Patents Assigned to Iowa Thin Film Technologies, Inc
  • Method for fabricating an interconnected array of semiconductor devices
    Patent number: 5385848
    Abstract: A method of forming an array of interconnected solar cells. A flexible substrate carrying semiconductor and conductive layers is divided into individual devices by slitting the substrate along the web length. The individual devices are then connected with one another in series by laminating the substrate onto an insulating backing and by depositing conducting interconnection layers which join the lower conductor of one device with the top conductor of the adjoining device.
    Type: Grant
    Filed: September 20, 1993
    Date of Patent: January 31, 1995
    Assignee: Iowa Thin Film Technologies, Inc
    Inventor: Derrick P. Grimmer