Patents Assigned to J. G. Systems, Inc.
  • CMP composition and process
    Patent number: 6955586
    Abstract: The present invention provides a chemical metal polishing (CMP) method with improved flexibility and improved processing window, especially as it relates to the chemical aspect of CMP technology. Broadly speaking, the invention has two aspects: according to one aspect, the invention provides a new CMP composition, comprising as an oxidizer, at least one of inorganic halogen derivative and dissolved oxygen while in a second aspect the invention provides an improved method for polishing metals.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: October 18, 2005
    Assignee: J. G. Systems, Inc.
    Inventor: John Grunwald
  • Fixed abrasive CMP pad with built-in additives
    Patent number: 6875097
    Abstract: This invention discloses fixed abrasive chemical mechanical polishing pads, wherein the pad itself comprises at least one material selected from the group consisting of oxidants, wetting agents and other additives normally delivered via a polishing slurry, which assist in the polishing effectiveness of the pad. The improved polishing pad provides both the benefit of a fixed abrasive and the benefits of slurry based polishing systems.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: April 5, 2005
    Assignee: J. G. Systems, Inc.
    Inventor: John Grunwald
  • Method for electroless copper deposition using a hypophosphite reducing agent
    Patent number: 6524490
    Abstract: A method for improving the electrical conductivity and appearance of copper films produced by reduction of copper ions using hypophosphite, comprising exposure of the as-deposited copper film to a solution of dimethylamino borane (DMAB) or equivalents thereof.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: February 25, 2003
    Assignee: J. G. Systems Inc.
    Inventor: John Grunwald