Patents Assigned to Iwaki Glass Co., Ltd.
  • Patent number: 6077721
    Abstract: A semiconductor sensor mount is formed as follows: through holes are formed that penetrate a glass plate; and then the glass plate having the through holes is dipped into hydrofluoric acid etchant to smooth the inner peripheral surfaces of the respective through holes. By etching the inner peripheral surfaces of the respective through holes after the through hole formation, minute roughness and cracks formed on the inner peripheral surfaces are removed, and thereby the areas for adsorbing gas are substantially reduced. That is, vacuums within the through holes can be maintained at a high degree during the anodic bonding, whereby undesirable electric discharge phenomena are prevented even if a relatively high voltage is applied during the anodic bonding. Accordingly, the yield of products can be improved while improving productivity.
    Type: Grant
    Filed: October 8, 1997
    Date of Patent: June 20, 2000
    Assignees: Nippondenso Co., Ltd., Iwaki Glass Co., Ltd.
    Inventors: Tsuyoshi Fukada, Yasutoshi Suzuki, Koushu Satoh, Hiroaki Kawashima
  • Patent number: 5736061
    Abstract: A semiconductor sensor mount is formed as follows: through holes are formed that penetrate a glass plate; and then the glass plate having the through holes is dipped into hydrofluoric acid etchant to smooth the inner peripheral surfaces of the respective through holes. By etching the inner peripheral surfaces of the respective through holes after the through hole formation, minute roughness and cracks formed on the inner peripheral surfaces are removed, and thereby the areas for adsorbing gas are substantially reduced. That is, vacuums within the through holes can be maintained at a high degree during the anodic bonding, whereby undesirable electric discharge phenomena are prevented even if a relatively high voltage is applied during the anodic bonding. Accordingly, the yield of products can be improved while improving productivity.
    Type: Grant
    Filed: June 27, 1996
    Date of Patent: April 7, 1998
    Assignees: Nippondenso Co. Ltd., Iwaki Glass Co., Ltd.
    Inventors: Tsuyoshi Fukada, Yasutoshi Suzuki, Koushu Satoh, Hiroaki Kawashima
  • Patent number: 5340514
    Abstract: The present invention relates to a process of using shirasu balloon powder as a material to manufacture pottery products where;white pottery products of light weight, highly white coloring, uniformly distributed density and satisfactory strength can be obtained by removing impurities such as iron from the shirasu balloon powder and diffusing the shirasu balloon powder uniformly in the body and reinforcement agent, ornon-white pottery products of light weight, uniformly distributed density and satisfactory strength can be obtained by diffusing the shirasu balloon powder uniformly in the body and reinforcement agent without removing impurities such as iron from the shirasu balloon powder.
    Type: Grant
    Filed: September 29, 1992
    Date of Patent: August 23, 1994
    Assignees: Setoseido Kabushiki Kaisha, Iwaki Glass Co., Ltd., Tokai Kogyo Kabushiki Kaisha
    Inventors: Ryoziro Taniguchi, Takao Yamaguchi, Osamu Saito