Abstract: A multi-layered structure is provided, which includes a carrier and a resin coating on the carrier, wherein the resin coating is formed by magnetically aligning and drying a resin composition. The resin composition includes 1 part by weight of (a) crosslinkable monomer with a biphenyl group, 1.0 to 20.0 parts by weight of (b) polyphenylene oxide, 0.1 to 10.0 parts by weight of (c) hardener, and 0.1 to 80.0 parts by weight of (d) magnetic filler. (d) Magnetic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof, with a surface modified by iron-containing oxide. (d) Magnetic filler is sheet-shaped or needle-shaped.

Abstract: A resin composition is provided, which includes 1 part by weight of (a) thermally conductive resin with a biphenyl group, 1.0 to 10.0 parts by weight of (b) polyphenylene oxide, 0.01 to 5.0 parts by weight of (c) hardener, and 0.1 to 5.0 parts by weight of (d) inorganic filler. (d) Inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide. (d) Inorganic filler is sheet-shaped or needle-shaped.

Abstract: The invention relates to a polyimide containing polymaleic anhydride having the formula: wherein X represents functional groups having carbon chain with carbon numbers more than 10, benzene ring and a combination of carbon chain with carbon numbers more than 10 and benzene ring; and m, n and l are integers, and larger than or equal to 1.

Abstract: The invention relates to an electromagnetic interference shielding film comprising an electromagnetic wave absorptive layer which contains electromagnetic wave absorptive particles; a conductive layer which contains conductive particles, and the conductive layer is disposed on a surface of the electromagnetic wave absorptive layer; a metallic layer disposed on another surface of the electromagnetic wave absorptive layer; and an insulating layer disposed on the metallic layer. The electromagnetic interference shielding film according to the invention can prevent the circuits and components from the electromagnetic interference.

Abstract: A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin.

Abstract: A thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride copolymers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.

Abstract: A varnish includes an epoxy resin, a curing agent, an accelerator agent and fillers. The fillers include inorganic mineral powders. The inorganic mineral powders have composition of SiO2 in weight ratio of 55±5% and a composition of aluminum compound in weight above 35%. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better machined-work capability.

Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.

Abstract: The invention provides a kind of prepolymer with 4-(N-maleimide phenyl)Ether (MPGE) epoxy resin and 4,4?-diphenylmethane bismaleimide (BMI) as reactants, with free radical initiator leading to reaction in solvents, and adding inhibitor after reaction, with the mole ratio of 0.05-0.5 for BMI and MPGE; the initiator usage is 0.01%-0.15% of mole total for reactant monomers; the solvent usage is 50%-70% of the total weight of the reactants; the inhibitor usage is half to double of mole amount of the initiator used. This kind of prepolymer can be used to produce high-performance thermosetting resin composition corresponding to the packaging requirements for electronic components and Integrated Circuits (IC).

Abstract: A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness.

Abstract: A varnish includes resin and composite curing agent. The composite curing agent includes curing agent of polyphenylene methylphosphonate resin and curing agent of phenol resin. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better thermal stability, anti-flammability, and low absorbent ability. Furthermore, the composite curing agent can be provided for higher curing rate.

Abstract: The present invention discloses a thermosetting resin for expediting a thermosetting process. The thermosetting resin is composed of 100 parts of primary resin formed by mixing a brominized epoxy resin, a tetrafunctional epoxy resin and an epoxy resin with a high bromine content, and other materials including 35 parts of phenolic resin curing agent, 30 parts of tetrabromobisphenol A curing agent, 0.1 part of 2-ethyl-4-methylimidazole, 0.8 part Lewis acid, and 50˜70 parts of solvent, calculated based on every 100 parts of the primary resin by weight. The invention can expedite a thermosetting process and enhance the Tg of prepregs and clad laminates.

Abstract: A composition for preparing a resin is provided. The composition includes a brominated epoxy resin, a urethane-modified copolyester, a curing agent and a solvent. A prepreg is also provided. The prepreg includes a glass fabric and a resin layer on the glass fabric. The resin layer is made from the foregoing resin.

Abstract: A halogen-free varnish includes epoxy resin, composite curing agent, condensed phosphate, and filler. The composite curing agent includes Benzoxazine (BZ) resin and amino triazine novolac (ATN) resin. The filler has aluminium hydroxide and silica. Glass fabric is dipped into the varnish so as to form a prepreg with better thermal stability, anti-flammability, and low moisture absorption.

Abstract: A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too.

Abstract: The inhibition of Chlorophyta growth in water needed to be treated can be accomplished by the addition of about 100 ppm glucosamine. The inhibition of Microcystic aeruginosa and Microcystis flos-aquae growth in water needed to be treated can be accomplished by the addition of about 10 to 50 ppm glucosamine. The addition of glucosamine to water needed to be treated, such as reservoirs, offers an environmentally safe method for inhibiting algae growth.