Abstract: A socket lid for a semiconductor test socket which uses a plurality of pneumatic cylinders integrated into the socket lid to facilitate the application of a controlled and variable force to multiple zones of an electronic circuit device carried by the test socket. The socket lid includes a cylinder casing with multiple independently sealed pressure chambers, each of which incorporates a plurality a pneumatic cylinders which bear against separate and independently movable compression plates that engage different areas of the electronic circuit device carried by the semiconductor test socket, thus providing an adjustably variable force to multiple zones of the electronic circuit device under test.

Abstract: A test socket for an electronic circuit device with protruding circuit contacts, the test socket including an underlying PCB substrate with an overlaying electrically insulative housing, where the PCB substrate includes an array of electrically conductive vias extending therethrough, and the housing includes an array of socket apertures which align with the PCB vias and contain resiliently compressible electrically conductive compression contacts therein that connect electrically with the conductive vias of the PBC substrate. The socket apertures each have peripheral retention flaps which engage and retain the protruding circuit contacts of the electronic circuit device in electrical engagement with the conductive compression contacts within the socket apertures during testing.

Abstract: An adapter apparatus and methods for using in providing such adapter apparatus include providing a substrate having a plurality of openings defined therethrough. A plurality of conductive elements are mounted within corresponding openings thereof using a flowable and curable laminate material.

Abstract: An adapter apparatus and method of forming the adapter apparatus includes providing a substrate with a plurality of layers. The layers include at least one socket contact holding layer that includes a plurality of holding structures positioned between a plurality of other layers. A plurality of socket contacts (e.g., each including an end connection portion and first and second deflectable element coupled thereto) are held in corresponding openings defined through the substrate at least in part by the plurality of holding structures.

Abstract: An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a socket lid assembly configured to apply a force upon a packaged device received in the socket cavity of the adapter body. A measurement apparatus associated with the socket lid assembly may include a measurement element (e.g., temperature sensing element, compressible element, etc.) that is configured to contact a packaged device received in the socket cavity when the socket lid assembly closes the socket cavity and applies a force upon the packaged device (e.g., a measurement signal is generated with use of the measurement element that is configured to contact the packaged device). An indicator may be configured to display a parameter based on the measurement signal (e.g., a count, a temperature, etc.).

Abstract: An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a torque applicator configured to apply an axial force. A bearing structure positioned between the torque applicator and a packaged device may be used to transfer a force (e.g., an axial force) applied using the torque applicator to the packaged device.

Abstract: An adapter apparatus for receiving a packaged device having a plurality of contact elements disposed on a surface thereof may include a conductive elastomer interconnect. The conductive elastomer interconnect may include a carrier having a plurality of openings defined therethrough from a first side to a second side thereof (e.g., the plurality of openings being arranged to align with the plurality of contact elements of the packaged device) and conductive elastomer suspended in each of the plurality of openings to contact a contact element of a plurality of contact elements of a packaged device when positioned adjacent the second side of the carrier. Further, the adapter apparatus may include one or more adapter wall members used with the conductive elastomer interconnect to define a socket cavity adapted to receive the packaged device.

Abstract: An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a socket lid assembly configured to apply a force upon a packaged device received in the socket cavity of the adapter body. A measurement apparatus associated with the socket lid assembly may include a measurement element (e.g., temperature sensing element, compressible element, etc.) that is configured to contact a packaged device received in the socket cavity when the socket lid assembly closes the socket cavity and applies a force upon the packaged device (e.g., a measurement signal is generated with use of the measurement element that is configured to contact the packaged device). An indicator may be configured to display a parameter based on the measurement signal (e.g., a count, a temperature, etc.).

Abstract: An adapter apparatus includes a substrate having a plurality of openings defined therethrough. Further, a deflectable element socket contact is provided in each of the openings. When a conductive male pin is positioned in contact between first and second deflectable elements of the deflectable element socket contact, at least a portion of the first and second deflectable elements are caused to deflect within first and second deflection regions, respectively, of the defined opening.

Abstract: An adapter apparatus and methods for using in providing such adapter apparatus include providing a substrate having a plurality of openings defined therethrough. A plurality of conductive elements are mounted within corresponding openings thereof using a curable material.

Abstract: An adapter apparatus includes a substrate having a plurality of openings defined therethrough. Further, a sleeve spring contact is mounted in each of the openings.

Abstract: An adapter apparatus and methods for using in providing such adapter apparatus include providing a substrate having a plurality of openings defined therethrough. A plurality of conductive elements are mounted within corresponding openings thereof using a curable material.

Abstract: An adapter apparatus includes a substrate having a plurality of openings defined therethrough. Further, a sleeve spring contact is mounted in each of the openings.

Abstract: An adapter apparatus and method includes using an adapter body that includes a threaded opening. A torque indicating assembly is used in applying a force upon a packaged device received in a cavity of the adapter body. The torque indicating assembly includes a threaded interface member and a torque indicator.

Abstract: An adapter apparatus and methods for using in providing such adapter apparatus include providing a high density interconnect board (e.g., having a pattern of contact pads on a first side thereof corresponding to a packaged device, such as a micro lead frame package) and providing an interconnect device. Interconnect elements extend through a substrate of the interconnect device and are electrically connected to conductive pads on a second side of the high density interconnect board.

Abstract: An adapter apparatus and method includes using an adapter body that includes a threaded opening. A torque indicating assembly is used in applying a force upon a packaged device received in a cavity of the adapter body. The torque indicating assembly includes a threaded interface member and a torque indicator.

Abstract: An adapter apparatus and method includes using an adapter body that includes a threaded opening. A torque limiting assembly is used in applying a force upon a packaged device received in a cavity of the adapter body. The torque limiting assembly includes a shaft, a threaded interface member including a threaded portion configured to mate with the threaded opening of the adapter body, one or more engagement elements, and a torque control apparatus used to selectively engage the threaded interface member and the shaft in a first state and allow movement between the threaded interface member and the shaft in a second state.

Abstract: An adapter apparatus and methods for using in providing such adapter apparatus include providing a substrate having a plurality of openings defined therethrough. A plurality of conductive elements are mounted within corresponding openings thereof using a curable material.

Abstract: A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.

Abstract: A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.