Patents Assigned to IVI Holdings, Ltd.
  • Patent number: 8983061
    Abstract: A method and apparatus cryptographically process data including a plurality of data segments. The cryptographic process includes (a) receiving a plurality of data segments, (b) selecting, for each data segment, a set of encryption information based on data contained in a predetermined portion of the data segment to be encrypted, and (c) encrypting each data segment using the set of encryption information selected for the data segment. At least one of an encryption algorithm, an encryption key, and an encryption parameter may be changed for each data segment based on the data contained in the predetermined portion. The predetermined portion may include a first predetermined portion for selecting a first set of encryption information, and a second predetermined portion for selecting a second set of encryption information, the encryption information including an encryption algorithm, an encryption key, and optionally an encryption parameter.
    Type: Grant
    Filed: February 13, 2004
    Date of Patent: March 17, 2015
    Assignee: IVI Holdings Ltd.
    Inventor: Masashi Watanabe
  • Patent number: 8918900
    Abstract: A smart card authenticates a cardholder. The smart card includes a substrate, a sensor module, a wireless transceiver module, and a power circuit. The sensor module includes (a) a biometric sensor adapted to detect biometric information from a person's body, (b) a processor unit adapted to authenticate the person in response to the detected biometric information and generate an authentication signal representing an authentication result, and (c) a memory adapted to store biometric information of a specific individual associated with the smart card. The wireless transceiver module transmits signals received from the processor unit and receives a wirelessly-transmitted power signal. The power circuit generates at least one supply voltage from the received power signal and provides the supply voltage to the sensor module. An electronic passport is embedded with the smart card, and a terminal module is used for wirelessly transmitting power to and receiving signals from the electronic passport.
    Type: Grant
    Filed: April 26, 2004
    Date of Patent: December 23, 2014
    Assignee: IVI Holdings Ltd.
    Inventor: Tamio Saito
  • Patent number: 8908934
    Abstract: A method and apparatus are provided for improved fingerprint recognition. A fingerprint image associated with an authorized user can be captured with a sensor. Direction vectors for a plurality of pixels of the first fingerprint image are then calculated. Next, characteristic points of the fingerprint image are located in a first coordinate system. The fingerprint central nucleus is determined based on the calculated direction vectors, and is expressed in the first coordinate system. Subsequently, a second coordinate system having an origin located relative to the fingerprint central nucleus is determined. Thereafter, the characteristic points of the fingerprint image are mapped to the second coordinate system. Finally, the fingerprint central nucleus and fingerprint characteristic points expressed in the second coordinate system are saved as a fingerprint template.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: December 9, 2014
    Assignee: IVI Holdings Ltd.
    Inventor: Tamio Saito
  • Patent number: 8899487
    Abstract: A card authenticates a cardholder. The card includes a substrate, a sensor module, a wireless transceiver module, and a power circuit. The sensor module includes (a) a biometric sensor adapted to detect biometric information from a person's body, (b) a processor unit adapted to authenticate the person in response to the detected biometric information and generate an authentication signal representing an authentication result, and (c) a memory adapted to store biometric information of a specific individual associated with the card. The wireless transceiver module transmits signals received from the processor unit and receives a wirelessly-transmitted power signal. The power circuit generates at least one supply voltage from the received power signal and provides the supply voltage to the sensor module. An electronic passport is embedded with the card, and a terminal module is used for wirelessly transmitting power to and receiving signals from the electronic passport.
    Type: Grant
    Filed: August 18, 2006
    Date of Patent: December 2, 2014
    Assignee: IVI Holdings Ltd.
    Inventors: Tamio Saito, Marcello Soliven
  • Patent number: 8904187
    Abstract: A high security identification card includes an on-board memory for stored biometric data and an on-board sensor for capturing live biometric data. An on-board processor on the card performs a matching operation to verify that the captured biometric data matches the locally stored biometric data. Only if there is a positive match is any data transmitted from the card for additional verification and/or further processing. Preferably, the card is ISO SmartCard compatible. In one embodiment, the ISO SmartCard functions as a firewall for protecting the security processor used for storing and processing the protected biometric data from malicious external attack via the ISO SmartCard interface. In another embodiment, the security processor is inserted between the ISO SmartCard Interface and an unmodified ISO SmartCard processor and blocks any external communications until the user's fingerprint has been matched with a previously registered fingerprint.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: December 2, 2014
    Assignee: IVI Holdings Ltd.
    Inventors: Tamio Saito, Wayne Drizin, Takashi Aida
  • Patent number: 8786033
    Abstract: A biometric sensor panel includes (a) a first flexible substrate, (b) a plurality of first electrodes formed on the first flexible substrate, the first electrodes being arranged in a first direction, (c) a semiconductor layer formed on the first electrodes, (d) a second flexible substrate, (e) a plurality of second electrodes formed on the second flexible substrate, the second electrodes being arranged in a second direction crossing the first direction, and (f) a pressure sensitive conductive layer formed on the second electrodes, wherein the first and second flexible substrates face each other such that the semiconductor layer is in contact with the pressure sensitive conductive layer.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: July 22, 2014
    Assignee: IVI Holdings, Ltd.
    Inventor: Tamio Saito