Patents Assigned to Isotronics, Incorporated
  • All metal flat package having excellent heat transfer characteristics
    Patent number: 4266089
    Abstract: An all-metal flat package for microcircuits is described which has a copper bottom and a stainless steel frame. Beryllia substrates carrying power chips can readily be soldered into the package which has good heat transfer characteristics.
    Type: Grant
    Filed: September 14, 1978
    Date of Patent: May 5, 1981
    Assignee: Isotronics, Incorporated
    Inventor: Jeremy D. Scherer
  • All metal flat package
    Patent number: 4266090
    Abstract: An all-metal flat package for microcircuits is described which has a molybdenum bottom and a Kovar frame. Large 96% alumina substrates carrying heat dissipating microcircuits can readily be soldered into the package which has good transfer characteristics.
    Type: Grant
    Filed: September 14, 1978
    Date of Patent: May 5, 1981
    Assignee: Isotronics, Incorporated
    Inventor: Jeremy D. Scherer