Patents Assigned to Jabil Circuit (Singapore) Pte, Ltd.
  • Patent number: 11921741
    Abstract: A method for accessing Redfish data that is compliant with Redfish® specification, and that is stored in a board baseboard management controller (BMC) of a computer device is provided. The method includes: executing a unified extensible firmware interface (UEFI) application to transmit a data request to the BMC through a host interface using a representational state transfer (REST) protocol; when it is determined that Redfish data that corresponds with a URL included in the data request has been received, performing data transformation on the Redfish data to obtain transformed data; and generating and presenting the transformed data on a graphic interface.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: March 5, 2024
    Assignee: Jabil Circuit (Singapore) Pte. Ltd.
    Inventor: Fu-Pao Shih
  • Publication number: 20240012653
    Abstract: A method for returning to a basic input/output system (BIOS) setup utility while in a shell environment during a booting process of a computing system includes: upon execution of an update Unified Extensible Firmware Interface (UEFI) (BIOS) firmware file, storing a dynamic command in a command storage; storing a back protocol in the storage module, the back protocol being linked to a back function that, when executed, causes the CPU to call a program file that, when executed by the CPU, causes the CPU to enter a BIOS setup utility, the dynamic command being linked to accessing a memory location in which the back protocol is stored; and in response to receipt of the dynamic command while in the shell environment, locating the back protocol, performing the back function and calling the specific program file, which causes the CPU to enter the BIOS setup utility.
    Type: Application
    Filed: March 15, 2023
    Publication date: January 11, 2024
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Hung-An Chen, Ching-Yuan Wu, Shuo-Hung Hsu
  • Publication number: 20230356549
    Abstract: A sensor device includes a plurality of wires that are adapted to be disposed on an object, a control circuit that is electrically coupled to the wires, and a conductive member that is electrically coupled to the control circuit. Each of the wires has a detection section. The conductive member is operable to contact the detection sections of the wires. The detection sections are urged to move relative to the conductive member when the object is deformed, so that a quantity of the detection sections in contact with the conductive member varies with deformation of the object. When the conductive member is in contact with the detection section of any one of the wires, the conductive member and the one of the wires cooperatively form one closed circuit. The control circuit is adapted to transmit data of a quantity of the closed circuit to an external device.
    Type: Application
    Filed: May 2, 2023
    Publication date: November 9, 2023
    Applicants: Taiwan Green Point Enterprises Co., Ltd., Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Ching-Lung Mao, Chin-Feng Yang, Ming-Chung Chung, Huang-Keng Chen
  • Patent number: 11736856
    Abstract: An earphone device includes a speaker unit, an inner housing body and an outer housing body. The inner housing body covers the speaker unit through an insert molding technique. The outer housing body covers the inner housing body through the insert molding technique.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: August 22, 2023
    Assignee: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen-Hong Wang, Ching-Feng Lin, Chia-Chien Chen, Po-Cheng Huang, Shih-Hsien Yang, Cheng-Kun Chiang, Ching-Hsin Chen, Ching-Chieh Lin, Che-Hao Liao
  • Patent number: 11726110
    Abstract: A connecting device for electrically connecting signal contact portions of an electrical device under test includes a lower modular unit and an upper modular unit. The lower modular unit includes a port substrate and a plurality of lower connecting terminals electrically connected with the port substrate. The upper modular unit is disposed above the lower modular unit and includes a plurality of upper connecting terminals movable relative to an upper wall. The upper connecting terminals are movable as a result of a downward pressing of the electrical device to the upper modular unit to project outwardly of the upper wall and to electrically connect with the signal contact portions. The upper connecting terminals are electrically connected with the lower connecting terminals.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: August 15, 2023
    Assignee: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Xiang-Lin Xiang, Fang Chen, Shan-Huai Lan
  • Publication number: 20230205885
    Abstract: An operation method of a software program meeting UEFI specifications for configuring a GPIO port is provided. The operation method includes: operating in a command-line mode to display, on a display device, a first prompt for guiding a user to input a string of command-line arguments; in response to receipt of a string of command-line arguments for reading content stored in a register that corresponds to one of GPIO pins of the GPIO port under the command-line mode, displaying, on the display device, a default value of the register that corresponds to a function of said one of the GPIO pins; and in response to receipt of a string of command-line arguments for setting a register that corresponds to one of the GPIO pins to a set value under the command-line mode, writing the set value to the register to replace a current value with the set value.
    Type: Application
    Filed: December 27, 2022
    Publication date: June 29, 2023
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Hung-An Chen, Ching-Yuan Wu, Shuo-Hung Hsu
  • Publication number: 20230138996
    Abstract: A connecting device for electrically connecting signal contact portions of an electrical device under test includes a lower modular unit and an upper modular unit. The lower modular unit includes a port substrate and a plurality of lower connecting terminals electrically connected with the port substrate. The upper modular unit is disposed above the lower modular unit and includes a plurality of upper connecting terminals movable relative to an upper wall. The upper connecting terminals are movable as a result of a downward pressing of the electrical device to the upper modular unit to project outwardly of the upper wall and to electrically connect with the signal contact portions. The upper connecting terminals are electrically connected with the lower connecting terminals.
    Type: Application
    Filed: July 26, 2022
    Publication date: May 4, 2023
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Xiang-Lin Xiang, Fang Chen, Shan-Huai Lan
  • Publication number: 20230095272
    Abstract: A tapping apparatus adapted for tapping a workpiece includes a lower die unit to drive the workpiece to move along a conveying direction, and an upper die unit disposed above and movable upwardly and downwardly relative to the lower die unit. A tapping mechanism is disposed between the lower and upper die units to be driven by the upper die unit for tapping the workpiece so that the workpiece is formed with a tapped hole. A thread checking mechanism is disposed between the lower and upper die units and is spaced apart from the tapping mechanism along the conveying direction. The thread checking mechanism is driven by the upper die unit for checking the tapped hole of the workpiece.
    Type: Application
    Filed: August 26, 2022
    Publication date: March 30, 2023
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Jiang-Xi Wu, Ming Zhao, Bi Meng, Zhan-Qiang Chen, Shao-Bo Pan, Chuan-Ying Chien
  • Publication number: 20230067595
    Abstract: A package structure includes a carrier substrate, a circuit unit, and a packaging unit. The circuit unit includes an antenna circuit, and a conducting circuit that is flexible and that is electrically connected to the antenna circuit. At least a portion of the antenna circuit is disposed on the carrier substrate. The packaging unit is disposed on the carrier substrate by molding and encapsulates the circuit unit such that a portion of the circuit unit is exposed to permit said conducting circuit for electrical connection with the outside.
    Type: Application
    Filed: August 29, 2022
    Publication date: March 2, 2023
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Chi-Neng Ho, Sheng-Wen Ni, Yu-Cheng Lin, Yen-Chou Chen
  • Patent number: 11582551
    Abstract: A speaker device includes a housing body, a speaker driver and a passive radiator. The housing body is formed with a first sound hole and a second sound hole respectively opening in two opposite directions. The speaker driver is disposed in the housing body, is located adjacent to the first sound hole, and is adapted to generate sound. The passive radiator is disposed in the housing body, is located adjacent to the second sound hole, and is adapted to generate sound. The first sound hole and the second sound hole are adapted for respectively allowing the sound generated by the speaker driver and the sound generated by the passive radiator to travel out from the housing body respectively in two opposite directions therethrough.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: February 14, 2023
    Assignee: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen-Hong Wang, Chia-Chien Chen, Ching-Feng Lin, Po-Cheng Huang, Shih-Hsien Yang, Kuo-Lin Chao, Cheng-Chih Tai, Kuan-Yu Su, En-De Su, Cheng-Kun Chiang, Ke-Yu Lin, Ching-Hsin Chen
  • Patent number: 11553273
    Abstract: A passive diaphragm assembly includes a counterweight member, a first diaphragm and a second diaphragm. The first diaphragm and the second diaphragm are spaced apart from each other, are connected respectively to opposite ends of the counterweight member, and cooperate with the counterweight member to define an air space thereamong.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: January 10, 2023
    Assignee: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen Hong Wang, Ching Feng Lin, Chia Chien Chen, Po-Cheng Huang, Shih-Hsien Yang
  • Patent number: 11546681
    Abstract: A speaker adapted to be disposed on a head-mounted device includes a housing member, a speaker unit, a vibrating unit and an abutting member. The housing member is adapted to be disposed on the head-mounted device and is formed with an opening adapted to open toward an ear of a user when in use. The speaker unit is disposed on the housing member in a manner that the speaker unit is not directly in contact with the head of the user when in use. The vibrating unit is disposed on the housing member and is capable of generating vibrations. The abutting member is disposed on the vibrating unit, is adapted to be in contact with the skin of the user, and is capable of transmitting the vibrations to the skull of the user.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: January 3, 2023
    Assignee: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen Hong Wang, Ching Feng Lin, Chia Chien Chen
  • Publication number: 20220335055
    Abstract: A method for accessing Redfish data that is compliant with Redfish® specification, and that is stored in a board management controller (BMC) of a computer device is provided. The method includes: executing a unified extensible firmware interface (UEFI) application to transmit a data request to the BMC through a host interface using a representational state transfer (REST) protocol; when it is determined that Redfish data that corresponds with a URL included in the data request has been received, performing data transformation on the Redfish data to obtain transformed data; and generating and presenting the transformed data on a graphic interface.
    Type: Application
    Filed: April 11, 2022
    Publication date: October 20, 2022
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventor: Fu-Pao Shih
  • Publication number: 20220294641
    Abstract: A program signing method is provided to include: determining whether the signing program is tampered with; if not, obtaining a releasing hash that is related to a to-be-released program, and transmitting the releasing hash to a signature server unit, so as to make the signature server unit acquire a releasing digital signature based on the releasing hash and transmit the releasing digital signature to the processing module; and, upon receipt of the releasing digital signature, executing the signing program to generate a signed to-be-released program.
    Type: Application
    Filed: March 4, 2022
    Publication date: September 15, 2022
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Cheng Huang Wang, Chin Liang, Shuo-Hung Hsu
  • Publication number: 20220141574
    Abstract: A passive diaphragm assembly includes a counterweight member, a first diaphragm and a second diaphragm. The first diaphragm and the second diaphragm are spaced apart from each other, are connected respectively to opposite ends of the counterweight member, and cooperate with the counterweight member to define an air space thereamong.
    Type: Application
    Filed: September 15, 2021
    Publication date: May 5, 2022
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen Hong Wang, Ching Feng Lin, Chia Chien Chen, Po-Cheng Huang, Shih-Hsien Yang
  • Publication number: 20220141575
    Abstract: A speaker device includes a housing body, a speaker driver and a passive radiator. The housing body is formed with a first sound hole and a second sound hole respectively opening in two opposite directions. The speaker driver is disposed in the housing body, is located adjacent to the first sound hole, and is adapted to generate sound. The passive radiator is disposed in the housing body, is located adjacent to the second sound hole, and is adapted to generate sound. The first sound hole and the second sound hole are adapted for respectively allowing the sound generated by the speaker driver and the sound generated by the passive radiator to travel out from the housing body respectively in two opposite directions therethrough.
    Type: Application
    Filed: October 25, 2021
    Publication date: May 5, 2022
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen-Hong Wang, Chia-Chien Chen, Ching-Feng Lin, Po-Cheng Huang, Shih-Hsien Yang, Kuo-Lin Chao, Cheng-Chih Tai, Kuan-Yu Su, En-De Su, Cheng-Kun Chiang, Ke-Yu Lin, Ching-Hsin Chen
  • Publication number: 20220141570
    Abstract: An earphone device includes a speaker unit, an inner housing body and an outer housing body. The inner housing body covers the speaker unit through an insert molding technique. The outer housing body covers the inner housing body through the insert molding technique.
    Type: Application
    Filed: October 26, 2021
    Publication date: May 5, 2022
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen-Hong Wang, Ching-Feng Lin, Chia-Chien Chen, Po-Cheng Huang, Shih-Hsien Yang, Cheng-Kun Chiang, Ching-Hsin Chen, Ching-Chieh Lin, Che-Hao Liao
  • Publication number: 20220141561
    Abstract: A speaker adapted to be disposed on a head-mounted device includes a housing member, a speaker unit, a vibrating unit and an abutting member. The housing member is adapted to be disposed on the head-mounted device and is formed with an opening adapted to open toward an ear of a user when in use. The speaker unit is disposed on the housing member in a manner that the speaker unit is not directly in contact with the head of the user when in use. The vibrating unit is disposed on the housing member and is capable of generating vibrations. The abutting member is disposed on the vibrating unit, is adapted to be in contact with the skin of the user, and is capable of transmitting the vibrations to the skull of the user.
    Type: Application
    Filed: September 17, 2021
    Publication date: May 5, 2022
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen Hong Wang, Ching Feng Lin, Chia Chien Chen
  • Patent number: 11318543
    Abstract: A jig system with hydraulic expansion clamp mechanism for clamping a work piece includes a plate that is manufactured integrally as one piece using three-dimensional printing. The plate is formed with an expansion chamber that is defined by a surrounding wall for allowing the work piece to extend therethrough, an inlet that is fluidly connected to a hydraulic source that supplies pressurized fluid, and a passage that is fluidly connected to the inlet and the expansion chamber. When pressurized fluid is supplied into the passage from the inlet, the expansion chamber is caused to expand and move the surrounding wall inwardly into contact with the work piece.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: May 3, 2022
    Assignee: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Yoshio Kouda, Kai-En Huang
  • Publication number: 20210094104
    Abstract: A jig system with hydraulic expansion clamp mechanism for clamping a work piece includes a plate that is manufactured integrally as one piece using three-dimensional printing. The plate is formed with an expansion chamber that is defined by a surrounding wall for allowing the work piece to extend therethrough, an inlet that is fluidly connected to a hydraulic source that supplies pressurized fluid, and a passage that is fluidly connected to the inlet and the expansion chamber. When pressurized fluid is supplied into the passage from the inlet, the expansion chamber is caused to expand and move the surrounding wail inwardly into contact with the work piece.
    Type: Application
    Filed: September 24, 2020
    Publication date: April 1, 2021
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Yoshio Kouda, Kai-En Huang