Abstract: The present invention relates to a method of manufacturing a direct and selective surface deposition by a pulsed radiation treatment. Said method allows the production of a selective pattern on any receiving material without any pre-treatment and/or post-treatment of said receiving material. The invention provides a selective deposition of a monolayer donor material onto a receiving material by means of a pulsed radiation treatment without any contact between said donor and receiving materials. It further provides a method of direct surface metallization of various types of receiving materials using a pulsed radiation treatment. The present invention provides a method of manufacturing a direct and selective surface deposition by a pulsed radiation treatment of a monolayer donor material onto a receiving material. The present invention relates more particularly to a method of manufacturing free form patterned deposition on surfaces of various receiving materials.

Abstract: The present disclosure relates to a shaping device for light rays of a laser beam that cross it, wherein the shaping device is formed by a conduit including an entry orifice, an exit orifice, and an internal wall, achieved by one or a plurality of facets adapted to reorient by at least one reflection at least a part of the rays of the crossing beam.

Abstract: The present disclosure relates to a shaping device for light rays of a laser beam that cross it, wherein the shaping device is formed by a conduit including an entry orifice, an exit orifice, and an internal wall, achieved by one or a plurality of facets adapted to reorient by at least one reflection at least a part of the rays of the crossing beam.

Abstract: A process and apparatus for the preparation and coating of the surface of a substrate by thermal projection, in which the surface of the substrate is progressively subjected to laser irradiation thereby at least partially to eliminate a superficial contaminating film on the surface of the substrate, and then there is projected by a thermal projection device a deposit material on the surface thus prepared immediately after the preparation. The surface of the substrate is subjected to successive laser and thermal projection treatments thereby to lay down on the surface a plurality of layers of deposit material. The substrate can be cylindrical, and can be rotated about its axis while continuously applying laser radiation and thermal projection thereto, with the substrate rotating in a direction such that the surface of the substrate is subjected first to laser radiation and subsequently to thermal projection. The laser is a pulsed laser.