Abstract: Embodiments of the invention provide methods and apparatuses to process optical subsystems. In one aspect, the optical subsystems are polished using an orbital polishing apparatus adapted to polish and clean an optical subsystem interconnect surface. The orbital polishing apparatus is adapted to incrementally advance a movable web of polishing material to provide polishing uniformity and consistent polishing performance device to device.

Abstract: The invention provides a method and apparatus to process and assemble optical subsystems. In one aspect, the optical subsystems are placed on a carrier apparatus adapted to support a plurality of the optical subsystems in a desired process orientation and with a desired spacing to provide high process throughput. In one aspect of the invention, optical components are assembled and sequentially processed in various steps, such as component installation, optical fiber preparation, component attachment, fiber trim, optical fiber polishing, and optical component testing to produce a finished optical subsystem.

Abstract: Embodiments of the invention provide methods and apparatuses to process optical subsystems. In one aspect, the optical subsystems are polished using an orbital polishing apparatus adapted to polish and clean an optical subsystem interconnect surface. The orbital polishing apparatus is adapted to incrementally advance a movable web of polishing material to provide polishing uniformity and consistent polishing performance device to device.

Abstract: Embodiments of the invention provide methods and apparatuses to process optical subsystems. In one aspect, the optical subsystems are polished using an orbital polishing apparatus adapted to polish and clean an optical subsystem interconnect surface. The orbital polishing apparatus is adapted to incrementally advance a movable web of polishing material to provide polishing uniformity and consistent polishing performance device to device.