Patents Assigned to IT Corporation
  • Patent number: 11763413
    Abstract: A method for transforming an input array of pixel data into an output array of data, to yield enhanced expression of a digital watermark signal in the output array. One such method includes, for each pixel in the input array, generating a first datum that indicates a value difference between said pixel and a neighboring pixel in a first direction, the first data thereby collectively comprising a first directional difference array. Similarly, for each such pixel in the input array, generating a second datum that indicates a value difference between said pixel and a neighboring pixel in a second direction, the second data thereby collectively comprising a second directional difference array. One or more transforms to a spatial frequency domain are then performed, using these first and second directional difference arrays as input data. First and second results from the one or more transformations are then combined to yield an output array.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: September 19, 2023
    Assignee: Digimarc Corporation
    Inventor: Geoffrey B. Rhoads
  • Patent number: 11765710
    Abstract: A method and apparatus for controlling transmit power in a wireless local area network (WLAN). For example, a station may receive, from an access point (AP), a beacon frame that includes a field indicating a maximum transmission power for at least one of a plurality of operational bandwidth that the AP supports. The station may determine a transmission power for a signal to be transmitted to the AP based on the at least one of the plurality of operational bandwidths indicated in the received beacon. The station may then transmit the signal at the determined transmission power.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: September 19, 2023
    Assignee: INTERDIGITAL TECHNOLOGY CORPORATION
    Inventors: Marian Rudolf, Vincent Roy
  • Patent number: 11762893
    Abstract: Creating a summary of a plurality of texts includes tokenizing each of a plurality of texts to obtain tokens; generating a vector space using a first set of vectors having one or more obtained feature scores equal to or larger than a predefined value; executing non-hierarchical clustering using the vector space to generate a first plurality of clusters; choosing a first representative text in each of the plurality of clusters; generating a second set of vectors from each of the arrays generated based on a number of characters included in tokens of the representative texts; executing hierarchical clustering using the second set of vectors to generate a second plurality of clusters; and in response to a determining a number of clusters included in the second plurality of clusters, determining a second representative text for each of the clusters included in the second plurality of clusters.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: September 19, 2023
    Assignee: International Business Machines Corporation
    Inventors: Yu Gu, Takayuki Kushida, Hiroki Nakano, Yaoping Ruan, Yuji Sugiyama
  • Patent number: 11764368
    Abstract: A titanium material including a base metal made of pure titanium or a titanium alloy and a titanium oxide film formed on the base metal. Peak intensities obtained by thin-film X-ray diffraction analysis performed on an outer layer of the titanium material using an incident angle of 0.3° satisfy (I(104)+I(200))/I(101)?0.08?0.004×I(200), where I(104) is the peak intensity resulting from a plane (104) of a Ti2O3 phase, I(200) is the peak intensity resulting from a plane (200) of a TiO phase, I(101) is the peak intensity resulting from a plane (101) of an ?-Ti phase, and 0<I(104), 0?I(200), and 0<I(101). The titanium material is inexpensive and has both the electrical conductivity and corrosion resistance.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: September 19, 2023
    Assignee: Nippon Steel Corporation
    Inventors: Hideya Kaminaka, Yoshitaka Nishiyama, Koichi Nose, Junko Imamura, Haruka Sato
  • Patent number: 11765458
    Abstract: An image blur correction device is configured to correct a blur of an imaging apparatus that includes an image sensor that images a subject through an imaging optical system. An image blur correction device includes an acceleration sensor that detects accelerations in two directions, an angular velocity sensor that detects an angular velocity of the imaging apparatus around a rotation axis parallel to the optical axis, a rotational acceleration component calculator that calculates rotational acceleration components which are generated by rotation of the imaging apparatus around the rotation axis based on an output of the angular velocity sensor, and a blur corrector that corrects blurs of the imaging apparatus based on the rotational acceleration components and the accelerations. The blur corrector corrects the blurs based on a member of the imaging apparatus that is used for an imaging of the imaging apparatus.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: September 19, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Koichi Tanaka, Fuminori Irie, Junya Kitagawa, Kouhei Awazu
  • Patent number: 11763774
    Abstract: The present disclosure is directed to systems and methods of maintaining source device to sink device synchronization in systems in which the source device enters a Panel Self-Refresh (PSR/PSR2) mode and the sink device enables adaptive synchronization with the source device. To maintain synchronization, in some instances the source device and the sink device may maintain synchronization contemporaneous with at least a portion of the PSR/PSR2 operating mode. To maintain synchronization, in some instances, a high-bandwidth communications link may be maintained between the source device and the sink device. In some instances, synchronization between the source device and the sink device may be interrupted upon the source device entering the PSR/PSR2 operating mode and may be re-established upon the source device exiting the PSR/PSR2 operating mode.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: September 19, 2023
    Assignee: Intel Corporation
    Inventors: Nausheen Ansari, Gary Smith
  • Patent number: 11759483
    Abstract: Disclosed is a method for improving eye conditions comprising orally administering to humans, an ethanol-soluble component-containing degradation product obtained by degrading a comb with a protease and removing a solid.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: September 19, 2023
    Assignee: LAIMU CORPORATION
    Inventor: Sachio Wakayama
  • Patent number: 11763415
    Abstract: An embodiment of a graphics apparatus may include a mask buffer to store a mask, a shader communicatively coupled to the mask buffer to apply the mask to a first shader pass, and a resolver communicatively coupled to the mask buffer to apply the mask to a resolve pass. The resolver may be configured to exclude a sample location not covered by the mask in the resolve pass. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: September 19, 2023
    Assignee: Intel Corporation
    Inventors: Hugues Labbe, Tomer Bar-On, Kai Xiao, Ankur N. Shah, John G. Gierach
  • Patent number: 11764523
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. In some embodiments, the connector is may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. In some embodiments, the modules may have projecting portions, of conductive and/or dielectric material, that are shaped and positioned to reduce changes in impedance along the signal paths as a function of separation of conductive elements, when the connectors are separated by less than the functional mating range.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: September 19, 2023
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, John Robert Dunham, Marc B. Cartier, Jr., Donald A. Girard, Jr.
  • Patent number: 11765239
    Abstract: Technologies disclosed herein provide a method for receiving at a device from a remote server, a request for state information from a first processor of the device, obtaining the state information from one or more registers of the first processor based on a request structure indicated by a first instruction of a software program executing on the device, and generating a response structure based, at least in part, on the obtained state information. The method further includes using a cryptographic algorithm and a shared key established between the device and the remote server to generate a signature based, at least in part, on the response structure, and communicating the response structure and the signature to the remote server. In more specific embodiments, both the response structure and the request structure each include a same nonce value.
    Type: Grant
    Filed: February 2, 2022
    Date of Patent: September 19, 2023
    Assignee: Intel Corporation
    Inventors: Prashant Dewan, Siddhartha Chhabra, Uttam K. Sengupta, Howard C. Herbert
  • Patent number: 11762347
    Abstract: A control device executes a step of starting a computation processing of a prediction model; a step of computing a remaining processing time until the computation processing is completed after starting the computation processing of the prediction model; a step of determining whether the determination of the command value based on an output obtained from the prediction model is made within a control timing for controlling the operation of manufacturing by the manufacturing device, on the basis of a computed remaining processing time; and a step of stopping, when it is determined that the determination of the command value is not made within the control timing, the computation processing of the prediction model, determining the command value on the basis of a value of an intermediate result of the computation processing, and controlling the operation of the manufacturing device on the basis of the determined command value.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: September 19, 2023
    Assignee: OMRON Corporation
    Inventors: Yuki Ueyama, Yasuaki Abe, Nobuyuki Sakatani, Kazuhiko Imatake, Takashi Fujii
  • Patent number: 11761372
    Abstract: A multi-way coolant valve and a heat pump system having the same include an external housing in which first, second and third external inlets and first, second and third external outlets are formed; and an internal housing provided rotatably inside the external housing to selectively fluidically-connect the first, second and third external inlets, and the first, second and third external outlets, and divided into two stages through which a coolant flows respectively, wherein as the internal housing rotates at a predetermined interval in a selected mode of the vehicle, the first external inlet selectively fluidically-communicates with the first external outlet, the second external outlet, or the third external outlet, the second external inlet selectively fluidically-communicates with the first external outlet or the second external outlet, and the third external inlet selectively fluidically-communicates with the first external outlet, the second external outlet, or the third external outlet.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: September 19, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Seong-Bin Jeong, Dong Seok Oh, Namho Park, Yeonho Kim, Man Hee Park, Jae Yeon Kim, Wan Je Cho
  • Patent number: 11764183
    Abstract: Provided is a joint structure interposed between a semiconductor element and a substrate, the joint structure including: a Sn phase; Cu alloy particles containing P in an amount of 1 mass % or more and less than 7 mass %; and Ag particles, wherein the Cu alloy particles are each coated with a Cu6Sn5 layer, wherein the Ag particles are each coated with a Ag3Sn layer, wherein the Cu alloy particles and the Ag particles are at least partially bonded to each other through a Cu10Sn3 phase, wherein a total of addition amounts of the Cu alloy particles and the Ag particles is 25 mass % or more and less than 65 mass % with respect to the joint structure, and wherein a mass ratio of the addition amount of the Ag particles to the addition amount of the Cu alloy particles is 0.2 or more and less than 1.2.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: September 19, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Yamazaki, Yoshio Tamura
  • Patent number: 11760091
    Abstract: A liquid discharge head includes a flow channel member including a first surface and a second surface opposite to the first surface, and a pressing unit on the first surface. The flow channel member includes a first discharge hole and a second discharge hole in the second surface, a first individual flow channel connected to the first discharge hole, a first pressurizing chamber on an upstream side of the first discharge hole in the first individual flow channel, a second individual flow channel connected to the second discharge hole, a second pressurizing chamber on an upstream side of the second discharge hole in the second individual flow channel, and a manifold commonly connected to an upstream side of first individual flow channel and an upstream side of the second individual flow channel. The first individual flow channel and the second individual flow channel have an overlapping portion in plan view.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: September 19, 2023
    Assignee: KYOCERA CORPORATION
    Inventor: Kazuki Dogome
  • Patent number: 11760511
    Abstract: A transport device for transporting an unmanned aerial vehicle and methods for using the transport device are described herein. An example embodiment of the transport device includes: a carriage configured to engage the unmanned aerial vehicle; a plurality of engagement arms movably attached to the carriage and movable between a first locking position and a second locking position, each of the plurality of engagement arms, and configured to maintain engagement of the unmanned aerial vehicle by the carriage when in the first locking position; and a handle adapter having a first end configured for attachment to the carriage and a second end configured to receive an extension member.
    Type: Grant
    Filed: December 23, 2022
    Date of Patent: September 19, 2023
    Assignee: The ADT Security Corporation
    Inventors: Joshua Bradshaw, Trevor Greenberg, Michael Lavway, Johnnie Donnell Singletary, Christopher Anthony Smith
  • Patent number: 11761523
    Abstract: A rotary device is disclosed. The rotary device includes a first rotor, a centrifugal element, and a tilt preventing mechanism. The first rotor is disposed to be rotatable. The centrifugal element is supported to be axially movable with respect to the first rotor. The tilt preventing mechanism prevents the centrifugal element from tilting.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: September 19, 2023
    Assignee: EXEDY Corporation
    Inventors: Yusuke Tomita, Yusuke Okamachi
  • Patent number: 11761064
    Abstract: A refractory metal alloy includes at least three metal components. At least one of the metal components is a refractory metal selected from the group of Mo, Nb, W, Ti, V, Cr, Mn, Y, Zr, Hf, Ta, Fe, Co, Al, Mn. The refractory metal alloy also includes two nonmetal components. The refractory metal alloy comprises non-trace amounts of each of the metal components and each of the nonmetal components. A component is also disclosed.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: September 19, 2023
    Assignee: RTX CORPORATION
    Inventors: Richard Wesley Jackson, John A. Sharon, Ryan M. Deacon
  • Patent number: 11765883
    Abstract: The present application provides a method for manufacturing a semiconductor die. The method includes forming dielectric layers on a substrate; forming decoupling capacitors in the dielectric layers; forming first and second bonding pads on the dielectric layers, wherein the first bonding pads are coupled to a power supply voltage, the second bonding pads are coupled to a reference voltage, a group of the decoupling capacitors are located under one of the first bonding pads, first terminals of the group of the decoupling capacitors are electrically connected to the one of the first bonding pads, second terminals of the group of the decoupling capacitors are routed to one of the second bonding pads; and forming bond metals on the first and second bonding pads, wherein the decoupling capacitors are overlapped with the first and second bonding pads, and laterally surround portions of the dielectric layers overlapped with the bond metals.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: September 19, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Wu-Der Yang
  • Patent number: 11759803
    Abstract: A method for producing a wearable coating having a solid material fixed on skin, the method comprising: A) a step of placing one or more solid materials selected from the group consisting of a powder, a granule, a film, a fiber, a flat material, and a cubic material other than these, on a skin surface; B) a step of, after the step A), electrostatically spraying a composition X comprising the following component (a) and the following component (b) directly on the skin to thereby form a coating on the skin surface: (a) one or more volatile substances selected from the group consisting of water, an alcohol, and a ketone, and (b) a polymer having a coating forming ability; and after the step B) or before the step A), C) a step of applying a composition Y, other than the composition X, comprising one or more components selected from the group consisting of the following component (c) and the following component (d) to the skin: (c) an adhesive polymer, and (d) an oil.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: September 19, 2023
    Assignee: KAO CORPORATION
    Inventors: Nobuyuki Asami, Asuka Imai, Michael Rosner
  • Patent number: RE49662
    Abstract: A semiconductor integrated circuit includes: a first voltage line on which a specific one of a power-supply voltage and a reference voltage appears; a second voltage line; a plurality of circuit cells each receiving power generated as a difference between a voltage appearing on the second voltage line and the other one of the power-supply voltage and the reference voltage; a plurality of switch transistors connected in parallel between the first and second voltage lines to serve as switch transistors including switch transistors each having different conducting-state resistances; and a switch conduction control section for controlling a transition of each of the switch transistors from a non-conducting state to a conducting state by turning on the switch transistors at separate points of time.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: September 19, 2023
    Assignee: Sony Group Corporation
    Inventors: Masahiro Igarashi, Tetsuo Motomura, Ryuji Kaneko, Makoto Fujiwara, Yoshinori Tanaka, Hiromi Ogata