Patents Assigned to Isola USA Corp.
  • SMA resin formulation
    Patent number: 11891475
    Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: February 6, 2024
    Assignee: Isola USA Corp.
    Inventors: Edward Kelley, Teck Kai Wong, Rebekah F. Theisen, Christopher G. Clark, Jr.
  • Prepregs and laminates having a UV curable resin layer
    Patent number: 11558962
    Abstract: Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: January 17, 2023
    Assignee: ISOLA USA CORP.
    Inventor: Roland Schönholz
  • SMA resin formulation
    Patent number: 11365282
    Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: June 21, 2022
    Assignee: Isola USA Corp.
    Inventors: Edward Kelley, Teck Kai Wong, Rebekah F. Theisen, Christopher G. Clark, Jr.
  • High Tg epoxy formulation with good thermal properties
    Patent number: 11155687
    Abstract: Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: October 26, 2021
    Assignee: Isola USA Corp.
    Inventors: David Bedner, Tarun Amla
  • Prepregs and laminates having a UV curable resin layer
    Patent number: 10631412
    Abstract: Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: April 21, 2020
    Assignee: ISOLA USA CORP.
    Inventor: Roland Schönholz
  • Prepregs and laminates having homogeneous dielectric properties
    Patent number: 10582614
    Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: March 3, 2020
    Assignee: ISOLA USA CORP.
    Inventors: Tarun Amla, Johann R. Schumacher, Sascha Kreuer, Peggy Conn, Stanley E. Wilson
  • High Tg epoxy formulation with good thermal properties
    Patent number: 10364332
    Abstract: Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: July 30, 2019
    Assignee: ISOLA USA CORP.
    Inventors: David Bedner, Tarun Amla
  • Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs
    Patent number: 10307989
    Abstract: Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: June 4, 2019
    Assignee: Isola USA Corp.
    Inventor: Roland Schönholz
  • Prepregs and laminates having homogeneous dielectric properties
    Patent number: 10070518
    Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: September 4, 2018
    Assignee: Isola USA Corp.
    Inventors: Tarun Amla, Johann R. Schumacher, Sascha Kreuer, Peggy Conn, Stanley E. Wilson
  • High Tg epoxy formulation with good thermal properties
    Patent number: 9822227
    Abstract: Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: November 21, 2017
    Assignee: Isola USA Corp.
    Inventors: David Bedner, Tarun Amla
  • Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs
    Patent number: 9764532
    Abstract: Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: September 19, 2017
    Assignee: Isola USA Corp.
    Inventor: Roland Schönholz
  • Prepregs and laminates having a UV curable resin layer
    Patent number: 9579868
    Abstract: Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: February 28, 2017
    Assignee: ISOLA USA CORP.
    Inventor: Roland Schönholz
  • Synthesized resins and varnishes and prepegs and laminates made therefrom
    Patent number: 8871870
    Abstract: Synthesized base resin compositions that include a raw resin and a maleimide and/or bismaleimide monomer as well as compounded varnishes that include a raw resin or synthesized base resin as well as a monomer, flame retardant and initiator as well as prepregs and laminates made using the synthesized base resin and compounded varnishes.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: October 28, 2014
    Assignee: Isola USA Corp.
    Inventors: Guroen He, Tarun Amla, Larry D. Olson, Peggy Conn
  • Ultrathin Laminates
    Publication number: 20140231007
    Abstract: Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils.
    Type: Application
    Filed: March 4, 2014
    Publication date: August 21, 2014
    Applicant: Isola USA Corp.
    Inventors: Johann R. Schumacher, Steven M. Schultz, Stanley E. Wilson, Tarun Amla
  • Prepregs and Laminates Having Homogeneous Dielectric Properties
    Publication number: 20140220844
    Abstract: Resin compositions including one or more base resins and one or more high dielectric constant materials wherein the one or more high dielectric constant materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured Dk that matches the Dk of the reinforcing material to which the resin composition is to be applied to within plus or minus (±) 15% as well as prepregs and laminates made using the resin compositions.
    Type: Application
    Filed: March 14, 2013
    Publication date: August 7, 2014
    Applicant: ISOLA USA CORP.
    Inventors: Tarun Amla, Johann R. Schumacher, Sascha Kreuer, Peggy Conn, Stanley E. Wilson
  • Flame retardant compositions with a phosphorated compound
    Patent number: 8697864
    Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a halogen-free or substantially halogen-free epoxide and one or more phosphorated compounds. In some examples, the phosphorated compound comprises an average particle size less than 10 microns. In other examples, the phosphorated compound provides a surface area of 78.5 ?m2 to about 1965 ?m2. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: April 15, 2014
    Assignee: Isola USA Corp.
    Inventors: David Bedner, William D. Varnell
  • Synthesized Resins and Varnishes and Prepegs and Laminates Made Therefrom
    Publication number: 20140024278
    Abstract: Synthesized base resin compositions that include a raw resin and a maleimide and/or bismaleimide monomer as well as compounded varnishes that include a raw resin or synthesized base resin as well as a monomer, flame retardant and initiator as well as prepregs and laminates made using the synthesized base resin and compounded varnishes.
    Type: Application
    Filed: March 15, 2013
    Publication date: January 23, 2014
    Applicant: ISOLA USA CORP.
    Inventor: ISOLA USA CORP.
  • Synthesized Resins and Varnishes and Prepegs and Laminates Made Therefrom
    Publication number: 20140011962
    Abstract: Synthesized base resin compositions that include a raw resin and a maleimide and/or bismaleimide monomer as well as compounded varnishes that include a raw resin or synthesized base resin as well as a monomer, flame retardant and initiator as well as prepregs and laminates made using the synthesized base resin and compounded varnishes.
    Type: Application
    Filed: March 15, 2013
    Publication date: January 9, 2014
    Applicant: ISOLA USA CORP.
    Inventor: ISOLA USA CORP.
  • Copolymer of Styrene and Maleic Anhydride Comprising an Epoxy Resin Composition and Co-Cross-Linking Agent
    Publication number: 20130230727
    Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards including an epoxy resin a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.
    Type: Application
    Filed: September 28, 2012
    Publication date: September 5, 2013
    Applicant: ISOLA USA CORP.
    Inventors: Franz Tikart, Karl-Heinz Leis, Karl Walter Kopp
  • Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent
    Patent number: 8313836
    Abstract: Laminates for printed wiring boards for the making of laminates for printed wiring boards having an impregnant including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: November 20, 2012
    Assignee: Isola USA Corp.
    Inventors: Franz Tikart, Karl-Heinz Leis, Karl Walter Kopp