Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed by the second conveying device 43 along the direction of length and are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed [into the second cutting device 33] by the second conveying device 43 along the direction of length. [The cut wiring boards 3a] are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted.

Abstract: ICs with leadframes can be efficiently transferred, stocked and positioned without the need for preparing jigs for each kind of IC.A cassette 4 accommodating a stack of ICs is inserted into a cassette space 35 and held in the center thereof. A moving table 9 is driven to move by a servomotor 21. A lifting member 67 of an IC lifting mechanism 60 raises the ICs in the cassette 4 from the bottom by an amount corresponding to the thickness of one IC at a time. A pulling-over device 70, which is disposed above the cassette space 35, centers the IC in both the lateral and longitudinal directions to thereby effect positioning.