Abstract: A head up display (HUD) system includes a housing, a display assembly, and a mechanical guide system. The housing contains optical and electronic components that support a head up display function. The display assembly is captured by the housing. The display assembly has a display element for conveying head-up display information and a carrier that structurally supports the display element. The mechanical guide system moves and guide the display assembly to an in-use position, a storage position, and a service position. When in the service position, the display assembly is removable from the housing without disassembly of the housing. When not in said service position, the display assembly can be movable between an in-use position (in which the display element is substantially exposed outside the housing but is physically secured by the housing) and a storage position (in which the display assembly is substantially enclosed and protected by the housing).

Abstract: A transducer includes a housing, a magnet unit, an elastic diaphragm, a vibration unit, and a coil. The housing has a first housing and a second housing to form a storing space. The magnet unit is secured in the first housing. The elastic diaphragm is a thin layer and disposed between the second housing and the vibration unit. The spiral coil is mounted on the vibration unit and has two electrical connecting points for inputting electric signal of alternating current. Hence, the coil can generate continuous vibration caused by alternating attraction/repelling force of the magnet unit. When the frequency of the electric signal is within 20˜20000 Hz, the elastic diaphragm generates sound signals within earshot. When it is within 10˜20 Hz, it can generate vibration signals. So, signal unit can produce sound and vibration. In addition, it saves space for effectuating the thickness minimization of a product.

Abstract: The invention relates to an optical module for a cellular phone having an image sensor comprising a light sensitive upper side for detecting and converting optical signals into electrical signals, an imaging device for imaging the optical signals on the image sensor, and a circuit board comprising an upper side and a lower side electrically and mechanically connected to the image sensor. In order to create a particularly flat optical module, for example for integration into a cellular phone, the invention provides that the circuit board has a recess in which the image sensor is disposed such that a lower side of the image sensor is substantially located at the same height as the lower side of the circuit board.

Abstract: Systems and methods for monitoring a battery stack having a plurality of cells are provided. One system includes a plurality of time delay circuits. Each of the time delay circuits is electrically coupled to at least one of the plurality of cells. The time delay circuits are configured to execute a time delay in response to receiving a trigger signal and output a time delay marking signal indicating that the time delay has elapsed. The time delay is based on a voltage of the cell(s) to which the respective time delay circuit is electrically coupled. The system further includes a control circuit configured to receive the time delay marking signal from each of the time delay circuits and, for each received time delay marking signal, to determine the voltage of the at least one of the plurality of cells associated with the respective time delay marking signal.

Abstract: A method for optimizing control circuit for FC HDDs in a system includes determining the number of subsystems supported in a FC loop and the number of HDDs to be supported in each of the subsystems, analyzing binary values of address of all HDDs for each of the subsystems, enumerating logical variations of the address selection signals according to the analyzed binary values to obtain logic combinations for the address selection signals, analyzing logic relations between these logic combinations and a system address signal, selecting logic components required according to the found logic relations, and calculating the total number of required logic components and the number of address selections signals that can share an output pin of each of the required logic components based on properties of output pins of the logic components and maximum input current of the address selection signals.

Abstract: Carrier for the rack mounting of two or more data storage devices into a chassis. The carrier includes support members along the length of the carrier, to receive and retain the two or more data storage devices. The carrier further includes a single electrical communication connector to provide an electrical communication interface for all of the data storage devices in the carrier, to and from a mating connector on a board of the chassis. The carrier further includes an interposer to adapt electrical signals from the single electrical communication connector into a form that is usable by the data storage devices.

Abstract: A system and method for installing a peripheral device on a printed circuit board (PCB) is provided. In the system and method, the PCB has a board connector portion and the peripheral device has a device connector portion. The method includes providing a connector adapter housing enclosing a first mating portion configured for mating with the board connector portion and a second mating portion configured for mating with the device connector portion. The method also includes engaging the second mating portion with the device connector portion to position the first mating portion to extend substantially perpendicular to the surface of the PCB. The method further includes depositing the peripheral on the PCB using a motion substantially perpendicular to the surface of the PCB, the motion engaging the board connector portion and the first mating portion.

Abstract: A cartridge for holding and ejecting fluid test strips and a test-strip metering device for use with such a cartridge. The cartridge holds the test strips in a sheet-like configuration. The metering device is able to extract test strips from the cartridge in response to an actuation of a single user-interface element. The metering device may test the fluids as each is extracted.

Abstract: A combiner positioning system for a head-up display includes a carrier and a locking element. The carrier supports a combiner for the head-up display, and the combiner is movable between a stowed position and a display position. The locking element has an engaged position and a disengaged position. The locking element engages a portion of the carrier in the display position and rigidly holds the carrier in the display position.

Abstract: A combiner positioning system for a head-up display includes a carrier and a camwheel. The carrier supports a combiner for the head-up display, and the combiner is movable between a stowed position and a display position. The camwheel is rotatable about a camwheel axis. The rotation of the camwheel about the camwheel axis engages the carrier and moves the combiner between the stowed position and the display position.

Abstract: A system for testing an electronic circuit board (ECB) having a plurality of test points in a pre-defined arrangement on a measurement device having a plurality of resources includes an interface fixture having a plurality of contact pads arranged in an array on a first surface. The contact pads can be electrically coupled to the plurality of resources of the measurement system according to a pre-defined pattern, where at least two of the contact pads are electrically coupled to one of the plurality of resources in a many-to-one relationship. The system also includes a test fixture removably attached to the first surface of the interface fixture. The test fixture includes an upper probe plate having a plurality of openings and a lower probe plate parallel to the upper probe plate. The lower probe plate includes a plurality of openings associated with the openings in the upper probe plate.

Abstract: A drop-in computing component mounting system can include a contact connector and two drop-in mounting arms. The contact connector can be configured to provide a solderless connection between a computing component and an element of a computing environment. The two drop-in mounting arms can be attached to a mounting surface of the element of the computing environment. The two mounting arms can be aligned in parallel to each other at a spacing corresponding to the dimensions of the computing component being mounted. Each mounting arm can include a quantity of fastening fingers. The quantity and positioning of the fastening fingers can correspond to the quantity and positioning of fastening indentations upon the computing component being mounted. Placement of the computing component between the two mounting arms can engage the fastening fingers with their corresponding fastening indentations and can engage the contact connector.

Abstract: An electro-optical semiconductor device having a semiconductor die including an active region for detecting light which is covered by a cover. The cover has a transparent pane over the active region, and is supported by a standoff. The standoff sits on the die on a perimeter region between the active region and a plurality of bond pads disposed around the periphery of the die.

Abstract: A system for testing an electronic circuit board (ECB) having a plurality of test points in a pre-defined arrangement on a measurement device having a plurality of resources includes an interface fixture having a plurality of contact pads arranged in an array on a first surface. The contact pads can be electrically coupled to the plurality of resources of the measurement system according to a pre-defined pattern, where at least two of the contact pads are electrically coupled to one of the plurality of resources in a many-to-one relationship. The system also includes a test fixture removably attached to the first surface of the interface fixture. The test fixture includes an upper probe plate having a plurality of openings and a lower probe plate parallel to the upper probe plate. The lower probe plate includes a plurality of openings associated with the openings in the upper probe plate.

Abstract: One or more embodiments of the present invention provide apparatuses, methods and systems to form a thin LED backlight unit for a large-screen flat-panel display. The backlight unit is able to achieve improved color mixing within a shorter mixing distance than the conventional art, while maintaining desired brightness uniformity, thereby allowing for a shorter bezel of a display device. One or more embodiments of the present invention include one or more light guides, which, by operating together, provide thin backlight units. High system efficiency is provided by introducing a recycling enhancement component, and uniform color distribution is achieved by incorporating color shift compensation. Multiple light guides are arranged adjacent to one another can offer a progressive scan illumination feature.

Abstract: A projector has a transmissive spatial light modulator backlit by a collimated illuminator that includes a light source that outputs red, green, blue (RGB) light, and a combiner disposed in light-receiving relation to the light source for mixing or combining the RGB light. The combiner has cavity features associated therewith for outputting collimated light, where such light preferably has a divergent cone angle less than plus or minus fifteen degrees (+/?15°).

Abstract: A low cost manufacturing method (300) and assembly (100) for positioning a lens (106) relative to an electronic imager (102). A viscous adhesive (104) is applied to the lens (106) or the electronic imager (102) outside of the optical path. The lens (106) is disposed on the electronic imager (102) exclusively with the adhesive (104) disposed between them.

Abstract: A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.

Abstract: A head up display (HUD) system includes a housing, a display assembly, and a mechanical guide system. The housing contains optical and electronic components that support a head up display function. The display assembly is captured by the housing. The display assembly has a display element for conveying head-up display information and a carrier that structurally supports the display element. The mechanical guide system moves and guide the display assembly to an in-use position, a storage position, and a service position. When in the service position, the display assembly is removable from the housing without disassembly of the housing. When not in said service position, the display assembly can be movable between an in-use position (in which the display element is substantially exposed outside the housing but is physically secured by the housing) and a storage position (in which the display assembly is substantially enclosed and protected by the housing).

Abstract: Carrier for the rack mounting of two or more data storage devices into a chassis. The carrier includes support members along the length of the carrier, to receive and retain the two or more data storage devices. The carrier further includes a single electrical communication connector to provide an electrical communication interface for all of the data storage devices in the carrier, to and from a mating connector on a board of the chassis. The carrier further includes an interposer to adapt electrical signals from the single electrical communication connector into a form that is usable by the data storage devices.