Abstract: A radome and a method for manufacturing same. A radome apparatus has a radome body having an aperture, a film covering the aperture, and a support installed into the aperture. The film and the support have a low loss at a desired operating frequency. The support provides backing, support, and rigidity for the film so that distortion of the film by weather conditions, such as wind, is reduced. Thus, the integrity of the RF transmission characteristics of the radome are preserved. The aperture, film, and support are in the boresight of an antenna and are large enough to accommodate a desired beam steering range. The radome body may be manufactured with the aperture and the film included therein by using an in-mold labeling process. The support may be installed in the aperture by a subsequent molding process.

Abstract: A tool set includes a tool holder, a tool and a tool rack. The tool has a groove unit. The tool holder has a latch unit that engages the groove unit. The tool rack includes a rack body and a blocking member. When the tool holder is moved away from the rack body after the tool is moved into the rack body by the tool holder and after the blocking member moves to a blocking position, the tool is blocked by the blocking member so that the latch unit is separated from the groove unit and that the tool holder is separated from the tool.

Abstract: A container feeding device includes a casing and first and second latch members. The casing defines a lower retaining space for receiving a plurality of containers that are stacked on one another. The first latch member is operable to enter the lower retaining space for supporting a bottommost container, or leave the lower retaining space to release the bottommost container. The second latch member enters the lower retaining space to support a second bottommost container when the bottommost container is released by the first latch member.

Abstract: A mounting frame for being mounted with either one of first and second screwdrivers, includes a main frame, a mounting seat, and first and second mounting plates. The mounting seat has a plate attachment hole set. The first mounting plate has a first seat attachment hole set operable to be connected to the plate attachment hole set, and a first driver attachment hole set for the first screwdriver to be attached thereto. The second mounting plate has a second seat attachment hole set operable to be connected to the plate attachment hole set, and a second driver attachment hole set for the second screwdriver to be attached thereto.

Abstract: A bond pad connector to be disposed on a stretchable substrate and adapted to secure an electronic component thereon. The bond pad connector includes two spaced apart bond pads that are adapted to be disposed on the stretchable substrate to face each other. Each of the two bond pads is adapted to be connected to a respective conductive trace and includes: a stress relieve component that is adapted to be connected to the conductive trace, the stress relieve component being formed with a central hole; and an extension component extending from the stress relieve component and opposite to the conductive trace. The electronic component is secured onto the bond pad connector by attaching the electronic component to, for each of the bond pads, at least a part of the extension component.

Abstract: A flexible composite substrate for a wearable antenna includes a fabric sheet and a single-layer dielectric film immersed into the fabric sheet. The single-layer dielectric film includes a dielectric resin matrix and a low dielectric loss material which is mixed with the dielectric resin matrix and which serves as a wireless functional dielectric interface material.

Abstract: A predictive analytics apparatus, engine, system and method capable of providing real time analytics in a manufacturing system. The apparatus, engine, system and method may include a data input capable of receiving raw data output from at least one machine operable to effect the manufacturing system embodiments, and a processor associated with a computing memory and suitable for executing code from the computing memory.

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

Abstract: A rework patch for an electronic circuit includes a flexible patch body and at least two patch traces. The electronic circuit includes a substrate, at least two board traces formed on the substrate, and at least one defect portion within at least one of the board traces. The patch body is attached to the substrate to partially cover each of the board traces and to cover the defect portion. The patch traces are formed on the patch body. A pattern of the patch traces corresponds to a pattern of a portion of the board traces covered by the patch body.

Abstract: The embodiments are and include at least an apparatus, system and method for forming print material particles for additive manufacturing (AM) printing. The apparatus, system and method include at least a melt chamber comprising a polymer melt; a vertical extruder that fluidically receives the polymer melt; an atomizer that atomizes the polymer melt from the vertical extruder and that distributes the atomized polymer melt; a fall chamber comprising a plurality of zones into which the atomized polymer melt is distributed; and a collector to receive the print material particles formed of the atomized polymer melt after falling through the plurality of zones.

Abstract: Apparatuses, systems and methods of providing heat to enable an FDM additive manufacturing nozzle having refined print control and enhanced printing speed. The heating element may include at least one sheath sized to fittedly engage around an outer circumference of the FDM printer nozzle; at least one wire coil at least partially contacting an inner diameter of the sheath; and at least one energy receiver associated with the at least one wire coil.

Abstract: Apparatuses, systems and methods of providing heat to enable an FDM additive manufacturing nozzle having refined print control and enhanced printing speed. The heating element may include at least one sheath sized to fittedly engage around an outer circumference of the FDM printer nozzle; at least one wire coil at least partially contacting an inner diameter of the sheath; and at least one energy receiver associated with the at least one wire coil.

Abstract: Apparatuses, systems and methods of providing heat to enable an FDM additive manufacturing nozzle having refined print control and enhanced printing speed. The heating element may include at least one sheath sized to fittedly engage around an outer circumference of the FDM printer nozzle; at least one wire coil at least partially contacting an inner diameter of the sheath; and at least one energy receiver associated with the at least one wire coil.

Abstract: The disclosure is of and includes at least an apparatus, system and method for a print head for additive manufacturing. The apparatus, system and method may include at least two proximate hobs suitable to receive and extrude therebetween a print material filament for the additive manufacturing, each of the two hobs comprising two halves, wherein each of the hob halves comprises teeth that are offset with respect to the teeth of the opposing hob half; a motor capable of imparting a rotation to at least one of the two hobs, wherein the extrusion results from the rotation; and an interface to a hot end capable of outputting the print material filament after at least partial liquification to perform the additive manufacturing.

Abstract: An apparatus, system and method for providing a nozzle having refined print control and enhanced printing speed by providing, on the inside or outside or on an interstitial substrate layer, of any metallic or non-metallic nozzle of a non-conductive surface suitable to support sensors relevant to the FFF process. Heat, force, flow, strain, stress, extrusion force, and like sensors may be provided on the inside or the outside of any nozzle, or on an interstitial substrate layer on the inside or outside of any nozzle. The sensors may be provided about the center access through the nozzle, longitudinally along the center access of the nozzle, or at any of various points along the nozzle, wherein the placement or shape of such sensors may vary in accordance with the type of sensing to be performed by the subject sensor.

Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

Abstract: A radome and a method for manufacturing same. A radome apparatus has a radome body having an aperture, a film covering the aperture, and a support installed into the aperture. The film and the support have a low loss at a desired operating frequency. The support provides backing, support, and rigidity for the film so that distortion of the film by weather conditions, such as wind, is reduced. Thus, the integrity of the RF transmission characteristics of the radome are preserved. The aperture, film, and support are in the boresight of an antenna and are large enough to accommodate a desired beam steering range. The radome body may be manufactured with the aperture and the film included therein by using an in-mold labeling process. The support may be installed in the aperture by a subsequent molding process.

Abstract: An electronics assembly including a plurality of midplanes positioned between and coupled to a plurality of electronic components at one side of the plurality of midplanes and at least one electronic component at an opposite side of the plurality of midplanes in a manner so that the midplanes are vertically oriented in parallel relative to each other so as to define spaces therebetween. The midplanes each include electrical traces configured to send signals among and between the plurality of electronic components at the one side of the midplanes and the at least one electronic component at the opposite side of the midplanes.

Abstract: A vital signs monitoring ring with integrated display includes a ring housing, the ring housing comprising at least two windows and a printed circuit board assembly (PCBA) layer configured to be attached to the ring housing. The PCBA layer includes a display section, a sensor section, a transmission mode oximetry measurement section configured to be in alignment with the at least two windows, a power supply, and a switch configured to power on the vital signs monitoring ring with integrated display via the power supply. The display section is configured to display physiological and action parameters associated with a user by sensing the physiological and action signals from a digit of user wearing the vital signs monitoring ring with integrated display using at least the sensor section and the transmission mode oximetry measurement section.

Abstract: The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.