Patents Assigned to Ishizuka Electronics Corporation
  • Publication number: 20030123517
    Abstract: A non-contact temperature sensor includes a holder 10 having a cavity 12 with a light conducting portion 11 for conducting the infrared ray incident from an opening 10a at the one end and a closed-end cavity 13 with the one end closed which is arranged adjacently to the cavity 12; a resin film 20 arranged on the side of an opening 10b at the other end of the light conducting portion 11 of the holder 10 and an opening 10c of the closed end cavity 13; a space 50a formed behind the resin film 20; an infrared ray detecting heat-sensitive element 30a arranged on the resin film 20 located at the opening at the other end of the light conducting portion 11; a temperature compensating heat-sensitive element 30b arranged on the resin film 20 located at the opening 10c of the closed end cavity 13; and a cover member 50 for sealing the resin film 20 and forming the space 50a.
    Type: Application
    Filed: December 27, 2002
    Publication date: July 3, 2003
    Applicant: ISHIZUKA ELECTRONICS CORPORATION
    Inventor: Toshiyuki Nojiri
  • Publication number: 20030062984
    Abstract: In a thin film thermistor with a cutting portion of a metallic pattern for resistance adjustment, initially, the resistance is roughly adjusted by adjusting the film thickness of a second heat-sensitive film, and secondly finely adjusted by trimming the cutting portion by laser irradiation. Thus, the thin film thermistor with a resistance adjusted accurately can be produced.
    Type: Application
    Filed: September 26, 2002
    Publication date: April 3, 2003
    Applicant: Ishizuka Electronics Corporation
    Inventors: Kenji Ito, Yasutaka Tanaka, Tadashi Toyoda, Shouichi Tamura
  • Patent number: 6367972
    Abstract: A non-contact temperature sensor includes a holder serving as a light conducting portion for guiding infrared rays incident from a first opening at its one end; a plastic film arranged at a second opening of the other end of tile light conducting portion; a cover for sealing the second opening at the other end of the holder so as to provide a space between itself and the plastic film, an infrared ray detection heat-sensitive element arranged on the side of the space of the plastic film, for detecting the infrared rays incident from the first opening; and a temperature compensating heat-sensitive means arranged in the vicinity of the holder, for detecting the temperature of the holder. In this configuration, the surface temperature of the body-to-be-detected can be precisely detected in a short time.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: April 9, 2002
    Assignee: Ishizuka Electronics Corporation
    Inventors: Jun Kamiyama, Shinichi Saito, Toshiyuki Nojiri, Kenichi Hiroe, Toshikazu Okada
  • Patent number: 6348650
    Abstract: An improved thermopile infrared sensor is provided wherein thermoelectric elements are formed on a single crystalline silicon substrate containing a cavity therein. The thermopile infrared sensor contains a first dielectric film covering the cavity, a plurality of n-type polycrystalline silicon layers formed on the first dielectric film, extending radially from the vicinity of a chip center, and metal film layers formed in contact with the n-type polycrystalline silicon layers, wherein hot junctions are formed at the chip central side and cold junctions are formed at the chip peripheral side of the n-type polycrystalline silicon layers, respectively, by contacting the n-type polycrystalline silicon layer and the metal film layer, and at least one series of thermoelectric elements is formed on the first dielectric film by connecting alternately and successively, by the metal film layer, the hot junction and cold junction of the neighboring n-type polycrystalline silicon layer.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: February 19, 2002
    Assignee: Ishizuka Electronics Corporation
    Inventors: Haruyuki Endo, Takeshi Fuse, Tadashi Matsudate, Yasutaka Tanaka, Toshikazu Okada
  • Patent number: 6092925
    Abstract: A frost deposition detecting device is provided. This frost deposition detecting device comprises: a base member 1; a heat-conductive container 4 including a frosting portion provided to the base member 1; a thermally sensitive element 6' for detecting the temperature of the base member 1; a protection pipe 8 inserted into the base member 1 and disposed in the cavity formed inside the heat-conductive container; a heat insulator integrally formed with the protection pipe 8 to reduce heat conduction to the protection pipe 8; and another thermally sensitive element 6 secured in the protection pipe 8. With such frost deposition detecting device, highly accurate frost detecting performance and excellent durability in terms of water resistance and humidity resistance can be achieved.
    Type: Grant
    Filed: August 6, 1998
    Date of Patent: July 25, 2000
    Assignee: Ishizuka Electronics Corporation
    Inventor: Toshiyuki Nojiri
  • Patent number: 6038872
    Abstract: A frost detecting device including a frost detector which detects the amount of frost from the temperature difference between a detecting thermal sensitive element and a compensating thermal sensitive element is provided. The frost detecting device includes: a frost detector 1 made up of a detecting thermal sensitive element and a compensating thermal sensitive element; an amplifier circuit 2 for amplifying an output signal from the frost detector 1; a comparator circuit 3 for comparing an output voltage from the amplifier circuit 2 with a set level; an operation detecting circuit 5 for detecting operating conditions of a compressor and a cooling fan 4; and a judging circuit 6 for detecting the amount of frost in accordance with output voltages from the operation detecting circuit 5 and the comparator circuit 3. The output from the comparator circuit 3 is used to detect the amount of frost only when the compressor and the cooling fan 4 are both in operation.
    Type: Grant
    Filed: June 12, 1998
    Date of Patent: March 21, 2000
    Assignee: Ishizuka Electronics Corporation
    Inventors: Toshiyuki Nojiri, Shinichi Saito
  • Patent number: 5962854
    Abstract: A chip-shaped infrared sensor comprising a substrate formed with a cavity, an infrared radiation receiving portion supported in the form of a micro air bridge in the cavity by four hook-shaped beam portions extending from the substrate, two thermistor films for infrared radiation detection formed on the infrared radiation receiving portion, two thermistor films for temperature compensation arranged on the substrate, and a single thermistor film arranged on the substrate for detecting temperature of the substrate.
    Type: Grant
    Filed: June 12, 1997
    Date of Patent: October 5, 1999
    Assignee: Ishizuka Electronics Corporation
    Inventor: Haruyuki Endo
  • Patent number: 5798684
    Abstract: A thin-film temperature sensor with a robust bridge structure and a stable electric characteristic, as well as a method of manufacture thereof, is provided. Over the substrate 1 with the cavity 13 are formed electrode layers 6 in a bridge shape, whose electrodes 6A, 6B are bonded with thermal sensitive resistor films 7, 8, which are then covered with a protective insulating film 9, a buffer film 10 and a glass layer 11 in that order. The protective insulating film 9 and the glass layer 11 extend over the substrate 1 to increase the mechanical strength of the infrared sensitive element A. The sandwich structure of the insulating films 5, 9 holding the thermal sensitive resistor films 7, 8 in between and the use of the buffer film 10 combine to prevent electrical characteristic variations, which would otherwise be caused by changes in composition of the thermal sensitive resistor films 7, 8 during the heat treatment process.
    Type: Grant
    Filed: March 28, 1996
    Date of Patent: August 25, 1998
    Assignee: Ishizuka Electronics Corporation
    Inventors: Haruyuki Endo, Takeshi Fuse, Hiroyuki Ishida
  • Patent number: 5693942
    Abstract: An infrared detector has a sensor with an infrared detecting portion composed of a thermal sensitive resistor film on an insulating film provided on a surface of a semiconductor substrate. The sensor is installed on a base such that it bridges a cavity in the substrate. The cavity is sealed by an infrared reflecting film or an infrared reflecting metallic board.
    Type: Grant
    Filed: April 3, 1996
    Date of Patent: December 2, 1997
    Assignee: Ishizuka Electronics Corporation
    Inventors: Haruyuki Endo, Takeshi Fuse, Hiroyuki Ishida
  • Patent number: 5522232
    Abstract: A frost detecting device for detecting adhesion of the frost, a slit-like opening is formed on the inside of a container with a hollow portion, a thermally sensitive element such as a thermistor is arranged on the inside of the hollow portion, leads of the thermally sensitive element are mounting to exterior through a penetrating hole provided for a metallic plate, the leads are fixed to the metallic plate, the slit-like opening is blocked by adhesion of the frost. An inside of the container is interrupted from ambient atmosphere, a temperature on the inside of the container drops, a quantity of adhesion of the frost can be detected by detecting difference in temperature between non frost state and adhesion of the frost state. Further two containers are provided.
    Type: Grant
    Filed: April 25, 1995
    Date of Patent: June 4, 1996
    Assignee: Ishizuka Electronics Corporation
    Inventor: Toshiyuki Nojiri