Abstract: A semiconductor device includes: a plurality of memory cells; a plurality of local bit lines connected to respective memory cells of the plurality of memory cells; and a first amplifier. The first amplifier receives read data from each local bit line of the plurality of local bit lines and determines a transition speed of an output level of the first amplifier in response to receiving a combination of at least two pieces of read data. The first amplifier transfers, based on the determined transition speed, multivalued data of the read data to a read global bit line.

Abstract: A memory element has a layered structure, including a memory layer that has magnetization perpendicular to a film face in which a magnetization direction is changed depending on information, and includes a Co—Fe—B magnetic layer, the magnetization direction being changed by applying a current in a lamination direction of the layered structure to record the information in the memory layer, a magnetization-fixed layer having magnetization perpendicular to a film face that becomes a base of the information stored in the memory layer, and an intermediate layer that is formed of a non-magnetic material and is provided between the memory layer and the magnetization-fixed layer, a first oxide layer and a second oxide layer.

Abstract: The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.

Abstract: An semiconductor structure, method of fabrication therefor, and design structure therefor is provided. A thermal grid is formed over at least a portion of a substrate. An insulating layer is formed over at least a portion of the thermal grid. A resistor is formed over at least a portion of the insulating layer. A buried interconnect is connected to the thermal grid via at least one contact. The buried interconnect is adapted to receive thermal energy from the thermal grid via the at least one contact.

Abstract: A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.

Abstract: A method of operating an oven having a cooking cavity and a gas heating element provided at a lower portion of the cooking cavity and an electric heating element provided at an upper portion of the cooking cavity.

Abstract: There is provided a monitoring apparatus (1) including: an acquisition unit (10) that acquires failure information indicating that a failure has occurred in any of a plurality of monitoring targets; a notification job determination unit (20) that determines whether or not a predetermined user has to be notified of the failure which is specified by the failure information; and a display unit (40) that displays failure notification information indicating occurrence of the failure when the acquisition unit (10) acquires the failure information, and displays notification job information indicating that there is a job to notify the failure to a predetermined user when the notification job determination unit (20) determines that notification has to be issued.

Abstract: A semiconductor device includes a substrate, a first trough structure and a second trough structure. The first trough structure which is in the substrate includes a first conductive layer, a first doping layer and a first insulation layer, which is placed between the first conductive layer and the first doping layer. The second trough structure which is in the substrate and separated from the first trough structure by a separation part of the substrate includes a second conductive layer and a second insulation layer. A first contact connects the first doping layer, a second contact connects the separation part, and a third contact connects the second conductive layer. The separation part forms a resistor, coupled between the first contact and the second contact, and the substrate, the second insulation layer and the second conductive layer together form a capacitor, coupled between the second contact and the third contact.

Abstract: A microresonator with an input electrode and an output electrode patterned thereon is described. The input electrode includes a series of stubs that are configured to isolate acoustic waves, such that the waves are not reflected into the microresonator. Such design results in reduction of spurious modes corresponding to the microresonator.

Abstract: A computational device receives input data and control data, where the control data includes instructions to modify one or more operations performed during a runtime execution associated with the input data. The control data is processed to modify the one or more operations during the runtime execution associated of the input data.

Abstract: A capacitor structure in a semiconductor device includes a semiconductor substrate having a top surface and a bottom surface opposite the top surface, an isolation region having a top surface and a bottom surface, opposite the top surface, the bottom surface of the isolation region being disposed on the top surface of the semiconductor substrate. The capacitor structure also includes a gate terminal structure disposed on the top surface of the isolation region and a diffusion contact structure disposed on the top surface of the isolation region and arranged parallel to the gate terminal structure. In some aspects, the gate terminal structure is connected to a first contact node and the diffusion contact structure is connected to a second contact node, in which the first and second contact nodes form opposing nodes of the capacitor structure.

Abstract: A fail signal indicating overcharge/overdischarge of unit cells detected by voltage detecting ICs (21-1) to (21-n) is transmitted as a digital signal and an analog signal to a CPU 32. If the analog fail signal and digital fail signal agree with each other, the CPU 32 determines that overcharge or overdischarge is occurring in the unit cells. If the fail signals disagree with each other, it is determined that an error is occurring in data communication in communication lines L1 to L3 and the error is informed to an operator with an alarm signal or the like. As a result, overcharge or overdischarge is highly accurately detectable.

Abstract: The patient device, designed for use by patients of reduced cognitive or physical ability, integrates with the network-based portal, designed for use by family members or nursing staff to customize the user experience of the patient. Using the portal the family member pushes user interface customizations as well as content and applications to be run on the patient device. The family member can also control the patient device remotely via the portal. The patient device collects usage data on the set of customizable interface components, and on the pushed content and applications. These data are sent as feedback to the portal, allowing the portal to show the family member which user interface features, content and applications are being used and which are not. Aggregate data collected via the portal generate ranking metrics used to aid in user interface feature selection.

Abstract: A computer-implemented method for the placing of information assets, including: discovering information about a new or changed information asset; determining one or more characteristics of an ideal location for the information asset; determining one or more characteristics of one or more locations in an information technology environment; determining the compatibility of the information asset with the location(s) by comparing the characteristic(s) of the ideal location to the characteristic(s) of the actual location(s); reporting the compatibility to a user; and optionally suggesting alternative placement locations. The locations may be part of one or more locational schemas.

Abstract: To improve detection accuracy of SPIT, first, an identification information gathering apparatus receives various identification information from an IP phone terminal which has transmitted an INVITE message. A PUCI server generates bind identification information by binding or associating various identification information received from an identification information gathering apparatus via an SIP server and registers the bind identification information to a gray list stored in a list storing portion. A SPIT determination portion evaluates the bind identification information in reference to the gray list and determines whether or not the session start request from the IP phone terminal is allowed.

Abstract: A mobile device is provided that may switch between a first arrangement and a second arrangement. The mobile device may include a communication device to provide wireless communication. A first panel may be provided having a display, and a second panel may be provided having a display. A first hinge device may couple the first panel to the second panel. A first magnet may be provided at or near a side surface of the first panel, and a second magnet may be provided at or near a side surface of the second panel.

Abstract: A broadside coupled differential design is described herein. The design may include a differential pair. Each trace of the differential pair includes a wide portion and a narrow portion. The wide portion of the first trace of the differential pair is to be aligned with a narrow portion of the second trace of the differential pair. Additionally, the wide portion of the second trace of the differential pair is to be aligned with a narrow portion of the first trace of the differential pair, such that the wide and narrow portions of the traces of the differential pair are staggered.

Abstract: A method and device for selecting a media device that is enabled to receive and then play or distribute digital media files, where the media device is or has been connected to a network over which the digital media is delivered to the media device. Media devices that have been connected to the network are identified. Identification information for available media devices that are currently connected to the network and turned on, and identification information for unavailable media devices that are not currently turned on or are not currently connected to the network, is stored. A selection of either an available or an unavailable media device is received, and in response the digital media is distributed over the network to the selected media device.

Abstract: A terminal assembly includes a terminal board with an interrupted aperture to receive a passthrough.