Abstract: Provided is a method of fabricating a battery protection circuit package, the method including preparing a complex package substrate obtained by connecting a flexible printed circuit board (PCB) including at least one external connection terminal for connection to an external device, to a rigid PCB for mounting components thereon, mounting the complex package substrate on a lead frame including at least one metal tab for connection to a battery cell, and encapsulating at least portions of the complex package substrate and the lead frame with a molded part while exposing the at least one metal tab and the at least one external connection terminal.

Abstract: Provided is a battery protection circuit module package capable of easily achieving high integration and size reduction. The battery protection circuit module package includes a terminal lead frame including a first internal connection terminal lead and a second internal connection terminal lead provided at two edges of the terminal lead frame and electrically connected to electrode terminals of a battery bare cell, and a plurality of external connection terminal leads provided between the first and second internal connection terminal leads and serving as a plurality of external connection terminals, and a device package including a substrate mounted on the terminal lead frame to be electrically connected to the terminal lead frame, and providing a battery protection circuit device thereon.

Abstract: A battery pack includes a battery protection circuit module package coupled with a holder. The protection circuit module includes a basic package including a lead frame having a plurality of leads spaced apart from each other, and protection circuit elements provided on the lead frame, and an encapsulant and a holder simultaneously produced by disposing the basic package in a first injection mold and injecting a resin melt into the first injection mold to perform an insert injection molding process. The encapsulant encapsulates the protection circuit elements to expose parts of the lead frame, wherein the encapsulant and the basic package configure the battery protection circuit module package, and wherein the holder is coupled to the battery protection circuit module package due to the insert injection molding process.

Abstract: Disclosed is a battery protection module package (PMP). The battery PMP according to an embodiment of the present invention includes a lead frame provided with a plurality of external terminals thereon, a printed circuit board stacked on the lead frame, and a plurality of internal terminals, a protection integrated chip (IC), a field effect transistor (FET), resistors, and capacitors disposed on the printed circuit board and electrically connected to each other, wherein the resistors and the capacitors are mounted on a pattern of the printed circuit board using surface mount technology (SMT), and wherein the plurality of internal terminals are electrically connected to the plurality of external terminals.

Abstract: The present invention pertains to a package module of a battery protection circuit, and the package module of the battery protection circuit according to the present invention comprises: a first internal connection terminal area and a second internal connection terminal area, which are respectively disposed at both edge parts thereof, and in which first and second internal connection terminals connected to a battery can provided with a bare cell are respectively disposed; an external connection terminal area, which is adjacent to the first internal connection terminal area, and in which a plurality of external connection terminals are disposed; and a protection circuit area comprising a device area in which a plurality of passive devices forming the battery protection circuit are disposed and a chip area, which is adjacent to the device area, and in which a protection IC and a dual FET chip forming the battery protection circuit are disposed, are disposed between the external connection terminal area and the