Abstract: A multi-path feed-thru lead is disclosed that provides increased conductive pathway density and that has particular utility in combination with microcircuit packages housing hybrid and semiconductor discrete and integrated circuit chips. The multi-path feed-thru leads have a configuration that facilitates sealing thereof in the apertures of microcircuit packages to provide increased conductive path density. The multi-path feed-thru lead according to the present invention includes an insulative substrate having a predetermined geometric configuration and includes an extended intermediate portion and first and second end portions configured to define a plurality of bonding pads that facilitate wire bonding to the circuitry housed in the package and to external circuitry, respectively. A plurality of discrete metalized conductive pathways are formed on the intermediate portion ad first and second end portions of the insulative substrate.

Abstract: A method is disclosed for easy and inexpensive fabrication of fold-up frames having diverse geometric configurations for flat packs (metal packages) for housing discrete and integrated circuit chips. The method includes a first step of cutting a piece of flat metallic stock to predetermined length and width consistent with the number of fold-up frames and the perimeter required for the specific fold-up frame configuration to be fabricated, respectively. The flat stock is then milled to form a plurality of grooves of predetermined angle lengthwise in at least one major surface thereof to define the number of sidewall members in the final configuration of the fold-up frame. The milled flat stock may then be sliced to form a plurality of individual milled frames each having the predetermined height required by the specific configuration fold-up frame. Apertures are formed in the milled frame by punching or piercing all sidewall members simultaneously in a single operation.

Abstract: A duplex glass preform for forming hermetic glass-to-metal seals of the compression type. The duplex glass preform comprises a glass infrasturcture or matrix having at least one end thereof modified by the selective distribution therein of ceramic particles. The ceramic particles are selectively distributed to form a ceramic density gradient having the largest concentration of ceramic particles at the surface and gradually decreasing with depth. The duplex glass preform of the present invention has utility in forming glass-to-metal compression seals in hybrid metal packages containing microcircuit chips. The duplex glass preform may be used in the normal insulative fashion or as a conductive member.

Abstract: A duplex glass preform for forming hermetic glass-to-metal seals. The duplex glass preform comprises a glass infrastructure or matrix having at least one end thereof modified by the selective distribution therein of ceramic particles. The ceramic particles are selectively distributed to form a ceramic density gradient having the largest concentration of ceramic particles at the surface and gradually decreasing with depth. The duplex glass preform of the present invention has utility in forming glass-to-metal seals in hybrid metal packages containing microcircuit chips.

Abstract: An offset weld ring is brazed or soldered to the top surface of a flat pack frame to provide an offset weld surface for the welding of a lid to the package in which the heat applied during the welding process is moved away from the glass feedthroughs in the package, thereby permitting closer spacing of the lid to the glass feedthrough for minimizing overall package height and obtaining a low profile package.

Abstract: An all-metal microwave chip carrier is provided with subminiature ceramic feedthroughs, each configured to function as a coaxial cable having a predetermined impedance. In one embodiment, the feedthroughs are formed by providing ceramic tubing metallized inside and out in which the ends are cut away to provide half-cylindrical bonding pads. In order to permit bonding directly to the feedthrough, a flat wire lead is soldered to the channel in the ceramic tube, with the ends of the flat wire extending onto the flat portions of the half-cylindrical portions of the feedthrough. In one embodiment, the chip carrier includes a base, ring, and stepped lid, all of Kovar or other suitable material, with the lid being weldable to the ring rather than being brazed or soldered.

Abstract: A microcircuit package in which one or more leads can be grounded to the package by a simple procedure which is performed on a package of usual construction. A braze preform is placed over a lead to be grounded, a metal washer is disposed over the lead and preform, and the assembly is brazed to cause fusing of the washer to the lead and to the header to provide a low resistance grounding connection between the lead and package.

Abstract: A brazing technique is described for providing a standard flat pack with a Thermkon base brazed to a Kovar frame through the utilization of an intermediary ring of high thermal conductivity material which prevents flashing onto the Thermkon base. Brazing is accomplished either in a one-step process in which the parts with the intermediary ring are brazed together all at one time with a single heat treatment, or in a two-step process in which the intermediary ring is first brazed to the frame. In a subsequent step, the frame with the intermediary ring brazed thereto, is brazed to the Thermkon base. In either process, the high thermal conductivity of the intermediary ring permits the ring to quickly reach brazing temperature for minimizing flashing.

Abstract: A microcircuit flat package which remains hermetically sealed even under conditions of high stress. The package comprises an integral rectangular metal tubular shell having an opening in one of the broad walls, and elongated integral insulators sealed in the open ends of the tube, each insulator having an array of leads extending in sealed manner therethrough. A microcircuit is installed within the package and connected via wire bonds to the inner ends of the leads and after which a cover can be bonded onto the flat coplanar surfaces of the tubular shell surrounding the package opening to hermetically enclose the microcircuit.

Abstract: A multi-component microcircuit package is formed from a plurality of separate components which are secured together to form a lower package portion using a base and a continuous composite side wall frame having irregularities on its upper surface as a result of the component junctions. Secured to the top of this side wall frame is a one-piece continuous top frame member having a uniform upper surface. This top frame member covers the irregularities present in side wall frame and provides a surface more suitable for hermetic sealing of a package lid to the package.

Abstract: An ultraviolet-transmitting glass window assembly comprising a metallic mounting ring containing an ultraviolet-transmitting glass is made by placing a preformed ultraviolet-transmitting glass member in the center of the metallic ring which has a higher coefficient of thermal expansion than the glass, heating the resulting assembly to melt the glass whereby it completely fills the ring, and cooling the assembly whereby a compression seal is achieved due to the greater shrinkage of the metallic ring. This window assembly is sealed over the memory chip of a programmable read only memory package to provide for ultraviolet erasure of the program information stored in the memory device.