Abstract: A MOSFET device arranged on a substrate 10 having first and second heavily-doped strips 11 and 14 respectively covered by first and second contacts 13 and 15, these two strips being spaced apart by a channel 18 that also appears on the substrate 10, the channel being covered by a dielectric layer 20, itself surmounted by a third contact 21. The channel 18 incorporates a thin film 19 lightly doped with dopant atoms of a same type as the channel, at the interface with the dielectric layer 20, the dopant atoms being distributed on both sides of the interface.

Abstract: The present invention provides a support that comprises: an electrically conductive biased table; an insulating electrostatic substrate carrier 20 in the form of a cylinder having a shoulder 21, the bottom face of the substrate carrier 20 facing the biased table and its top face 22 presenting a bearing plane designed to receive a substrate; and an electrically conductive clamping collar for clamping the shoulder 21 against the biased table. The support also has at least one electrically conductive element 201-202-203 for connecting the bearing plane to the shoulder 211.

Abstract: A method of controlling an implanter operating in plasma immersion, the method including the steps of: an implantation stage (1) during which the plasma AP is ignited and the substrate is negatively biased S; a neutralization stage (2) during which the plasma AP is ignited and the substrate has a positive or zero bias S applied thereto; a suppression stage (3) during which the plasma AP is extinguished; and an expulsion stage (4) for expelling negatively charged particles from the substrate and during which the plasma AP is extinguished. The method is remarkable in that the duration of the expulsion stage is longer than 5 ?s. The invention also provides a power supply for biasing an implanter.

Abstract: A method of doping a silicon wafer in order to fabricate a photovoltaic cell, the method including the steps of: performing a first doping operation of at least a first portion (11) of a surface (10) of the silicon wafer; forming an oxide layer (40) on the partially doped surface (10); and performing a second doping operation through the oxide layer (40), so as to dope another portion (12) of the surface (10) of the silicon wafer.

Abstract: The invention relates to a method for producing a solar cell (1) from crystalline semiconductor material, wherein a first doping region (5) is formed by means of ion implantation (S2) of a first dopant in a first surface (3a) of a semiconductor substrate (3), and a second doping region (7) is formed by means of ion implantation (S3) or thermal indiffusion of a second dopant in the second surface (3b) of the semiconductor substrate. After the doping of the second surface, a cap (9b) acting as an outdiffusion barrier for the second dopant is applied and an annealing step (S4) is subsequently carried out.

Abstract: A method of controlling an implanter operating in plasma immersion, the method including the steps of: an implantation stage (1) during which the plasma AP is ignited and the substrate is negatively biased S; a neutralization stage (2) during which the plasma AP is ignited and the substrate has a positive or zero bias S applied thereto; a suppression stage (3) during which the plasma AP is extinguished; and an expulsion stage (4) for expelling negatively charged particles from the substrate and during which the plasma AP is extinguished. The method is remarkable in that the duration of the expulsion stage is longer than 5 ?s. The invention also provides a power supply for biasing an implanter.

Abstract: The present invention relates to a support comprising: an electrically conductive biased table (10) connected to a high voltage power supply (12) and supported on an electrically insulating stand (40); an electrically insulating substrate carrier (20) in the form of a cylinder, its top face presenting a bearing plane designed to receive a substrate (50); legs (15) standing on the biased table (10) in order to support the bottom face of the substrate carrier (20); and at least one electrically conductive connection (201, 202, 203, 31, 30) for connecting the bearing plane to the biased table (10). The support is remarkable in that the substrate carrier (20) incorporates a heating resistance (26).

Abstract: A method of treating a substrate 23 includes a doping step followed immediately by a stabilization step. The method is remarkable in that the stabilization step involves immersing the substrate in a gas forming part of the set consisting of: oxygen; water vapor; wet air; hydrogen peroxide vapor; ozone; and ammonia. Also disclosed is a machine for treating a substrate in accordance with the above method and including a gas introduction orifice.

Abstract: The present invention relates to a support comprising: an electrically conductive biased table (10) connected to a high voltage power supply (12) and supported on an electrically insulating stand (40); an electrically insulating substrate carrier (20) in the form of a cylinder, its top face presenting a bearing plane designed to receive a substrate (50); legs (15) standing on the biased table (10) in order to support the bottom face of the substrate carrier (20); and at least one electrically conductive connection (201, 202, 203, 31, 30) for connecting the bearing plane to the biased table (10). The support is remarkable in that the substrate carrier (20) incorporates a heating resistance (26).

Abstract: The present invention relates to a method of implanting impurities in a part. The method is remarkable in that the part is a gas diffusion device of the showerhead type in the form of a hollow body 1 having a gas admission orifice 2 and an ejection surface 3 provided with a plurality of holes, and the implanting takes place in the ejection surface.

Abstract: The present invention relates to a method of controlling an ion implanter having a plasma power supply AP and a substrate power supply, the substrate power supply comprising: an electricity generator; a first switch SW1 connected between the generator and the output terminal of the substrate power supply; and a second switch SW2 connected between the output terminal and a neutralization terminal; the method including an implantation stage A-D and a neutralization stage E-H. The method also includes a relaxation stage C-F overlapping the implantation stage and the neutralization stage, during which relaxation stage the plasma power supply is inactivated. Furthermore, the neutralization stage includes a preliminary step E-F for closing the second switch, this preliminary step being followed by a cancellation step F-G for activating the plasma power supply AP.

Abstract: An ion implantation machine includes an enclosure that is connected to a pump device, a negatively polarized substrate-carrier that is arranged inside the enclosure, and a plasma feed device in the form of a generally cylindrical body extending between an initial section and a terminal section, the device having a main chamber provided with an ionization cell, the main chamber being provided with a gas delivery orifice, and the final section of the main chamber being provided with a head-loss component for creating a pressure drop relative to the body. Furthermore, the plasma feed device also includes an auxiliary chamber arranged beyond the final section, the auxiliary chamber opening out into the enclosure at the terminal section.

Abstract: The present invention relates to an ion implantation machine 100 that comprises: an enclosure 101 that is connected to a pump device 102; a plasma source 115-121-122; a bias power supply 113; a gas inlet 117 leading into the enclosure; and a substrate-carrier 104 connected to the negative pole of the bias power supply and arranged inside the enclosure. The machine is remarkable in that: the substrate-carrier 104 consists in at least two parallel plates 105-106; a reference electrode consists in at least one strip 110, this reference electrode being connected to the positive pole of the bias power supply; and the strip is interposed between the two plates.

Abstract: The invention relates to an ion implanter that comprises an enclosure ENV having arranged therein a substrate carrier PPS connected to a substrate power supply ALT via a high voltage electrical passage PET, the enclosure ENV being provided with pump means PP, PS, the enclosure ENV also having at least two cylindrical source bodies CS1, CS2 free from any obstacle and arranged facing the substrate carrier. This implanter is remarkable in that it includes at least one confinement coil BCI1-BCS1, BCI2-BCS2 per source body CS1, CS2.

Abstract: The invention relates to a method for producing a solar cell (1) from crystalline semiconductor material. In a first surface (3a) of a semiconductor substrate (3), a first doping area (5) is formed by thermally diffusing a first dopant and in the second surface (3b) of the semiconductor substrate, a second doping area (7) is formed by implanting ions and thermally implanting a second dopant.

Abstract: The invention relates to a method (800) for producing a contact structure (104) of a photovoltaic cell (100), wherein the method (800) comprises a step (802) of providing, a step (804) of doping, and a step (806) of contacting. In step (802) of providing, a wafer (102) for the photovoltaic cell (100) is provided. In step (804) of doping, a surface portion of at least one side of the wafer (102) is doped with a doping material in order to obtain a doped region (106), wherein the doped region (106) is formed as doped tracks (106) and the tracks (106) are separated by intermediate spaces (110). In step (806) of contacting, the doped region (106) is contacted in order to produce the contact structure (104), wherein a conductor material (108) is applied to the tracks (106) in such a way that the tracks (106) protrude beyond the conductor material (108) on both sides.

Abstract: A method of doping a silicon wafer in order to fabricate a photovoltaic cell, the method comprising the steps consisting in: performing a first doping operation of at least a first portion (11) of a surface (10) of the silicon wafer; forming an oxide layer (40) on the partially doped surface (10); and performing a second doping operation through the oxide layer (40), so as to dope another portion (12) of the surface (10) of the silicon wafer.

Abstract: The present invention relates to an ion implantation machine 100 that comprises: an enclosure 101 that is connected to a pump device 102; a plasma source 115-121-122; a bias power supply 113; a gas inlet 117 leading into the enclosure; and a substrate-carrier 104 connected to the negative pole of the bias power supply and arranged inside the enclosure. The machine is remarkable in that: the substrate-carrier 104 consists in at least two parallel plates 105-106; a reference electrode consists in at least one strip 110, this reference electrode being connected to the positive pole of the bias power supply; and the strip is interposed between the two plates.

Abstract: The invention relates to an ion implanter that comprises an enclosure ENV having arranged therein a substrate carrier PPS connected to a substrate power supply ALT via a high voltage electrical passage PET, the enclosure ENV being provided with pump means PP, PS, the enclosure ENV also having at least two cylindrical source bodies CS1, CS2 free from any obstacle and arranged facing the substrate carrier. This implanter is remarkable in that it includes at least one confinement coil BCI1-BCS1, BCI2-BCS2 per source body CS1, CS2.

Abstract: A control module for an ion implanter having a power supply, the power supply comprising: an electricity generator HT having its positive pole connected to ground; a first switch SW1 having its first pole connected to the negative pole of the generator HT and having its second pole connected to the outlet terminal S of the power supply; and a second switch SW2 having its first pole connected to the outlet terminal S and having its second pole connected to a neutralization terminal N. The control module also comprises a current measurement circuit AMP for measuring the current that flows between the second pole of the second switch SW2 and the neutralization terminal N.