Abstract: A carrier (10) is vapor-vacuum deposited with a vapor-vacuum deposited first metallic layer (14) of 10-90 nm in thickness. The carrier and vapor-vacuum deposited metal layers are selected of materials which, after vapor-vacuum depositing, adhere with less than about 3 pounds per linear inch of width, e.g., aluminum and copper or copper and copper. A second metallic layer (16) is electrolytically deposited to the vapor-vacuum deposited layer to increase the thickness of the first and second metal layers, taken together, to about 1-12 microns. The carrier and first and second metal layers are bonded under heat and pressure to a dielectric substrate (18). Thereafter, the carrier is peeled away leaving the vapor-vacuum deposited and electrolytically plated layers adhered to the dielectric substrate.