of the lenslets is arranged to focus infrared rays on a respective one of the sub-arrays of pixels. The focal plane array is enclosed in a vacuum in a space between the lens array and the focal plane substrate, and a readout circuit is electrically connected to the pixels. The thermal imaging device has a small form factor and low cost while maintaining adequate performance, enabling expanded usage of thermal imaging (e.g., in security, surveillance, first responder, defense and/or automotive applications).

Abstract: An imaging device comprises a focal plane array (FPA) having a plurality of singulated unit cells arranged on a carrier substrate. Each of the unit cells comprises a sub-array of pixels in the focal plane array. At least one of the unit cells has a different number or type of pixels than does another one of the unit cells arranged on the carrier substrate to enable multi-spectral imaging. The device also includes at least one lens positioned to direct incident electromagnetic radiation to the unit cells. A modular method for producing the FPA and lenses of a camera core uses wafer-level packaging and optics. Lenses and sub-arrays of pixels are each fabricated on densely packed, batch-fabricated wafers, and subsequently singulated and assembled into arrays (e.g., 3×3, 4×4, 4×5) on respective low cost carrier substrates. The carrier substrates are bonded together at the substrate level to form a series of camera cores, and the stacked substrates are singulated to form individual camera cores.