Patents Assigned to IO TECH GROUP LTD.
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Patent number: 12238862Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.Type: GrantFiled: May 30, 2024Date of Patent: February 25, 2025Assignee: IO Tech Group Ltd.Inventors: Michael Zenou, Guy Nesher
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Patent number: 12179382Abstract: A material for use as support material for energy-pulse-induced transfer printing, which contains (a) at least one energy transformation component, (b) at least one volume expansion component and (c) at least one binder and which has a viscosity at 25° C. of from 0.2 Pas to 1000 Pas and a surface tension at 25° C. of from 20 to 150 mN/m. The invention furthermore relates to a process for producing three-dimensional objects using the support material.Type: GrantFiled: April 25, 2023Date of Patent: December 31, 2024Assignees: Ivoclar Vivadent AG, IO Tech Group Ltd.Inventors: Lorenz Josef Bonderer, Jürgen Rudolf Laubersheimer, Wolfgang Josef Wachter, Michael Zenou
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Patent number: 12109754Abstract: Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.Type: GrantFiled: November 9, 2023Date of Patent: October 8, 2024Assignee: IO TECH GROUP LTD.Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
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Patent number: 12089328Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCB s produced according to the present systems and methods may be single-sided or double-sided.Type: GrantFiled: October 31, 2023Date of Patent: September 10, 2024Assignee: IO Tech Group Ltd.Inventors: Michael Zenou, Guy Nesher
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Patent number: 12064899Abstract: A material for use as support material for energy-pulse-induced transfer printing, which contains (a) at least one energy transformation component, (b) at least one volume expansion component and (c) at least one binder and which has a viscosity at 25° C. of from 0.2 Pas to 1000 Pas and a surface tension at 25° C. of from 20 to 150 mN/m. The invention furthermore relates to a process for producing three-dimensional objects using the support material.Type: GrantFiled: April 25, 2023Date of Patent: August 20, 2024Assignees: Ivoclar Vivadent AG, IO Tech Group Ltd.Inventors: Lorenz Josef Bonderer, Jürgen Rudolf Laubersheimer, Wolfgang Josef Wachter, Michael Zenou
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Patent number: 12059700Abstract: Systems and methods for coating a thin film with a viscous material, such as a liquid, a paste, or an adhesive, at a desired thickness. In such a system, two films move adjacent to one another, optionally in opposite directions, atop two rollers separated by a known gap that defines a coating thickness, with the material being transferred from one film to the other. The rollers may be maintained in their relative positions by springs and/or linear actuators and positioned using linear encoders. In alternative arrangements, the material to be coated could be low viscosity material such as a polymeric solution. Air knives may be provided near the gap to create an air flow that aids in preventing the free flow of low viscosity materials outside the bounds of the film during coating.Type: GrantFiled: September 19, 2022Date of Patent: August 13, 2024Assignee: IO Tech Group Ltd.Inventors: Michael Zenou, Ziv Gilan
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Patent number: 12046575Abstract: A method for fabricating a three-dimensional (3D) electronic device. A liquid support material (e.g., an epoxy acrylate with a photoinitiator) is applied by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having one or more connectors and one or more electronic components thereon, and then cured to solid form by cooling and/or exposure to ultraviolet (UV) radiation. A layer of conductive material (e.g., a metal) is printed on the solidified support material by LIFT to electrically connect the one or more electronic components to respective ones of the connectors on the PCB. Subsequently, the layer of conductive material is dried by heating and metal particles in the conductive layer sintered using a laser beam. The assembly may then be encapsulated in an encapsulant.Type: GrantFiled: April 22, 2020Date of Patent: July 23, 2024Assignee: IO Tech Group Ltd.Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
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Patent number: 12010800Abstract: In a first approach, a vacuum cell comprises a porous plate and a vacuum force generated by gas being drawn thorough the porous plate is used to pick electronic components from a donor substrate. After transport of the vacuum cell to a placing area, dots of liquid material may be deposited on a top surface of the porous plate adjacent to one or more picked components in order to disrupt the vacuum force and release the picked components onto a receiving substrate. In a refinement of the first approach, the porous plate contains a plurality of picking holes for selectively picking components. Certain picking holes can be fluidly coupled to the vacuum, allowing components to be attached within those picking holes, while other picking holes can be closed or rendered inactive with dots of liquid material deposited on a top surface of the porous plate.Type: GrantFiled: June 30, 2021Date of Patent: June 11, 2024Assignee: IO Tech Group Ltd.Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
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Patent number: 11877398Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.Type: GrantFiled: February 24, 2021Date of Patent: January 16, 2024Assignee: IO Tech Group Ltd.Inventors: Michael Zenou, Guy Nesher
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Patent number: 11872750Abstract: Methods and apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials at high resolution. A material is coated on a film non-digitally, excess material is removed digitally, by laser, leaving an image of a layer to be printed, and the image is then engaged with existing portions of an object being fabricated and exposed to a non-digital heat source. Since the only part of the process that is digital is the material removal, and this part is done by laser, the speed of printing and the robustness of the manufacturing process is improved significantly over conventional additive or 3D fabrication techniques.Type: GrantFiled: May 1, 2023Date of Patent: January 16, 2024Assignee: IO Tech Group Ltd.Inventors: Ziv Gilan, Michael Zenou, Guy Nesher
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Patent number: 11865767Abstract: Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.Type: GrantFiled: April 20, 2023Date of Patent: January 9, 2024Assignee: IO Tech Group Ltd.Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
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Patent number: 11858211Abstract: Systems for material deposition. One such system includes a number of containers arranged relative to one another in a conical or other shape, pointing toward a common deposition point. When not actively depositing material, the containers are held at a distance from the deposition point. Another system has a rod disposed within a container and a flexible tip on the rod seals a material exit of the container when biased closed. Pressurized gas introduced into the container forces the rod away from the material exit and material from the container. In yet another system, a container includes a barrel adapter having a one-way air valve that seals the container and creates a vacuum, preventing material from leaking from the container. Upon application of a pressurized gas, the one-way valve is forced open and material is deposited from the container. The valve closes automatically in the absence of the gas.Type: GrantFiled: December 6, 2021Date of Patent: January 2, 2024Assignee: IO Tech Group Ltd.Inventors: Ziv Gilan, Daniel Liptz
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Patent number: 11785722Abstract: Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.Type: GrantFiled: September 12, 2022Date of Patent: October 10, 2023Assignee: IO Tech Group Ltd.Inventor: Michael Zenou
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Patent number: 11697245Abstract: Methods and apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials at high resolution. A material is coated on a film non-digitally, excess material is removed digitally, by laser, leaving an image of a layer to be printed, and the image is then engaged with existing portions of an object being fabricated and exposed to a non-digital UV curing light source. Since the only part of the process that is digital is the material removal, and this part is done by laser, the speed of printing and the robustness of the manufacturing process is improved significantly over conventional additive or 3D fabrication techniques.Type: GrantFiled: November 5, 2021Date of Patent: July 11, 2023Assignee: IO Tech Group Ltd.Inventors: Ziv Gilan, Michael Zenou, Guy Nesher
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Patent number: 11697166Abstract: Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.Type: GrantFiled: August 8, 2022Date of Patent: July 11, 2023Assignee: IO TECH GROUP LTD.Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
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Patent number: 11691332Abstract: Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.Type: GrantFiled: January 4, 2021Date of Patent: July 4, 2023Assignee: IO Tech Group Ltd.Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
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Patent number: 11673328Abstract: Methods that prevent oxygen inhibition of a light-initiated polymerization reaction by purging the oxygen from reaction surfaces using inert gas flow. In some embodiments, oxygen is purged using a gas diffusion system that introduces, via a diffuser, an inert gas into a workspace between a UV light source and a UV curable layer of a workpiece. The diffuser may be made of a transparent or diffuse material to allow UV light to pass through it, and includes an array of micro-holes for the gas to pass through towards the workpiece. The inert gas flow may be heated to maintain a desired and uniform reaction temperature.Type: GrantFiled: November 2, 2021Date of Patent: June 13, 2023Assignee: IO TECH GROUP LTD.Inventors: Michael Zenou, Ziv Gilan, Daniel Liptz, Yuval Shai
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Patent number: 11667053Abstract: The invention relates to a material for use as support material for energy-pulse-induced transfer printing, which contains (a) at least one energy transformation component, (b) at least one volume expansion component and (c) at least one binder and which has a viscosity at 25° C. of from 0.2 Pas to 1000 Pas and a surface tension at 25° C. of from 20 to 150 mN/m. The invention furthermore relates to a process for producing three-dimensional objects using the support material.Type: GrantFiled: November 6, 2019Date of Patent: June 6, 2023Assignees: Ivoclar Vivadent AG, IO Tech Group Ltd.Inventors: Lorenz Josef Bonderer, Jürgen Rudolf Laubersheimer, Wolfgang Josef Wachter, Michael Zenou
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Patent number: 11642202Abstract: A three-dimensional device is fabricated in a layer-by-layer approach using a support material. The support material is deposited in a liquid form on a surface, hardened by cooling or ultraviolet (UV) curing, and selectively ablated to create an area within which the desired structure of the device will be formed. Active material is deposited into this area, and the layer-by-layer process repeated until the three-dimensional device has been completed. Thereafter, any remaining support material is removed by water or other solvent.Type: GrantFiled: October 4, 2021Date of Patent: May 9, 2023Assignee: IO Tech Group Ltd.Inventors: Michael Zenou, Guy Nesher, Ziv Gilan
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Patent number: 11629987Abstract: Systems and methods for the injection/dispensing of fluid material in a volumetrically accurate and repeatable manner via an injection cell that interconnects two reservoirs of the fluid material. The injection cell has a normally closed dispensing valve that is opened for dispensing of the fluid material during a compression cycle, and closed during a return cycle. Opening and closing of the dispensing valve is effected using either or both of pressurized air and/or a motorized linkage. During the compression cycle, independent longitudinal displacements of a piston cylinder and a piston within the injection cell act to first open the dispensing valve and subsequently eject fluid material within the piston cylinder via the opened dispensing valve. The piston cylinder and piston are returned to an initial state that facilitates reloading of the injection cell from the reservoirs and closes the dispensing valve during a return cycle.Type: GrantFiled: October 1, 2021Date of Patent: April 18, 2023Assignee: IO Tech Group Ltd.Inventor: Ziv Gilan