Patents Assigned to ISC Technology Co., Ltd.
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Patent number: 8334595Abstract: A silicon contactor of which a side contacts test terminals of a semiconductor testing device and of which an other side contacts ball leads of a semiconductor device so as to be used in the semiconductor testing device, including: conductive silicon parts which are formed opposite to the ball leads and/or the test terminals and include silicon rubber and conductive powders; and an insulating silicon part which is formed by filling silicon rubber among areas of the conductive silicon parts, which do not contact the ball leads, and supports the conductive silicon parts, wherein the conductive powders of the conductive silicon parts include plate type powders. Therefore, the plate type powders are used as the conductive powders of the conductive silicon parts to improve contact characteristics between the conductive silicon parts and the semiconductor device.Type: GrantFiled: April 7, 2009Date of Patent: December 18, 2012Assignee: ISC Technology Co., Ltd.Inventor: Young Seok Jung
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Publication number: 20120200024Abstract: An insert for a handler which may be easily replaced when damaged because a semiconductor device is often received in the insert. The insert in which the semiconductor device including a plurality of terminals is received and which allows the semiconductor device to contact an external contactor includes: an insert body that has a through-hole which is formed in a central portion of the insert body and into which the semiconductor device is to be inserted; and a support member that crosses the through-hole to be detachably coupled to the insert body and supports the semiconductor device inserted into the through-hole, wherein a plurality of communication holes are formed to correspond in position to the terminals of the semiconductor device and to pass through the support member from a top surface to a bottom surface of the support member such that the terminals and the external contactor are brought into contact with each other.Type: ApplicationFiled: June 24, 2010Publication date: August 9, 2012Applicant: ISC TECHNOLOGY CO., LTD.Inventor: Jae Hak Lee
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Publication number: 20120127713Abstract: An outdoor lamp. The outdoor lamp includes: a plurality of frame members rotatably connected to each other by hinge members so as to change relative rotation angles; optical source modules each comprising an optical source for emitting light, each of the optical source modules installed attachably to and detachably from the frame members; and rotation restriction units each combined to the frame members to restrict the relative rotation angles of the frame members so as for the frame members to be fixed at desired angles. According to the outdoor lamp, the optical source modules are installed to the rotatable frame members so that optical angles may be easily controlled according to an installation condition for the lamp.Type: ApplicationFiled: July 6, 2010Publication date: May 24, 2012Applicant: ISC TECHNOLOGY CO., LTD.Inventor: Jae Hak Lee
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Publication number: 20110272803Abstract: A silicon contactor of which a side contacts test terminals of a semiconductor testing device and of which an other side contacts ball leads of a semiconductor device so as to be used in the semiconductor testing device, including: conductive silicon parts which are formed opposite to the ball leads and/or the test terminals and include silicon rubber and conductive powders; and an insulating silicon part which is formed by filling silicon rubber among areas of the conductive silicon parts, which do not contact the ball leads, and supports the conductive silicon parts, wherein the conductive powders of the conductive silicon parts include plate type powders. Therefore, the plate type powders are used as the conductive powders of the conductive silicon parts to improve contact characteristics between the conductive silicon parts and the semiconductor device.Type: ApplicationFiled: April 7, 2009Publication date: November 10, 2011Applicant: ISC TECHNOLOGY CO., LTD.Inventor: Young Seok Jung
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Patent number: 7438563Abstract: In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.Type: GrantFiled: December 5, 2005Date of Patent: October 21, 2008Assignees: Samsung Electronics Co., Ltd., ISC Technology Co., Ltd.Inventors: Young-Bae Chung, Hyun-Seop Shim, Jeong-Ho Bang, Jae-Il Lee, Hyun-Kyo Seo, Young-Soo An, Soon-Geol Hwang
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Publication number: 20080180124Abstract: Provided is a cooling apparatus for a semiconductor device. The apparatus includes: a main body capable of moving vertically to face the semiconductor device that is mounted on a test unit in order to perform an electrical test; a heat exchange unit combined with the main body and contacting a top surface of the semiconductor device to absorb heat generated by the semiconductor device; and a lift unit combined with the main body and for moving the main body vertically. The heat exchange unit is combined with the main body to be capable of rotating according to an angle by which the semiconductor device is tilted when the heat exchange unit contacts the semiconductor device.Type: ApplicationFiled: January 25, 2008Publication date: July 31, 2008Applicant: ISC TECHNOLOGY CO., LTD.Inventor: Young Bae Chung