Abstract: A movable connector with which an insertion force of a connection object that places a load on a solder portion can be reduced, that has a floating function, and that can be reduced in size is provided. As a result of a pushing operation in which an operation housing is pushed into a fixed housing, a relay terminal is conductively connected to a substrate connection terminal, which is in conductive contact with a substrate, and a pin terminal, which is disposed in a movable housing and serves as the connection object, in the movable housing. Accordingly, the overall size of the movable connector can be reduced. In addition, the insertion force applied to the pin terminal is not applied to the solder portion by which the movable connector is fixed to the substrate, so that conduction failure does not occur.