Abstract: A hermetic sealing composition comprising 100 parts by weight of a basic composition consisting of from 80 to 99.9 wt % of a crystalline low melting glass powder containing lead and boron and from 0.1 to 20 wt % of a low expansion ceramic filler, and from 0.001 to 1.0 part by weight, in total, of at least one of an .alpha.-4PbO.B.sub.2 O.sub.3 crystal powder and a Pb.sub.3 O.sub.4 powder, incorporated to the basic composition, the thermal expansion coefficient of the sealing composition after firing being from 80.times.10.sup.-7 to 105.times.10.sup.-7 /.degree.C. within a range of from room temperature to 300.degree. C.

Abstract: A hermetic sealing composition comprising 100 parts by weight of a basic composition consisting of from 80 to 99.9 wt % of a crystalline low melting glass powder containing lead and boron and from 0.1 to 20 wt % of a low expansion ceramic filler, and from 0.001 to 1.0 part by weight, in total, of at least one of an .alpha.-4PbO.B.sub.2 O.sub.3 crystal powder and a Pb.sub.3 O.sub.4 powder, incorporated to the basic composition, the thermal expansion coefficient of the sealing composition after firing being from 80.times.10.sup.-7 to 105.times.10.sup.-7 /.degree.C. within a range of from room temperature to 300.degree. C.

Abstract: A fluorine-containing polymer composition comprising a polymer having a functional group and a fluorine-containing aliphatic cyclic structure dissolved in a solvent mixture of an aprotic fluorine-containing solvent and a protic fluorine-containing solvent.

Abstract: A sealing glass composition comprising from 75 to 50% by volume of low-melting glass powder containing PbO as the main component, from 20 to 45% by volume of ceramics powder having a thermal expansion coefficient of at most 30.times.10.sup.-7 .degree. C..sup.-1 in a range of from room temperature to 300.degree. C. and from 5 to 30% by volume of TiO.sub.2 -SnO.sub.2 solid solution powder.

Abstract: A sealing glass composition containing refractory filler of lower coefficient of thermal expansion for use in sealing alumina package for electronic components is disclosed. The composition consists essentially of low melting glass powder and cordierite powder in proportion of 2-30% by weight of the total composition, and optionally, .beta.-eucryptite, .beta.-spodumen, lead titanate or zircon in a proportion, respectively, not exceeding 15% by weight of the total composition. The low melting glass has a composition of 77.0-86.0 wt. % of PbO, 6.0-15.0 wt. % of B.sub.2 O.sub.3, 0.5-6.9 wt. % of ZnO, 0.1-3.0 wt. % of SiO.sub.2, 0-3.0% of Al.sub.2 O.sub.3 0-2.0% of alkali earth metal oxide, 0-1.5% of SnO.sub.2 and 0-1.0% of alkali metal oxide.

Abstract: A fluorine-containing polymer composition comprising a polymer having a functional group and a fluorine-containing aliphatic cyclic structure dissolved in a solvent mixture of an aprotic fluorine-containing solvent and a protic fluorine-containing solvent.