Abstract: A bond pad connector to be disposed on a stretchable substrate and adapted to secure an electronic component thereon. The bond pad connector includes two spaced apart bond pads that are adapted to be disposed on the stretchable substrate to face each other. Each of the two bond pads is adapted to be connected to a respective conductive trace and includes: a stress relieve component that is adapted to be connected to the conductive trace, the stress relieve component being formed with a central hole; and an extension component extending from the stress relieve component and opposite to the conductive trace. The electronic component is secured onto the bond pad connector by attaching the electronic component to, for each of the bond pads, at least a part of the extension component.

Abstract: Disclosed herein are integrated closures for a container. The integrated closure includes a base and a lid connected to the base via a hinge, where the lid and hinge are configured to permit the lid to open towards a center of the integrated closure, and a film. The film including a first portion connected to at least a portion of a bottom surface of the base, a second portion connected to at least a bottom surface of the lid, and a third portion connected to the first portion and releasably connected to the second portion. The integrated closure including a tamper indicator membrane connected to an edge of the lip and a corresponding edge of the base. The base further including a retention mechanism, the retention mechanism configured to engage and retain the lid in an open position.

Abstract: An auto alignment system is used with a base board that is mounted with at least one laser source, and a fiber array unit (FAU) that includes at least one lens facing the base board. The system includes a location determination unit configured to capture an image of the base board and the FAU, a processor, a motor, and a goniometer. The processor compares a current location of the FAU and an ideal position of the FAU, at which the at least one lens is aligned with the at least one laser source, and determines an offset value associated with the current location of the FAU and the ideal position of the FAU. Then, the processor controls the motor to actuate the goniometer to move the FAU to the ideal position based on the offset value.

Abstract: Methods and systems for inter-path delay estimation. A method for inter-path delay estimation includes injecting, nearly simultaneously, a continuous wave tone at an input test point in a first communication path and at an input test point in a second communication path, combining output signals from the first communication path and the second communication path, measuring a magnitude of a combined output signal using an envelope detector, and adjusting a delay element in one of the first communication path and the second communication path until the magnitude of the combined output signal is maximized.

Abstract: A rework patch for an electronic circuit includes a flexible patch body and at least two patch traces. The electronic circuit includes a substrate, at least two board traces formed on the substrate, and at least one defect portion within at least one of the board traces. The patch body is attached to the substrate to partially cover each of the board traces and to cover the defect portion. The patch traces are formed on the patch body. A pattern of the patch traces corresponds to a pattern of a portion of the board traces covered by the patch body.

Abstract: Disclosed herein are integrated closures for a container The integrated closure includes a base and a lid connected to the base via a hinge, where the lid and hinge are configured to permit the lid to open towards a center of the integrated closure, and a film. The film including a first portion connected to at least a portion of a bottom surface of the base, a second portion connected to at least a bottom surface of the lid, and a third portion connected to the first portion and releasably connected to the second portion. The integrated closure including a tamper indicator membrane connected to an edge of the lip and a corresponding edge of the base. The base further including a retention mechanism, the retention mechanism configured to engage and retain the lid in an open position.

Abstract: Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern directly on a single thermal adhesive film, placing one or more surface mounted devices on a cured deposed circuit of the deposed circuit pattern, curing the one or more surface mounted devices and the cured deposed circuit together to form an assembled deposed circuit, placing the assembled deposed circuit on a stretchable substrate, and melting the single thermal adhesive film directly onto the assembled deposed circuit and the stretchable substrate to reinforce joint bonds of the assembled deposed circuit and to attach the assembled deposed circuit to the stretchable substrate.

Abstract: Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern directly on a single thermal adhesive film, placing one or more surface mounted devices on a cured deposed circuit of the deposed circuit pattern, curing the one or more surface mounted devices and the cured deposed circuit together to form an assembled deposed circuit, placing the assembled deposed circuit on a stretchable substrate, and melting the single thermal adhesive film directly onto the assembled deposed circuit and the stretchable substrate to reinforce joint bonds of the assembled deposed circuit and to attach the assembled deposed circuit to the stretchable substrate.

Abstract: Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern on a thermal adhesive film. One or more surface mounted device(s) are attached to a cured printed circuit to form an assembled printed circuit. The assembled printed circuit may be placed on a stretchable substrate. The thermal adhesive film is melted on the assembled printed circuit and the stretchable substrate to protect and reinforce joint bonds and the circuit pattern of the assembled circuit pattern and attach the assembled printed circuit to the stretchable fabric in one melting or curing step.

Abstract: A flexible composite substrate for a wearable antenna includes a fabric sheet and a single-layer dielectric film immersed into the fabric sheet. The single-layer dielectric film includes a dielectric resin matrix and a low dielectric loss material which is mixed with the dielectric resin matrix and which serves as a wireless functional dielectric interface material.

Abstract: Described is a method and apparatus for training a character recognition model, a computer device, and a storage medium. The method includes: acquiring an input image and a labeled string of the input image; performing character recognition on the input image via the character recognition model pre-deployed on an edge device to obtain a predicted string of the input image; and performing a parameter update on a classification head in the character recognition model via a state space model in a case where the predicted string is inconsistent with the labeled string; wherein the state space model contains a state equation and an observation equation, the state equation is used to indicate an evolutionary relationship of a classification head parameter between different time steps, and the observation equation is used to generate an observable observation character based on the classification head parameter.

Abstract: Provided is a defect detection method and device, computer equipment and a storage medium. The method includes: acquiring an RGB image, a depth image and a sample label of a detection object sample; performing feature map extraction and feature map fusion on the RGB image and the depth image by a feature extraction network of the defect detection model, to obtain a fused feature map; performing defect detection based on the fused feature map by a feature reconstruction network of the defect detection model, to obtain a defect score map, wherein the defect score map being obtained by fusing a global defect score map which is generated based on a global defect detection network with a local defect score map which is generated by a local defect detection network; and updating parameters of the defect detection model based on the defect score map and the sample label.

Abstract: An antenna backplane including a printed circuit board (PCB) having a first differential pair with a first conductor and a second conductor and a second differential pair with a third conductor and a fourth conductor. The first conductor is positioned a first distance from the second differential pair and the second conductor is positioned a second distance from the second differential pair of conductors, where the first distance is greater than the second distance. The third conductor is positioned the second distance from the first differential pair and the fourth conductor is positioned a third distance from the first differential pair, where the third distance is greater than the second distance. A phase-shifting series resonant circuit is coupled between the first conductor and the fourth conductor that provides approximately an odd-integer multiple of a 180 degree phase shift at a predetermined frequency.

Abstract: A method for detecting frames is implemented using a system that is connected to a display apparatus and an external management port. The system includes a video capturing device and a computing device. The method includes: obtaining, by the video capturing device, a video feed from the display apparatus, and transmitting the video feed to the computing device; in response to receipt of the video feed, processing, by the computing device, the video feed to obtain a displaying frame; processing, by the computing device, the displaying frame to obtain a region of interest (ROI) within the displaying frame; obtaining, by the computing device, an identification result associated with a content included in the ROI; and transmitting, by the computing device, the identification result to the external management port.

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

Abstract: Methods and systems for managing secure IoT data are described. A docker container system for managing secure Internet of Things (IoT) device data includes a machine control container configured to collect IoT device data from device data producing machines, a translation container configured to translate collected IoT device data into a common semantic format, client-specific container applications configured to aggregate, filter, and process translated IoT device data to generate processed IoT device data, and send the processed IoT device data to at least one of client applications and data storage, and a secure container proxy service configured to apply security-based protocols to the processed IoT device data. The client-specific container applications deployed absent the security-based protocols.

Abstract: The disclosure provides at least an apparatus, system and method for providing a flexible planar inductive coil, such as may be embedded in a product. The apparatus, system and method may include at least one conformable substrate, and a matched function ink set, printed onto at least one substantially planar face of the at least one substrate. This printing may form at least one layer of additive conductive traces capable of receiving current flow from at least one source and layered into successive ones of the conductive traces about a center axis within a plane of the at least one conformable substrate.

Abstract: An apparatus, system and method for providing a nozzle having refined print control and enhanced printing speed by providing, on the inside or outside or on an interstitial substrate layer, of any metallic or non-metallic nozzle of a non-conductive surface suitable to support sensors relevant to the FFF process. Heat, force, flow, strain, stress, extrusion force, and like sensors may be provided on the inside or the outside of any nozzle, or on an interstitial substrate layer on the inside or outside of any nozzle. The sensors may be provided about the center access through the nozzle, longitudinally along the center access of the nozzle, or at any of various points along the nozzle, wherein the placement or shape of such sensors may vary in accordance with the type of sensing to be performed by the subject sensor.

Abstract: An apparatus, a system, and a method for improvements in fused filament fabrication (FFF). Characteristics of a filament may be measured during production of the filament and the characteristics stored in a memory for retrieval by a 3D printer. The 3D printer adjusts print settings as necessary based on the measured characteristics, thereby resulting in better print quality.

Abstract: An apparatus, system and method for providing a nozzle having refined print control and enhanced printing speed by providing, on the inside or outside or on an interstitial substrate layer, of any metallic or non-metallic nozzle of a non-conductive surface suitable to support sensors relevant to the FFF process. Heat, force, flow, strain, stress, extrusion force, and like sensors may be provided on the inside or the outside of any nozzle, or on an interstitial substrate layer on the inside or outside of any nozzle. The sensors may be provided about the center access through the nozzle, longitudinally along the center access of the nozzle, or at any of various points along the nozzle, wherein the placement or shape of such sensors may vary in accordance with the type of sensing to be performed by the subject sensor.