Abstract: Kits and methods for building devices for analyzing or suppressing vibrations in equipment are provided. An electrical-mechanical transducer is configured to be placed in operative contact with the equipment. The transducer may be directly mounted to a base plate that is configured for being mounted to the equipment. A first device (e.g., a printed circuit board) carrying electronic componentry is configured for transmitting vibration drive signals to the electrical-mechanical transducer. A second device (e.g., a printed circuit board) carrying electronic componentry is configured for receiving vibration sensing signals from the electrical-mechanical transducer. The first and second devices can be interchangeably mounted within a housing that can be mounted to the base plate. The housing may comprise an aperture for receiving the electrical-mechanical transducer.

Abstract: A piezoelectric package comprises an upper and lower piezoelectric plates, each having opposing electrodes. The piezoelectric package further comprises an electrically insulative structure encapsulating the piezoelectric plates. The piezoelectric package further comprises first and second external connectors mounted to the insulative structure. The connectors respectively have connector terminals that are electrically coupled to the electrodes in different orders, and have geometric arrangements that are identical, such that a single interface device can be selectively mated to either of the connectors. The piezoelectric package may be incorporated into a system that comprises electronic circuitry configured for operating the piezoelectric package, and a single interface device electrically coupled between the electronic circuitry and either of the external connectors of the piezoelectric package to selectively configure the package between a unimorph and a bimorph.

Abstract: A scalable piezoelectric package comprising a plurality of piezoelectric cells, each including a piezoelectric element and an external connector electrically coupled to the piezoelectric element of the respective piezoelectric cell. The piezoelectric package further comprises at least one intercellular conductor electrically coupling the piezoelectric cells together, such that the external connector of each of the piezoelectric cells is electrically coupled to the piezoelectric plate of each of the remaining piezoelectric plates of the piezoelectric cells.

Abstract: Kits and methods for building devices for analyzing or suppressing vibrations in equipment are provided. An electrical-mechanical transducer is configured to be placed in operative contact with the equipment. The transducer may be directly mounted to a base plate that is configured for being mounted to the equipment. A first device (e.g., a printed circuit board) carrying electronic componentry is configured for transmitting vibration drive signals to the electrical-mechanical transducer. A second device (e.g., a printed circuit board) carrying electronic componentry is configured for receiving vibration sensing signals from the electrical-mechanical transducer. The first and second devices can be interchangeably mounted within a housing that can be mounted to the base plate. The housing may comprise an aperture for receiving the electrical-mechanical transducer.

Abstract: Kits and methods for building devices for analyzing or suppressing vibrations in equipment are provided. An electrical-mechanical transducer is configured to be placed in operative contact with the equipment. The transducer may be directly mounted to a base plate that is configured for being mounted to the equipment. A first device (e.g., a printed circuit board) carrying electronic componentry is configured for transmitting vibration drive signals to the electrical-mechanical transducer. A second device (e.g., a printed circuit board) carrying electronic componentry is configured for receiving vibration sensing signals from the electrical-mechanical transducer. The first and second devices can be interchangeably mounted within a housing that can be mounted to the base plate. The housing may comprise an aperture for receiving the electrical-mechanical transducer.

Abstract: A piezoelectric package comprises a piezoelectric plate having a first planar surface and a second planar surface that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer electrically coupled to the first planar surface, and a second electrically conductive layer electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (e.g., a rigid fiber composite material) encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.

Abstract: A piezoelectric package comprises a piezoelectric plate having a first planar surface and a second planar surface that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer electrically coupled to the first planar surface, and a second electrically conductive layer electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (e.g., a rigid fiber composite material) encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.

Abstract: A piezoelectric package comprises a piezoelectric plate having a first planar surface and a second planar surface that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer electrically coupled to the first planar surface, and a second electrically conductive layer electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (e.g., a rigid fiber composite material) encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.

Abstract: A method of implementing vibration suppression at equipment residing at a local site includes the steps of transmitting a prompt from a remote site to the local site, automatically sensing vibration response information from the equipment in response to the prompt, and transmitting the sensed vibration response information to the remote site. The method further includes the steps of analyzing the sensed vibration response information at the remote site and creating a vibration suppression algorithm based on the analyzed information. Another prompt is then transferred from the remote site to the local site, and in response thereto, vibrations are induced within the equipment at the local site in accordance with the vibration suppression algorithm, and additional vibration response information from the equipment is sensed.

Abstract: A method of implementing vibration suppression at equipment residing at a local site is provided. The method comprises transmitting a prompt from a remote site to the local site, automatically sensing vibration response information from the equipment in response to the prompt, and transmitting the sensed vibration response information to the remote site. The method further comprises analyzing the sensed vibration response information at the remote site, and creating a vibration suppression algorithm based on the analyzed information. Another prompt is then transmitted from the remote site to the local site, and in response thereto, vibrations are induced within the equipment at the local site in accordance with the vibration suppression algorithm, and additional vibration response information from the equipment is sensed.

Abstract: A gas spring for suppression vibrations in payloads is provided. The gas spring comprises a piston disposed within the housing. The piston is configured to be displaced relative to the housing in response to vibrations applied to the housing. The piston has first concave or convex surface and a second surface opposing the first surface. The housing is configured to allow a first gaseous medium to apply a first gas pressure to the first concave piston surface, and a second gaseous medium to apply a second gas pressure to the second piston surface, thereby resulting in a net gas pressure force applied to the piston.

Abstract: Vibration suppression systems and methods for isolating payloads from vibrational forces are provided. A gas spring has a housing and a piston disposed within the housing. The piston has opposing first and second surfaces, and the housing has a chamber adjacent the first piston surface. A payload is coupled to the piston, and net gas pressure force is applied to the piston by respectively exposing the first and second piston surfaces to first and second gas pressures. The piston is allowed to be displaced relative to the housing in response to a vibration applied to the housing, whereby the net gas pressure force is modified. The mass of a gaseous medium within the chamber is modified to equalize the net gas pressure force.

Abstract: Vibration suppression systems and methods for isolating payloads from vibrational forces are provided. A gas spring has a housing and a piston within the housing. The piston is mechanically isolated from the housing via a magneto-rheological (MR) fluid gasket. A payload is coupled to the piston, and net gas pressure force is applied to the piston by respectively exposing the first and second piston surfaces to first and second gas pressures. The piston is allowed to be displaced relative to the housing in response to a vibration applied to the housing. A magnetic field is selectively applied to the MR fluid gasket to alternately transform the properties of the MR fluid gasket between primarily viscous and primarily elastic.

Abstract: A method of implementing vibration suppression at equipment residing at a local site is provided. The method comprises transmitting a prompt from a remote site to the local site, automatically sensing vibration response information from the equipment in response to the prompt, and transmitting the sensed vibration response information to the remote site. The method further comprises analyzing the sensed vibration response information at the remote site, and creating a vibration suppression algorithm based on the analyzed information. Another prompt is then transmitted from the remote site to the local site, and in response thereto, vibrations are induced within the equipment at the local site in accordance with the vibration suppression algorithm, and additional vibration response information from the equipment is sensed.

Abstract: A vibration suppression system is provided. The system comprises an integrated master vibration actuating device configured for generating vibration suppression control signals, inducing vibrations into a structure in response to the control signals, and transmitting the control signals. The system further comprises one or more integrated slave vibration actuating devices configured for receiving the control signals from the master actuating device, and inducing vibrations into the structure in response to the received control signals. The system also comprises one or more integrated vibration sensing devices configured for sensing vibrations within the structure, generating vibration sensing signals in response to the sensed vibrations, and transmitting the vibration sensing signals to the master actuating device. The master actuating device may be configured for generating the control signals based on the vibration sensing signals.

Abstract: Kits and methods for building devices for analyzing or suppressing vibrations in equipment are provided. An electrical-mechanical transducer is configured to be placed in operative contact with the equipment. The transducer may be directly mounted to a base plate that is configured for being mounted to the equipment. A first device (e.g., a printed circuit board) carrying electronic componentry is configured for transmitting vibration drive signals to the electrical-mechanical transducer. A second device (e.g., a printed circuit board) carrying electronic componentry is configured for receiving vibration sensing signals from the electrical-mechanical transducer. The first and second devices can be interchangeably mounted within a housing that can be mounted to the base plate. The housing may comprise an aperture for receiving the electrical-mechanical transducer.