Abstract: A copper or copper alloy electroplating bath has two or more electrolytes. The two or more electrolytes include at least one selected from nitric acid and a nitrate. The two or more electrolytes can form electrodeposits, such as a group of high-aspect bump electrodes, that have a uniform height or thickness at high speed.

Abstract: An electrodeposit formed by using a tin or tin alloy plating bath containing a prescribed branched polyoxyalkylene compound, such as an alkylene oxide adduct of aliphatic monoamine or polyamine in which a plurality of oxyalkylene chains are bonded to a nitrogen atom of an amine structure in a molecule, or an alkylene oxide adduct of glycerin or polyglycerin in which oxyalkylene chains are respectively bonded to a plurality of oxygen atoms of an alcohol structure in a molecule, suppresses formation defect such as abnormal growth of the electrodeposit. The electrodeposit also improves yield from the viewpoint of quality control.

Abstract: A structure containing a Sn layer or a Sn alloy layer includes a substrate, a Sn layer or Sn alloy layer formed above the substrate, and an under barrier metal formed between the substrate and the Sn layer or Sn alloy layer in the form of a single metal layer containing any one of Fe, Co, Ru and Pd, or an alloy layer containing two or more of Fe, Co, Ru and Pd.

Abstract: An electrodeposit formed by using a tin or tin alloy plating bath containing a prescribed branched polyoxyalkylene compound, such as an alkylene oxide adduct of aliphatic monoamine or polyamine in which a plurality of oxyalkylene chains are bonded to a nitrogen atom of an amine structure in a molecule, or an alkylene oxide adduct of glycerin or polyglycerin in which oxyalkylene chains are respectively bonded to a plurality of oxygen atoms of an alcohol structure in a molecule, suppresses formation defect such as abnormal growth of the electrodeposit. The electrodeposit also improves yield from the viewpoint of quality control.

Abstract: A Ta—Nb alloy powder which provides a capacitor having a higher capacitance than a Ta capacitor and a better thermal stability in terms of an oxide film than a Nb capacitor, the Ta—Nb alloy powder being a Ta—Nb alloy powder produced by a thermal CVD method, wherein a content of Nb is 1 to 50 mass %, and an average particle diameter of primary particles is 30 to 200 nm, preferably, a CV value per unit mass of the powder (?F·V/g) is 250 k?F·V/g or more, or further, a CV value per unit volume (?F·V/mm3) in terms of a molded body whose molding density ? (g/cm3) is ?c (g/cm3)=?0.012RNb+3.57, wherein RNb:Nb content (mass %) in an alloy, is 900 ?F·V/mm3 or more, and an anode element for a solid electrolytic capacitor using the alloy powder.

Abstract: Forming a conductive film comprising depositing a non-conductive film on a surface of a substrate, wherein the film contains a plurality of copper nanoparticles and exposing at least a portion of the film to light to make the exposed portion conductive. Exposing of the film to light photosinters or fuses the copper nanoparticles.

Abstract: In order to manufacture an alloy bump, a resist pattern having openings which expose a substrate is formed on the substrate, an under-bump metal is formed on the substrate inside the openings, a first plating film is formed on the under-bump metal by electroplating, a second plating film containing no metal components which are contained in the first plating film is formed on the first plating film by electroplating, the resist pattern is removed, and the alloy bump is formed by heat treating the substrate to thereby alloy the first plating film and the second plating film.

Abstract: In a conductive film forming method using photo sintering, a conductive film having low electric resistance is easily formed. Disclosed is a conductive film forming method in which a conductive film is formed using a photo sintering, which includes the steps of: forming a liquid film made of a copper particulate dispersion on a substrate, drying the liquid film to form a copper particulate layer, subjecting the copper particulate layer to photo sintering to form a conductive film, attaching a sintering promoter to the conductive film, and further subjecting the conductive film having the sintering promoter attached to photo sintering. The sintering promoter is a compound which removes copper oxide from metallic copper. Thereby, the sintering promoter removes a surface oxide film of copper particulates in the conductive film.

Abstract: A Ta-Nb alloy powder which has provides a capacitor having a higher capacitance than a Ta capacitor and a better thermal stability in terms of an oxide film is better than a Nb capacitor, the Ta-Nb alloy powder being a Ta-Nb alloy powder produced by a thermal CVD method, wherein a content of Nb is 1 to 50 mass %, and an average particle diameter of primary particles is 30 to 200 nm, preferably, a CV value per unit mass of the powder (?F·V/g) is 250 k?F·V/g or more, or further, a CV value per unit volume (?F·V/mm3) in terms of a molded body whose molding density ? (g/cm3) is ?c (g/cm3)=?0.012RNb+3.57, wherein RNb: Nb content (mass %) in an alloy, is 900 ?F·V/mm3 or more, and an anode element for a solid electrolytic capacitor using the alloy powder.

Abstract: A solution of metal ink is mixed and then printed or dispensed onto the substrate using the dispenser. The film then is dried to eliminate water or solvents. In some cases, a thermal curing step can be introduced subsequent to dispensing the film and prior to the photo-curing step. The substrate and deposited film can be cured using an oven or by placing the substrate on the surface of a heater, such as a hot plate. Following the drying and/or thermal curing step, a laser beam or focused light from the light source is directed onto the surface of the film in a process known as direct writing. The light serves to photo-cure the film such that it has low resistivity.

Abstract: The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle. The dispersant is a compound having at least one acidic functional group, which has a molecular weight of 200 or more and 100,000 or less, or a salt thereof. Whereby, the dispersant has compatibility with dispersion vehicle and a surface of copper particulates is coated with dispersant molecules, and thus the copper particulates are dispersed in the dispersion vehicle.

Abstract: To provide copper particulate dispersion capable of forming a conductive film having favorable adhesiveness on an inorganic substrate by photo-sintering. The copper particulate dispersion includes a dispersion vehicle and copper particulates RUM The copper particulates are dispersed into the dispersion vehicle. The copper particulate dispersion includes an adhesion improvement agent for improving adhesiveness between a conductive film formed on a substrate by photo-sintering the copper particulate and the substrate. The substrate is an inorganic substrate. The adhesion improvement agent is a compound containing a phosphorus atom. Thus, the adhesion improvement agent improves adhesiveness between the conductive film and the inorganic substrate.

Abstract: Provided is a copper particulate dispersion that can facilitate the formation of a conductive film with low electric resistance by photo-sintering. A copper particulate dispersion includes a dispersion vehicle and copper particulates dispersed in the dispersion vehicle. The copper particulate dispersion contains a sintering promoter. The sintering promoter is a compound that removes copper oxide from copper at a temperature higher than ambient temperature. The sintering promoter thereby removes surface oxide coatings from the copper particulates during the photo-sintering of the copper particulates.

Abstract: A layer of material having a low thermal conductivity is coated over a substrate. A film of conductive ink is then coated over the layer of material having the low thermal conductivity, and then sintered. The film of conductive ink does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

Abstract: An object is to provide a copper particulate dispersion which is suited to discharge in the form of droplets. The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle having a boiling point within a range from 150° C. to 250° C. Whereby, when the copper particulate dispersion is discharged in the form of droplets, clogging at the discharge portion caused by drying of the dispersion vehicle is prevented and the viscosity is low for its high boiling point, and thus the copper particulate dispersion is suited to discharge in the form of droplets.

Abstract: In a conductive film formed by photo sintering of a film composed of copper particulates, adhesiveness to a base material of the conductive film is improved. A circuit board includes a circuit including a conductive film, and a substrate. The circuit board further includes a resin layer between the substrate and the conductive film. The substrate is made of a non-thermoplastic base material. The resin layer contains a thermoplastic resin. The conductive film is formed by photo sintering of a film composed of copper particulates, and thus improving adhesiveness of the conductive film to the base material through the resin layer.

Abstract: An object is to provide the formulation of a copper particulate dispersion in which copper particulates are dispersed. The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle. The dispersant is a compound having at least one acidic functional group, which has a molecular weight of 200 or more and 100,000 or less, or a salt thereof. Whereby, the dispersant has compatibility with dispersion vehicle and a surface of copper particulates is coated with dispersant molecules, and thus the copper particulates are dispersed in the dispersion vehicle.

Abstract: An object is to provide a copper particulate dispersion which is suited to discharge in the form of droplets. The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle having a boiling point within a range from 150° C. to 250° C. Whereby, when the copper particulate dispersion is discharged in the form of droplets, clogging at the discharge portion caused by drying of the dispersion vehicle is prevented and the viscosity is low for its high boiling point, and thus the copper particulate dispersion is suited to discharge in the form of droplets.

Abstract: An object is to provide a conductive film forming method which can form a conductive film having low electric resistance on a base material by utilizing photo sintering even when the base material has low heat resistance. A conductive film forming method is a method in which a conductive film is formed on a base material, and the method includes the steps of forming a film composed of copper particulates on a base material, subjecting the film to photo sintering, and applying plating to the photo-sintered film. Whereby, it is possible to form a conductive film on a base material by lowering irradiation energy of light in photo sintering even when the base material has low heat resistance. Since the conductive film includes a plated layer, electric resistance decreases.

Abstract: Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.