Patents Assigned to ISHIKAWA TECHNOLOGY LABORATORY CO., LTD.

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC COMPONENT

Publication number: 20240002979

Abstract: A solder product 20 includes: a lead-free solder part 21 containing tin as a main component and a metal element other than lead as a secondary component; and a carboxylic acid having 10 to 20 carbons, the carboxylic acid being mainly distributed over the surface of the solder product 20 to form a surface layer 22. The carboxylic acid is preferably a fatty acid having 12 to 16 carbons, and more preferably a palmitic acid.

Type: Application

Filed: September 18, 2023

Publication date: January 4, 2024

Applicants: ISHIKAWA TECHNOLOGY LABORATORY CO., LTD., KAYABA OFFICE CO., LTD.

Inventors: Hisao ISHIKAWA, Masao KAYABA, Akira OGIHARA
Method for manufacturing solder product, solder, soldered component, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin intermediate product, and conductive member

Patent number: 11802322

Abstract: A solder product 20 includes: a lead-free solder part 21 containing tin as a main component and a metal element other than lead as a secondary component; and a carboxylic acid having 10 to 20 carbons, the carboxylic acid being mainly distributed over the surface of the solder product 20 to form a surface layer 22. The carboxylic acid is preferably a fatty acid having 12 to 16 carbons, and more preferably a palmitic acid.

Type: Grant

Filed: October 7, 2021

Date of Patent: October 31, 2023

Assignees: ISHIKAWA TECHNOLOGY LABORATORY CO., LTD., KAYABA OFFICE CO., LTD.

Inventors: Hisao Ishikawa, Masao Kayaba, Akira Ogihara
METHOD FOR MANUFACTURING SOLDER PRODUCT, SOLDER, SOLDERED COMPONENT, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, WIRE, SOLDERED PRODUCT, FLEXIBLE PRINTED BOARD, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING TIN ARTICLE, METHOD FOR MANUFACTURING TIN INTERMEDIATE PRODUCT, TIN INTERMEDIATE PRODUCT, AND CONDUCTIVE MEMBER

Publication number: 20220025484

Abstract: A solder product 20 includes: a lead-free solder part 21 containing tin as a main component and a metal element other than lead as a secondary component; and a carboxylic acid having 10 to 20 carbons, the carboxylic acid being mainly distributed over the surface of the solder product 20 to form a surface layer 22. The carboxylic acid is preferably a fatty acid having 12 to 16 carbons, and more preferably a palmitic acid.

Type: Application

Filed: October 7, 2021

Publication date: January 27, 2022

Applicants: ISHIKAWA TECHNOLOGY LABORATORY CO., LTD., KAYABA OFFICE CO., LTD.

Inventors: Hisao ISHIKAWA, Masao KAYABA, Akira OGIHARA

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC COMPONENT