Abstract: Manufacturing lines include inspection systems for monitoring the quality of parts produced. Manufacturing lines for making semiconductor devices generally inspect each fabricated part. The information obtained is used to fix manufacturing problems in the semiconductor fab plant. A machine-vision system for inspecting devices includes a light source for propagating light to the device and an image detector that receives light from the device. Also included is a light sensor assembly for receiving a portion of the light from the light source. The light sensor assembly produces an output signal responsive to the intensity of the light received at the light sensor assembly. A controller controls the amount of light received by the image detector to a desired intensity range in response to the output from the light sensor. The image detector may include an array of imaging pixels.

Abstract: A method and system are provided including an optical head which moves relative to an object at a vision station to scan a projected pattern of imagable electromagnetic radiation across the surface of an object to be inspected at a relatively constant linear rate to generate an imagable electromagnetic radiation signal. In one embodiment, the electromagnetic radiation is light to develop dimensional information associated with the object. The optical head includes at least one projector which projects a grid of lines and an imaging subsystem which includes a trilinear array camera as a detector. The camera and the at least one projector are maintained in fixed relation to each other. Three linear detector elements of the array camera extend in a direction parallel with the grid of lines. The geometry of the optical head is arranged in such a way that each linear detector element picks up a different phase in the grid pattern.