Abstract: This invention teaches deposition of a corrosion-barrier layer onto a copper substrate, which minimizes copper corrosion even if the final immersion top layer is not without pinholes. Such barrier layer can comprise a copper conversion coating, corrosion resistant immersion deposited metal coatings such as palladium, gold, etc. The deposition of a barrier layer is generally followed by immersion deposition of a metal plate such as for example silver, tin, or others, designed to promote solderability. The patent also envisions the barrier layer as a “stand alone” final finish, serving both as a corrosion barrier layer and at the same time will promote solderability. The patent further teaches ways to minimize the problems of black nickel formation in the field, when the final finish is an electroless Ni—P (EN), topped with immersion gold.

Abstract: Processes are disclosed for producing electronic interconnect devices, particularly semi-conductor wafers, with metal interconnect traces thereon wherein the surface of said device has improved planarity. Said planarity is achieved initially through the use of pulse reverse electrolytic plating techniques. Planarity is further enhanced by cathodically protecting the metal interconnect traces during the polishing operation. Cathodic protection is achieved by overtly applying a cathodic charge to said traces and/or by contacting said traces, during polishing, with a metal that is capable of sacrificial corrosion when in contact with the metal of the interconnect traces.

Abstract: A composition and process for the precision polishing of substrates such as semi-conductor chips is disclosed. The composition and process make use of soluble or insoluble organic nitro compounds as oxidizers and/or abrasive particles. Nitrogen containing reduction products of the foregoing organic nitro compounds may also be included.

Abstract: The use of organic nitro compounds, such as nitrobenzene sulfonic acids, in chemical mechanical polishing compositions is disclosed. Chemical mechanical polishing slurries are widely used in polishing and planarizing silicon wafers and other fine surfaces. Inorganic nitro compounds are widely used in these slurries as oxidant sources. However, organic nitro compounds, particularly aromatic nitro compounds, are here suggested as advantageous substitutes.

Abstract: The present invention provides a chemical metal polishing (CMP) method with improved flexibility and improved processing window, especially as it relates to the chemical aspect of CMP technology. Broadly speaking, the invention has two aspects: according to one aspect, the invention provides a new CMP composition, comprising as an oxidizer, at least one of inorganic halogen derivative and dissolved oxygen while in a second aspect the invention provides an improved method for polishing metals.

Abstract: The present invention provides a novel, structurally improved, abrasive agent, with improved surface properties resulting, inter alia, in enhanced wettability, dispersability and bonding. More specifically, the present invention provides according to an aspect thereof, an abrasive agent comprising abrasive particles, said particles being in the form of a composite material comprising more than one metal oxide material. In another aspect, the present invention provides an abrasive agent comprising metal oxide abrasive particles, said particles being coated at least partially with an extraneous metal or metal bearing layer.

Abstract: This invention discloses fixed abrasive chemical mechanical polishing pads, wherein the pad itself comprises at least one material selected from the group consisting of oxidants, wetting agents and other additives normally delivered via a polishing slurry, which assist in the polishing effectiveness of the pad. The improved polishing pad provides both the benefit of a fixed abrasive and the benefits of slurry based polishing systems.

Abstract: The present invention provides a method for improving interfacial chemical reactions of a solid workpiece contacted with a liquid solution, said method comprising pre-heating the workpiece prior to immersion thereof in said liquid solution. The pre-heating may be carried out up to a temperature that is practicable without impairing the workpiece.

Abstract: A method and apparatus for improving interfacial chemical reactions in electroless depositions of metals, in which the substrate to be plated is pre-heated prior to its immersion in the various processing solutions that require elevated temperatures, and especially before immersion in the electroless plating solution. The pre-heating is carried out to a temperature that is needed to bring about the desired chemical reaction at the substrate-solution interface, allowing the bath of that process step to operate significantly below the temperature that would have been needed if the panel had not been pre-heated, and below the solution temperature of current practice. According to another aspect of the present invention, the electroless plating apparatus for plating a workpiece operates in a vertical mode and it comprises a heating station, with the panel to be plated returning to the heating station as dictated by the temperature required for a given process step.

Abstract: A method for improving the electrical conductivity and appearance of copper films produced by reduction of copper ions using hypophosphite, comprising exposure of the as-deposited copper film to a solution of dimethylamino borane (DMAB) or equivalents thereof.

Abstract: The present invention relates to a method of manufacturing a conducting pattern on a non-conducting substrate, that leads to a printed circuit board (PCB). The method obviates the use of phototools and is known in the art as "direct write" (DW). It is achieved by coating the copper cladding of an insulating laminate with one or more very thin (1 to 10 micron) metallic layer or layers, that can act as copper etch-resists, when top-coated with at least one laser-imageable polymeric layer, where the principal function of the laser-defined polymeric coating is to achieve high resolution imaging, leaving the major "burden" of copper etch resistance to the metallic coating(s) that are exposed, bared following the laser imaging operation. The substantial advantage of this invention is that the etch resistance is principally achieved by the metal-bearing layer or layers underneath the organic areas that are left on the copper cladding following laser patterning.