Abstract: A test probe pin is disclosed. The test probe has a plurality of probes, each of which has a probe tip surface coated with a nano-film of conducting polymer, and the thickness of the nano-film is about 1-20 nm. The probes coated with the nano-film are installed on a test fixture for testing IC components, so that the probes can efficiently provide excellent no-clean property and stabler electro-conductivity for lowering the cleaning frequency of the probes, enhancing the yield of IC component testing, increasing the utility rate of the test fixture, reducing the total testing cost, elongating the usage lifetime of the test probe, and reducing the cost of probe material. Thus, due to the nano-film of conducting polymer, the probes made of metal material can provide almost the same electro-conductivity as a traditional probe by only plating a gold layer of one fifth of original thickness, so that the cost of whole probe material can be reduced.

Abstract: A probe of a cantilever probe card (Epoxy probe card) is disclosed. The probe has a tip and a surface region extended from the tip of the probe about 5-10 mil is coated with a nano-film of high electro-conductive nanomaterial. The thickness of the nano-film is about 1-20 nm. Through the coating process, the nano-film coated on the probe of the cantilever probe card can efficiently provide the excellent advantages of no-clean, stable electro-conductivity, minimum overdrive force and longer usage lifetime for the probe of cantilever probe card. Accordingly, the yield of wafer testing can be improved and the frequency of cleaning the probe can be decreased. Furthermore, the total testing cost can be reduced.

Abstract: A probe of a vertical probe card is disclosed. The probe has a probe tip and a surface region extended from the probe tip about 1-10 mil. The surface region is coated with a nano-film of high electro-conductive nano-material, and the thickness of the nano-film is about 1-20 nm. The nano-film of the probe can efficiently provide excellent no-clean property and higher electro-conductivity for lowering contact force and elongating usage lifetime of the probe of vertical probe card. Accordingly the yield of wafer testing can be improved, the frequency of cleaning probe can be lowered, and the total testing cost can be reduced.