Abstract: The invention relates to a micro-scale cooling element (1) having a mounting surface (2) for a constituent part, in particular a semiconductor component, that is to be cooled, which element is configured, in particular, cuboidally and has in the interior a micro-scale cooling structure (3) that is connected via connecting conduits (4) to at least one inflow opening (5) and at least one outflow opening (6) through which a cooling medium is conveyable to and dischargeable from the micro-scale structure (3), the micro-scale cooling element having a monolithic structure.

Abstract: The invention relates to a micro heat sink (1) having a mounting face (2) for a part that is to be cooled, particularly a semiconductor component whose interior contains a micro cooling structure (3) which is connected by means of connecting channels (4) to at least one intake opening (4a) and at least one drain opening (4b), via which a cooling medium can be supplied to and removed from the micro cooling structure (3), which is characterized in that it is formed from at least two different kinds of, pulverulent and/or liquid, in particular metal and/or ceramic, materials or material mixtures (10) while retaining a monolithic structure. The invention also relates to an apparatus and a method for producing a micro heat sink according to the invention.